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IEC

IEC 62047-10:2011/COR1:2012

(Corrigendum)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Corrigendum 1 - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

General Information

Status
Published
Publication Date
27-Feb-2012
ICS
31.080.99 - Other semiconductor devices
Technical Committee
SC 47F - Micro-electromechanical systems
Current Stage
PPUB - Publication issued
Start Date
29-Feb-2012
Completion Date
28-Feb-2012
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Relations

Corrects
IEC 62047-10:2011 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Effective Date
05-Sep-2023

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IEC 62047-10:2011/COR1:2012 - Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials Released:2/28/2012IEC 62047-10:2011/COR1:2012 - Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials Released:2/28/2012
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IEC 62047-10:2011/COR1:2012 - Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials Released:2/28/2012
English and French language
10 pages
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Standards Content (Sample)


IEC 62047-10 CEI 62047-10
(First edition – 2011) (Première édition – 2011)

Semiconductor devices – Dispositifs à semiconducteur –
Micro-electromechanical devices – Dispositifs microélectromécaniques –

Part 10: Micro-pillar compression test for MEMS Partie 10: Essai de compression utilisant
materials la technique des micro-piliers pour les
matériaux des MEMS
CO RR
...

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