IEC 62668-2:2019

Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources

IEC 62668-2:2019, defines requirements for avoiding the use of counterfeit, recycled and fraudulent components when these components are not purchased from the original component manufacturer (OCM) or are purchased from outside of franchised distributor networks for use in the aerospace, defence and high performance (ADHP) industries. This practice is used, as derogation, only when there are no reasonable or practical alternatives.
NOTE: Typically this document is used in conjunction with IEC 62239-1 and IEC 62668-1, enabling ADHP industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains.
Although developed for the ADHP industry, this document can be used by other high-performance and high-reliability industries, at their discretion.
This first edition cancels and replaces the second edition of IEC TS 62668-2 published in 2016. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the second edition of IEC TS 62668-2:
a) updates to the risk assessment process, including reference to SAE AS6081;
b) updates to the test methods, including reference to the SAE AS6171 test methods published and in development;
c) updates in line with IEC 62668-1 for definitions and references to DFARS.

Gestion des processus pour l'avionique - Prévention de la contrefaçon - Partie 2: Gestion des composants électroniques achetés auprès de sources non franchisées

l'IEC 62668-2:2019 définit les exigences permettant d'éviter l'utilisation de composants contrefaits, recyclés et frauduleux lorsque ces composants ne sont pas achetés auprès du fabricant de composants d'origine (OCM) ou lorsqu'ils sont achetés en dehors des réseaux de distributeurs franchisés pour être utilisés dans le secteur de l'aérospatial, de la défense et des hautes performances (ADHP). Cette pratique est utilisée comme dérogation uniquement si aucune alternative raisonnable ou pratique n'est disponible.
NOTE En règle générale, le présent document est utilisé conjointement avec l'IEC 62239-1 et l'IEC 62668-1, permettant au secteur ADHP de gérer et d'éviter l'utilisation de composants contrefaits, recyclés et frauduleux dans ses chaînes d'approvisionnement.
Bien que développé pour le secteur ADHP, le présent document peut être utilisé par d'autres secteurs hautes performances et haute fiabilité à leur gré.
Cette première édition annule et remplace la deuxième édition de l'IEC TS 62668-2 publiée en 2016. Cette édition constitue une révision technique. La présente édition inclut les modifications techniques majeures suivantes par rapport à la deuxième édition de l'IEC TS 62668-2:
a) mises à jour du processus d'évaluation des risques, y compris la référence à la SAE AS6081;
b) mises à jour des méthodes d'essai, y compris la référence aux méthodes d'essai de la SAE AS6171 publiées et à l'étude;
c) mises à jour des définitions et des références à la DFARS conformément à l'IEC 62668-1.

General Information

• Status: Published
• Publication Date: 08-Jul-2019
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 3 - TC 107/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 09-Jul-2019
• Completion Date: 12-Jul-2019

Relations

• Replaces: IEC TS 62668-2:2016 - Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
• Effective Date: 05-Sep-2023
• Revises: IEC TS 62668-2:2014 - Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
• Effective Date: 05-Sep-2023

Overview

IEC 62668-2:2019 is an international standard established by the International Electrotechnical Commission (IEC) focused on process management for avionics with a specific focus on counterfeit prevention. This second part of the IEC 62668 series addresses the challenging aspect of managing electronic components sourced from non-franchised distributors in aerospace, defence, and high-performance (ADHP) industries.

The standard defines stringent requirements aimed at avoiding the use of counterfeit, recycled, or fraudulent electronic components when such components cannot be sourced directly from the original component manufacturer (OCM) or franchised distributor networks. This derogation process is intended to be employed only when no reasonable or practical alternatives exist, thereby ensuring component authenticity, reliability, and safety in critical avionics applications.

Its first edition cancels and replaces the earlier technical specification (IEC TS 62668-2, 2016), reflecting updates in risk assessment methodologies aligned with SAE standards, enhanced test methods, and harmonization with related parts of the IEC 62668 series.

Key Topics

• Scope and Applicability: Addresses components from non-franchised distributors used in aerospace, defence, and other high-reliability sectors where counterfeit prevention is crucial.

• Risk Assessment Process: Updated with references to SAE AS6081, this process identifies potential risks related to quality, reliability, legal matters, and financial implications of purchasing from untrusted sources.

• Derogation Procedure: Outlines a structured approach including:

  • Notification to the OEM,
  • Evaluation of alternative sourcing solutions,
  • Establishment of approved non-franchised distributor lists,
  • Risk analysis and order authorization,
  • Inbound processing and manufacturing controls,
  • Nonconformance and failure management.

• Testing and Validation: Incorporates updated test methodologies per SAE AS6171 standards for suspect electronic components, ensuring rigorous verification against counterfeit and fraudulent parts.

• Supply Chain Controls: Emphasizes transparent records, storage management, and order processing to maintain traceability and secure handling of components from non-franchised sources.

