IEC TS 62647-1:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan

IEC/TS 62647-1:2012(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and defence electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. Keywords: avionics, lead-free solder

General Information

• Status: Published
• Publication Date: 08-Aug-2012
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 1 - TC 107/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 15-Sep-2012
• Completion Date: 09-Aug-2012

Relations

• Replaces: IEC PAS 62647-1:2011 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/TS 62647-1 ®
Edition 1.0 2012-08
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 1: Preparation for a lead-free control plan

IEC/TS 62647-1:2012(E)
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IEC/TS 62647-1 ®
Edition 1.0 2012-08
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 1: Preparation for a lead-free control plan

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
V
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-83220-298-2

– 2 – TS 62647-1 © IEC:2012(E)
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Symbols and abbreviated terms . 11
5 Objectives . 11
5.1 General . 11
5.2 Reliability . 12
5.3 Configuration control and product identification . 12
5.4 COTS assemblies and sub-assemblies . 12
5.5 Deleterious effects of tin whiskers . 12
5.6 Repair, rework, maintenance, and support. 12
6 Technical requirements . 12
6.1 General . 12
6.2 Reliability . 12
6.2.1 General . 12
6.2.2 Test and analysis methods . 13
6.2.3 Environmental and operating conditions . 13
6.2.4 Data . 13
6.2.5 Conversion of results from available data to applicable conditions . 14
6.3 Configuration control and product identification . 14
6.3.1 General . 14
6.3.2 Termination materials and finishes . 14
6.3.3 Solder alloys used in the assembly process . 15
6.3.4 Wiring and connector assemblies . 15
6.3.5 Changes in solder alloys. 15
6.3.6 Identification . 16
6.3.7 Part number changes . 16
6.4 COTS assemblies and sub-assemblies . 16
6.4.1 General . 16
6.4.2 COTS assembly and sub-assembly configuration control and product
identification . 16
6.5 Deleterious effects of tin whiskers . 16
6.6 Repair, rework, maintenance, and support. 16
7 Plan administrative requirements . 17
7.1 Plan organization . 17
7.2 Terms and definitions . 17
7.3 Plan point of contact . 17
7.4 References . 17
7.5 Requirements for suppliers and sub-contractors . 17
7.6 Plan acceptance . 17
7.7 Plan modifications . 17
Annex A (informative) Template for tailoring requirements of IEC/TS 62647-1 . 18

TS 62647-1 © IEC:2012(E) – 3 –
Annex B (informative) Requirements matrix for IEC/TS 62647-1 . 19
Annex C (informative) Guidance on configuration control and product identification . 23
Bibliography . 31

Figure C.1 – Decision flow chart . 25
Figure C.2 – Manufacturing, maintenance and reliability considerations . 28
Figure C.3 – Tin whisker considerations . 29

Table A.1 – Template for tailoring requirements . 18
Table B.1 – Requirement matrix . 19

– 4 – TS 62647-1 © IEC:2012(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 1: Preparation for a lead-free control plan

FOREWORD
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• the required support cannot be obtained for the publication of an International Standard,
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• the subject is still under technical development or where, for any other reason, there is the
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Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62647-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

TS 62647-1 © IEC:2012(E) – 5 –
This technical specification cancels and replaces IEC/PAS 62647-1 published in 2011. This
edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to:
a) the addition of requirements for the use of Pb-free solder alloys,
b) the addition of requirements for the use of COTS,
c) the update of Annex B.
The text of this technical specification is originally based on the following document:
GEIA-STD-0005-1 Revision A.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/159/DTS 107/180/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC/TS 62647 series, published under the general title Process
management for avionics, can be found on the IEC website.
The committee has decid
...