Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition:
a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;
b) editorial modifications on several pages; and
c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.

Normalisation mécanique des dispositifs à semi-conducteurs - Partie 6: Règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semi-conducteurs pour montage en surface

La CEI 60191-6:2009 donne les règles générales pour la préparation des dessins d'encombrement des dispositifs à semi-conducteurs pour montage en surface. Elle complète la CEI 60191-1 et la CEI 60191-3. Elle couvre tous les dispositifs pour montage en surface à semi-conducteurs discrets dotés d'au moins 8 sorties, ainsi que les circuits intégrés classés "de forme E" dans l'Article 3 de la CEI 60191-4. Cette troisième édition de la CEI 60191-6 annule et remplace la deuxième édition parue en 2004 dont elle constitue une révision technique. La présente édition contient les modifications majeures suivantes par rapport à l'édition précédente:
a) le domaine d'application est modifié pour couvrir tous les dispositifs pour montage en surface à semi-conducteurs discrets dotés d'au moins 8 sorties;
b) des modifications éditoriales sur plusieurs pages; et
c) une révision technique du boîtier matriciel à billes (BGA) particulièrement son format de dessin géométrique. (la révision du format de dessin permettrait d'unifier deux types de boîtier BGA pour n'avoir qu'un seul type.)

General Information

Status
Published
Publication Date
25-Nov-2009
Current Stage
PPUB - Publication issued
Completion Date
26-Nov-2009
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IEC 60191-6 ®
Edition 3.0 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6: General rules for the preparation of outline drawings of surface mounted
semiconductor device packages
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6: Règles générales pour la préparation des dessins d'encombrement des
boîtiers pour dispositifs à semi-conducteurs pour montage en surface

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IEC 60191-6 ®
Edition 3.0 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6: General rules for the preparation of outline drawings of surface mounted
semiconductor device packages
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6: Règles générales pour la préparation des dessins d'encombrement des
boîtiers pour dispositifs à semi-conducteurs pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.080.01 ISBN 978-2-88910-063-7
– 2 – 60191-6 © IEC:2009
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .6
4 Design rules .7
5 Dimensions to be specified.8
6 Notes .8
Annex A (informative) Illustration of the rules.12
Annex B (informative) Optional table format.36
Bibliography.38

Figure A.1 – Illustrations of terminal projection zone.13
Figure A.2 – Isometric view of an example of gauge .13
Figure A.3a – Top view .14
Figure A.3b – Side view .14
Figure A.3c – Lead section .14
Figure A.3d – Lead side view.14
Figure A.4 – Pattern of terminal position areas .14
Figure A.5a – Top view .17
Figure A.5b – Side view .17
Figure A.5c – Lead section .17
Figure A.5d – Lead side view.17
Figure A.6 – Pattern of terminal position areas .17
Figure A.7a – Top view .20
Figure A.7b – Side view .20
Figure A.7c – Lead section .20
Figure A.7d – Lead side view.20
Figure A.8 – Pattern of terminal position areas .20
Figure A.9a – Top view .23
Figure A.9b – Side view .23
Figure A.9c – Side view .23
Figure A.9d – Lead shape.23
Figure A.9e – Lead side view.23
Figure A.9f – Lead section .23
Figure A.10 – Pattern of terminal position areas .23
Figure A.11a – Top view .26
Figure A.11b – Side view .26
Figure A.11c – Side view .26
Figure A.11d – Lead section .27
Figure A.11e – Lead shape .27
Figure A.11f – Lead side view.27

60191-6 © IEC:2009 – 3 –
Figure A.12 – Pattern of terminal position areas .27
Figure A.13a – Top View.30
Figure A.13b – Side View.30
Figure A.13c – Bottom view .30
Figure A.14 – Pattern of terminal position areas .30
Figure A.15a – Top view .33
Figure A.15b – Side view .33
Figure A.15c – Bottom view .33
Figure A.16 – Pattern of terminal position areas .33

Table 1 – Dimensions to be specified for Group 1 .9
Table 2 – Dimensions to be specified for Group 2 .10

– 4 – 60191-6 © IEC:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
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consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services an
...

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