• Inter-Standard Coordination: Designed to be used alongside IEC 62239-1 (Procurement Controls) and IEC 62668-1 (Counterfeit Prevention General Requirements) for comprehensive counterfeit management in ADHP industries.

Applications

IEC 62668-2:2019 is essential for organizations within aerospace, defence, and related high-performance and high-reliability industries that must prevent the risk of counterfeit and fraudulent electronic components. Practical applications include:

• Avionics Manufacturing & Maintenance: Ensures components sourced beyond authorized channels meet strict authentication and reliability criteria.

• Supply Chain Management: Helps identify and manage risks when circumventing franchised distributors under constrained supply conditions such as obsolescence or allocation.

• Quality Assurance Programs: Supports implementation of robust inspection, testing, and verification processes to detect counterfeit electronic parts.

• Risk Mitigation Strategies: Guides decision-making when negotiating component sourcing challenges by evaluating technical, financial, and legal risks.

• Regulatory Compliance: Assists firms in aligning with industry best practices and legal frameworks, including references to Defense Federal Acquisition Regulation Supplement (DFARS).

Related Standards

• IEC 62668-1: Process management for avionics – Counterfeit prevention – Part 1
  Provides the overarching counterfeit prevention framework and general requirements applicable to avionics and other ADHP industries.

• IEC 62239-1: Management of procurement processes
  Defines controls and workflows for procurement to minimize counterfeit component risks.

• SAE AS6081: Distributors of counterfeit electronic parts - avoidance, detection, mitigation, and disposition
  Offers detailed risk assessment and management practices used as reference for this IEC standard.

• SAE AS6171 series: Test Methods Standard for Electrical, Electronic, and Electromechanical (EEE) Parts
  Prescribes specific tests identifying counterfeit and fraudulent electronic components, integral to the validation process defined in IEC 62668-2.

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Adopting IEC 62668-2:2019 enables avionics and defense manufacturers to maintain high levels of component integrity, safeguarding the operational reliability and safety of critical systems through effective counterfeit prevention when sourcing from non-franchised suppliers. This standard is a vital part of modern supply chain risk management strategies within high-stakes industries.

Standards Content (Sample)

IEC 62668-2 ®
Edition 1.0 2019-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Counterfeit prevention –
Part 2: Managing electronic components from non-franchised sources

Gestion des processus pour l'avionique – Prévention de la contrefaçon –
Partie 2: Gestion des composants électroniques achetés auprès de sources non
franchisées
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IEC 62668-2 ®
Edition 1.0 2019-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Counterfeit prevention –

Part 2: Managing electronic components from non-franchised sources

Gestion des processus pour l'avionique – Prévention de la contrefaçon –

Partie 2: Gestion des composants électroniques achetés auprès de sources non

franchisées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-7047-9

– 2 – IEC 62668-2:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 12
4 Technical requirements . 13
4.1 General . 13
4.2 Overview. 14
4.3 Risks associated with purchasing from non-franchised distributors . 15
4.3.1 General . 15
4.3.2 Origin of risks . 15
4.3.3 Quality risks. 15
4.3.4 Industrial risks . 16
4.3.5 Reliability risks . 17
4.3.6 Financial risks . 17
4.3.7 Legal risk . 17
4.4 Reasons to initialize the derogation process . 17
4.4.1 General . 17
4.4.2 Obsolescence notice failure . 17
4.4.3 Allocation . 17
4.4.4 Insufficient end-of-life inventory . 18
4.4.5 Late orders . 18
4.4.6 Minimum order quantity . 18
4.4.7 Technical requirements . 18
4.5 Derogation process . 18
4.5.1 Notification to the OEM . 18
4.5.2 Analysis of alternative solutions . 20
4.5.3 List of approved non-franchised distributors. 21
4.5.4 Non-franchised distributor consultation . 21
4.5.5 Risk analysis . 22
4.5.6 Non-franchised distributor order authorization . 25
4.5.7 Order processing . 26
4.5.8 Incoming processing . 26
4.5.9 Records . 30
4.5.10 Processing during storage and manufacturing . 31
4.5.11 Failed electronic components . 31
Annex A (informative) Flowchart of IEC 62668-1 requirements . 32
Annex B (informative) Example of detailed tests list, linked with risks levels . 34
Annex C (informative) iNEMI assessment methodology and metric development . 42
Annex D (informative) Summary of SAE AS6171 series' proposed test methods under
consideration by SAE International . 43
Bibliography . 51

Figure 1 – Suspect components perimeter . 14

Figure 2 – Typical derogation process when supplying from non-franchised distribution. 19
Figure 3 – Potential avionics supply chain scenarios and notification feedbacks . 20
Figure A.1 – Flowchart of IEC 62668-1 requirements . 33

