IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

  • Standard
    23 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers. IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

  • Standard
    55 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 60068-2-82:2019 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press‑fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds, plastics and the like during the required test flow are not considered or assessed. The test methods have been developed by using a knowledge-based approach. This edition includes the following significant technical changes with respect to the previous edition: – extension of the scope of the test standard from electronic to electromechanic components and press-fit pins, which are used for assembly and interconnect technology; – significant reduction of the testing effort by a knowledge-based selection of test conditions i.e. tests not relevant for a given materials system can be omitted (see Annex D); – harmonization with JESD 201A by omission of severities M, N for temperature cycling tests; – highly reduced test duration (1 000 h instead of 4 000 h) for damp-heat test by introducing test condition at elevated humidity of 85 % R.H. and a temperature of 85 °C providing increased severity.

  • Standard
    35 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

  • Standard
    43 pages
    English language
    sale 10% off
    e-Library read for
    1 day

NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.

  • Standard
    48 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

  • Standard
    10 pages
    English language
    sale 10% off
    e-Library read for
    1 day
  • Standard
    10 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-45:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (1,0 ± 0,15) W/(m•K).

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-47:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (2,0 ± 0,30) W/(m•K).

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-46:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal Conductivity is defined to be (1,5 ± 0,2) W/(m•K).

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

  • Standard
    46 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting). This edition includes the following significant technical changes with respect to the previous edition: The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

  • Standard
    22 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a)   the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b)   some of the terminology used in the document has been updated; c)   references to IEC standards have been corrected; d)   five termination styles have been added.

  • Standard
    36 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-5-503:2017(E) specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

  • Standard
    26 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62090:2017(E) applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document. Bar code and 2D symbol markings are used, in general, for automatic identification and automatic handling of components in electronics assembly lines. Intended applications include systems that automate the control of component packages during production, inventory and distribution. This edition includes the following significant technical changes with respect to the previous edition: a) Applicable data elements have been added. Data identifiers of those data elements are “10D”, “14D”, ”2P”, “25L”, “18V”, “V”, “J”, “3S”, “13E”, “33L” and “34L”. b) The following new informative annexes have been added: - Annex C, URL; - Annex D, Examples of data element short titles; - Annex E, Package levels for component package labels.

  • Standard
    34 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61188-7:2017(E) establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners. This edition includes the following significant technical changes with respect to the previous edition: a)   Figure 1 has been corrected; b)   the term “rectangle” has generally been replaced by “polygon”; c)   level B has been indicated as preferred level for new libraries.

  • Standard
    23 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.

  • Standard
    55 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

  • Standard
    34 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-2-719:2016 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

  • Standard
    23 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

  • Standard
    19 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.

  • Standard
    29 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 60068-3-13:2016 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components. This first edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - information for lead-free solders are added; - technical update and restructuring.

  • Standard
    30 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-44:2016 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-43:2016 gives requirements for properties of non-halogenated epoxide cellulose paper reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 100 °C minimum.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62326-20:2016 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also describe general aspects. This edition includes the following significant technical changes with respect to the previous edition: a) this edition focuses on the technical content of the printed circuit board for high-brightness LEDs; b) the figures related to the printed circuit board for high-brightness LEDs have been refined.

  • Standard
    52 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

  • Standard
    14 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

  • Standard
    58 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

  • Standard
    35 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3.

  • Standard
    40 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering.

  • Standard
    43 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

  • Standard
    42 pages
    English language
    sale 10% off
    e-Library read for
    1 day

Corrigendum to add the missing superseding information in the title pages and in the foreword

  • Corrigendum
    1 page
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004: - test conditions for use of lead-free solder are included; - test conditions for lead-free solders are added; - accelerations of the temperature cycling test for solder joints are added.

  • Standard
    47 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of 'Reflow condition and profile' in Annex B; c) addition of a new Annex C.

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-4-19:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.

  • Standard
    17 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-4-18:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.

  • Standard
    17 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

  • Standard
    21 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

  • Standard
    18 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes, according to classification of importance with regard to form, fit and function.

  • Standard
    65 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-27:2012 gives requirements for properties of bismaleimide/triazine modified with non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-30:2012 gives requirements for properties of non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-39:2012 specifies requirements for properties of modified brominated epoxide woven E-glass laminated sheet of a thickness 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 170 °C minimum.

  • Standard
    27 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61249-2-40:2012 specifies requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 170 °C minimum.

  • Standard
    26 pages
    English language
    sale 10% off
    e-Library read for
    1 day