IEC TS 62228:2007
(Main)Integrated circuits - EMC evaluation of CAN transceivers
Integrated circuits - EMC evaluation of CAN transceivers
Specifies test and measurement methods, test conditions, test setups, test procedures, failure criteria and test signals for the EMC evaluation of CAN transceivers concerning: - immunity against RF common mode disturbances on the signal lines - emissions caused by non-symmetrical signals regarding the time and frequency domain - immunity against transients (function and damage) - immunity against electrostatic discharges - ESD (damage)
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TECHNICAL IEC
SPECIFICATION TS 62228
First edition
2007-02
Integrated circuits –
EMC evaluation of CAN transceivers
Reference number
IEC/TS 62228:2007(E)
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TECHNICAL IEC
SPECIFICATION TS 62228
First edition
2007-02
Integrated circuits –
EMC evaluation of CAN transceivers
© IEC 2007 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – TS 62228 © IEC:2007(E)
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .7
4 Measurements and tests.7
4.1 General .7
4.2 RF and transient tests .8
4.3 ESD .35
5 Test report.39
Annex A (informative) Test circuit boards.40
Annex B (informative) Documentation of test results .42
Bibliography.44
Figure 1 – Overview of a minimum configuration of a CAN system for emission and
immunity tests against transient and RF disturbances.9
Figure 2 – Example of the circuit diagram of the minimum network for a CAN high
speed system for measuring emission and immunity in respect to RF disturbances and
transients.10
Figure 3 – Example of the circuit diagram of the minimum network for a CAN low speed
system for measuring emission and immunity in respect to RF disturbances and
transients.11
Figure 4 – Example of the circuit diagram of the minimum network for a CAN high
speed system for measuring the emission of RF disturbances .15
Figure 5 – Example of the circuit diagram of the minimum network for a CAN low speed
system for measuring the emission of RF disturbances.16
Figure 6 – Test set-up for measurement of RF disturbances on the bus lines.18
Figure 7 – Decoupling network for emission measurement at CAN_High and CAN_Low
in the frequency domain.18
Figure 8 – Example of the circuit diagram of the minimum network for a CAN high
speed system for testing the RF immunity.21
Figure 9 – Example of the circuit diagram of the minimum network for a CAN low speed
system for testing the RF immunity .22
Figure 10 – Test set-up for DPI measurements .24
Figure 11 – Coupling network for DPI measurements on bus lines .25
Figure 12 – RF monitoring network for DPI measurements of bus lines.25
Figure 13 – Coupling network for DPI measurements on V .25
Bat
Figure 14 – RF monitoring network for DPI measurements of V .26
Bat
Figure 15 – Coupling network for DPI measurements on wake-up.26
Figure 16 – RF monitoring network for DPI measurements of wake-up.26
Figure 17 – Example of the circuit diagram of the minimum network for a CAN high
speed system for testing the transient immunity.29
Figure 18 – Example of the circuit diagram of the minimum network for a CAN low
speed system for testing the transient immunity.30
TS 62228 © IEC:2007(E) – 3 –
Figure 19 – Test set-up for direct capacitive impulse coupling .32
Figure 20 – Coupling network for direct capacitive impulse coupling on CAN_High and
CAN_Low .33
Figure 21 – Coupling network for direct capacitive impulse coupling on V .33
Bat
Figure 22 – Coupling network for direct capacitive impulse coupling on wake-up .33
Figure 23 – Circuit diagram of the test set-up for ESD measurements at CAN high
speed transceivers.36
Figure 24 – Circuit diagram of the test set-up for ESD measurements at CAN low
speed transceivers.36
Figure 25 – Test set-up for ESD measurements.37
Figure 26 – Coupling network for ESD measurements on bus lines, V and wake-up .38
Bat
Figure A.1 – Example of IC interconnections of CAN high and CAN low.40
Figure B.1 – Example of presentation of emission test results in the frequency domain .42
Figure B.2 – Example of presentation of DPI test results.43
Table 1 – Overview of requested measurements and tests.7
Table 2 – General test conditions.8
Table 3 – Communication test signal TX1 .13
Table 4 – Communication test signal TX2 .13
Table 5 – Basic scheme for immunity evaluation.14
Table 6 – Boundary values for normal IC operation.14
Table 7 – Overview of decoupling ports for emission.17
Table 8 – Parameters for emission test in the frequency domain.19
Table 9 – Settings of the measurement device for measurement of emission in the
frequency domain .20
Table 10 – Overview of coupling ports .23
Table 11 – Specifications for DPI measurements .27
Table 12 – Required DPI measurements for function test.28
Table 13 – Combination of resistors for coupling on DPI measurements .28
Table 14 – Overview of coupling ports .31
Table 15 – Parameters for functional test.34
Table 16 – Required impulse tests for functioning.34
Table 17 – Parameters for impulse test (damage test) .35
Table 18 – Required impulse tests for damage .35
Table 19 – Summery of ESD coupling points .37
Table 20 – Specifications for ESD measurements .39
Table A.1 – Parameter ESD test circuit board .41
– 4 – TS 62228 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS −
EMC EVALUATION OF CAN TRANSCEIVERS
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