Table 1 – Typical procurement risk scenarios and guidance for risk assessment . 23
Table 2 – Typical testing . 29
Table B.1 – Example of detailed revalidation testing of suspect stock . 34
Table D.1 – Summary of SAE AS6171 series test methods (published versions and
those under considerations) . 43

– 4 – IEC 62668-2:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 2: Managing electronic components
from non-franchised sources
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62668-2 has been prepared by IEC technical committee 107:
Process management for avionics.
This first edition cancels and replaces the second edition of IEC TS 62668-2 published in
2016. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the second
edition of IEC TS 62668-2:
a) updates to the risk assessment process, including reference to SAE AS6081;
b) updates to the test methods, including reference to the SAE AS6171 test methods
published and in development;
c) updates in line with IEC 62668-1 for definitions and references to DFARS.

This International Standard is to be used in conjunction with IEC 62239-1 and IEC 62668-1.
The text of this International Standard is based on the following documents:
FDIS Report on voting
107/353/FDIS 107/359/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 62668-2:2019 © IEC 2019
INTRODUCTION
The avionics industry has a responsibility to ensure that all flight equipment produced has a
predicted product life which correlates with the predicted repair and service life to ensure the
public is not endangered. Typically, an original equipment manufacturer (OEM) calculates a
mean time between failure (MTBF) and possibly a mean time to failure (MTTF) prediction.
These calculations assume all components are new, or considered as “unused”, at the point
of introduction into flight use and that no useful component life and/or any “unsafe”
component conditions have been used. It is therefore essential that counterfeit, recycled and
fraudulent components which have had potentially some of their ”useful life” consumed and
which can also be malfunctioning are not purchased for use in aerospace, defence and high
performance (ADHP) industries.

PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 2: Managing electronic components
from non-franchised sources
1 Scope
This part of IEC 62668, defines requirements for avoiding the use of counterfeit, recycled and
fraudulent components when these components are not purchased from the original
component manufacturer (OCM) or are purchased from outside of franchised distributor
networks for use in the aerospace, defence and high performance (ADHP) industries. This
practice is used, as derogation, only when there are no reasonable or practical alternatives.
NOTE Typically this document is used in conjunction with IEC 62239-1 and IEC 62668-1, enabling ADHP
industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains.
Although developed for the ADHP industry, this document can be used by other high-
performance and high-reliability industries, at their discretion.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62239-1, Process management for avionics – Management plan – Part 1: Preparation and
maintenance of an electronic components management plan
IEC 62668-1:2019, Process management for avionics – Counterfeit prevention – Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic components
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
aftermarket source
reseller which may or may not be under contract with the original component manufacturer
(OCM) or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated components (wafer
and/or die) whose end of life date has been published by the OCM. These components are then resold at a profit to
fill a need within the market for components that have become obsolete.
[SOURCE: IEC 62668-1:2019, 3.1.1]

– 8 – IEC 62668-2:2019 © IEC 2019
3.1.2
broker
individual or corporate organization that serves as an intermediary between buyer and seller
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by another. The broker operates within a worldwide
component exchange network.
[SOURCE: IEC 62668-1:2019, 3.1.2]
3.1.3
COTS product
commercial off-the-shelf product
one or more components, assembled and developed for multiple commercial consumers,
whose design and/or configuration is controlled by the manufacturer’s specification or industry
standard
Note 1 to entry: COTS products can include electronic components, subassemblies, or assemblies, or top-level
assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard
drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid
arrays, file servers to individual switches, routers, personal computers, or similar equipment.
Note 2 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.3]
3.1.4
counterfeit, verb
action of simulating, reproducing or modifying a material, good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to willful trademark infringement.
[SOURCE: IEC 62668-1:2019, 3.1.4]
3.1.5
counterfeited component
material good imitating or copying an authentic material, good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty
etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use, etc.
Note 2 to entry: When a material good has no registered or confidential intellectual property rights, then the
material good has no intellectual property protection. Examples include situations where the original component
manufacturer (OCM) has ceased to trade and has not sold or passed on the intellectual property rights to another
entity.
[SOURCE: IEC 62668-1:2019, 3.1.5]
3.1.6
customer device specification
device specification written by a user and agreed by the supplier
[SOURCE: IEC 62668-1:2019, 3.1.6]

