IEC 60384-20-1:2008/COR1:2008
(Corrigendum)Corrigendum 1 - Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ
Corrigendum 1 - Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ
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IEC 60384-20-1
(Second edition – 2008)
Fixed capacitors for use in electronic equipment –
Part 20-1: Blank detail specification – Fixed metallized polyphenylene sulfide
film dielectric surface mount d.c. capacitors – Assessment level EZ
CORRIGENDUM 1
Replace, on the cover page, the title page, and on pages 4 and 6 th
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IEC 60384-21:2024 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric with a defined temperature coefficient (dielectric Class 1), intended for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included but are covered by IEC 60384-14. The object of this document is to specify preferred ratings and characteristics and to select from IEC 60384-1:2021 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification provide specific test severities and requirements of an equal or higher performance level. Further information on the conception of generic, sectional and detail specifications can be found in the Introduction of IEC 60384-1:2021.
This edition includes the following significant technical changes with respect to the previous edition:
a) the document has been completely restructured to comply with the ISO/IEC Directives, Part 2 and to make it more useable; tables, figures and references have been revised accordingly; Annex X contains all cross-references of changes in clause/subclause numbers;
b) the terms have been replaced by the letter symbols in Table 3;
c) code of temperature coefficient and tolerance of C0G, U2J have been added in Table 4, Table 6, Table 8, Table 9, Table 11, Table 13, Table 16 and Annex B;
d) the requirement in 5.5.2(visual examination) has been repeated in 5.9.3, 5.10.5, 5.11.4, 5.11.4, 5.13.7, 5.14.5 and 5.15.5;
e) the deflection D in the very robust designs has been added in 5.9.1;
f) Annex B has been changed informative into normative;
g) Clause C.5 (Test schedule for quality conformance inspection) has been newly added to withdraw the blank detail specification: IEC 60384-21-1.
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IEC 60384-22:2024 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.
Capacitors for electromagnetic interference suppression are not included but are covered by IEC 60384-14. The object of this document is to specify preferred ratings and characteristics and to select from IEC 60384-1:2021 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification provide specific test severities and requirements of an equal or higher performance level. Further information on the conception of generic, sectional and detail specifications can be found in the Introduction of IEC 60384-1:2021.
This edition includes the following significant technical changes with respect to the previous edition:
a) The document has been completely restructured to comply with the ISO/IEC Directives, Part 2 and to make it more useable; tables, figures and references have been revised accordingly.
b) The requirements of reference temperature 25 °C has been added in Table 5, Table 9, Table 10, Table 12, Table 14 and Table 17.
c) The table of temperature characteristics of capacitance for the reference temperature 25 °C have been added in Table C.1, Table C.2 and Table C.3.
d) The requirement in 5.5.2 (visual examination) has been repeated in 5.9.3, 5.10.6, 5.11.4, 5.12.6, 5.13.8, 5.14.6 and 5.15.6.
e) The deflection D in the very robust designs has been added in 5.9.1.
f) Annex C has been changed informative into normative.
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- revision of all parts of the document based on the ISO/IEC Directives, Part 2:2021, and harmonization with other similar kinds of documents;
- the document structure has been organized to follow new sectional specification structure decided in TC 40;
- revised tables and Clause 5 so as to prevent duplications and contradictions;
- in Clause 5.2 (Mounting), the Subclauses 5.2.1, 5.2.2 and 5.2.3 have been added;
- in Subclause 5.5 (Shear test), the Subclauses 5.5.1 and 5.5.2 have been added;
- in Subclause 5.14 (Component solvent resistance), the Subclauses 5.14.1 and 5.14.2 have been added. In Table 8 and Table A.2, test 5.14 has been moved before 5.7.5 (Final inspections and requirements) in Group 1A and in Subgroup C1;
- in Subclause 5.15 (Solvent resistance of marking), the Subclauses 5.15.1 and 5.15.2 have been added;
- tangent of loss angle measurement has been added to resistance to soldering heat test;
- lot-by-lot and periodical inspection tables, including requirements, have been moved to Annex A;
- revised Inspection Level (IL) of A1 subgroup.
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- the document structure has been organized to follow new sectional specification structure decided in TC 40;
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- in Subclause 5.15 (Solvent resistance of marking), the Subclauses 5.15.1 and 5.15.2 have been added;
- tangent of loss angle measurement has been added to the resistance to soldering heat test;
- lot-by-lot and periodical inspection tables including requirements have been moved to Annex A;
- revised Inspection Level (IL) of A1 subgroup.
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- deletion of the description on the permissible reactive power in 6.2.2 because it is not appropriate for the purposes of this document;
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