3.1.7
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant with this document, and uses them
to design, produce, and maintain systems
[SOURCE: IEC 62668-1:2019, 3.1.7]
3.1.8
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
[SOURCE: IEC 62668-1:2019, 3.1.8]
3.1.9
franchised distributor or agent
individual or corporate organisation that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be dispatched either directly from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
[SOURCE: IEC 62668-1:2019, 3.1.9]
3.1.10
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
1) a stolen component;
2) a component scrapped by the original component manufacturer (OCM) or by any user;
3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled (for example,
disassembled from a PCB assembly) component resold as a new component (see Figure 1), where typically
there is evidence of prior use and rework (for example solder, re-plating or lead re-attachment activity) on the
component package terminations;
4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;
5) fraudulent designs, models, patents, software, or copyright sold as being new and authentic. For example: a
component whose production and distribution are not controlled by the original manufacturer;
6) unlicensed copies of a design;
7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other
identifiers etc.), which may be a counterfeit component (see Figure 1);
8) a component without an internal silicon die or with a substituted silicon die which is not the original
manufacturer’s silicon die.
[SOURCE: IEC 62668-1:2019, 3.1.10]

– 10 – IEC 62668-2:2019 © IEC 2019
3.1.11
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards / printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components).
Note 2 to entry: A microcircuit is usually referred to as an active component or device. The term component can
be applied to passive devices such as resistors and capacitors. Sometimes the term ‘part’ is also used instead of
the terms ‘microcircuit’, ‘component’ and ‘device’
[SOURCE: IEC 62668-1:2019, 3.1.12, modified – Note 2 has been added.]
3.1.12
MRO
maintenance, repair and overhaul
operations such as tests, measurements, replacements, adjustments and repairs intended to
retain or restore a functional unit or to a specified state in which the unit can perform its
required functions
Note 1 to entry: This activity includes inspection, rebuilding, alteration and the supply of spare parts, accessories,
raw materials, adhesives, sealants, coatings and consumables.
Note 2 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.13]
3.1.13
non-franchised distributor
companies which do not fall under a franchised distributor or OCM
Note 1 to entry: These distributors may purchase components from component manufacturers, franchised
distributors, or through other supply channels (open markets). These distributors cannot always provide the
guarantees and support provided by the franchised distributor network; components sourced through this source
are usually protected by the source’s warranty only.
Note 2 to entry: Some non-franchised distributors are able to purchase traceable components from the OCM or
their franchised distributors and provide traceability paperwork and/or are able to return stock for investigation to
the OCM. Such non-franchised distributors can satisfy the USA DFARS 252.246.7008 requirements (see A.8.10 of
IEC 62668-1:2019).
[SOURCE: IEC 62668-1:2019, 3.1.14]
3.1.14
OCM
original component manufacturer
company specifying and manufacturing the electronic component
Note 1 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.15]
3.1.15
OEM
original equipment manufacturer
manufacturer which defines the electronic subassembly that includes the electronic
components or defines the components used in an assembly and/or test specification

Note 1 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.16]
3.1.16
piracy
wilful copyright infringement
[SOURCE: IEC 62668-1:2019, 3.1.17]
3.1.17
re-manufactured component
electronic component that includes recycled silicon die or technology
element as documented and disclosed by the electronic component re-manufacturer and that
is fully tested before being sold
Note 1 to entry: Examples include a silicon or other die extracted from another electronic component, either new
or used which is externally marked and disclosed using the re-manufacturer’s name, logo, and different part
number.
Note 2 to entry: Re-manufacturing an electronic component can necessitate the original engineering data and
schematics of the product. This does not mean that a re-manufactured product is identical to the new product.
Note 3 to entry: Electronic re-manufactured components often come with warranties.
[SOURCE: IEC 62668-1:2019, 3.1.18]
3.1.18
purchasing agency
organization which groups the quantities of electronic components required by a series of
companies in order to constitute significant buying power and thereby obtain the best possible
supplier conditions for purchasing (especially as regards pricing and purchasing conditions)
as well as for assistance with management, documentation, financing, etc.
3.1.19
reseller
general supplier which offers a selection of electronic components to order from a catalogue
[SOURCE: IEC 62668-1:2019, 3.1.19]
3.1.20
recycled component
electrical component removed from its original product or assembly and available for reuse
Note 1 to entry: The component has authentic logos, trademarks and markings. However, it typically has no
output to measure the useful life remaining for its reuse. A recycled component can fail earlier than a new one
when re-assembled into another product or assembly. A recycled component may also be physically or ESD
damaged during the removal process.
[SOURCE: IEC 62668-1:2019, 3.1.20]
3.1.21
semiconductor
electronic component in which the characteristic distinguishing electronic conduction takes
place within a semiconductor
Note 1 to entry: This includes semiconductor diodes which are semiconductor devices having two terminals and
exhibiting a nonlinear voltage-current characteristic and transistors which are active semiconductor devices
capable of providing power amplification and having three or more terminals.
[SOURCE: IEC 62668-1:2019, 3.1.21]

– 12 – IEC 62668-2:2019 © IEC 2019
3.1.22
subcontractor
manufacturer of electronic subassemblies or supplier manufacturing items in compliance with
customer design data pack and drawings, and under the authority of the OEM
Note 1 to entry: This supplier may potentially procure all or part of the electronic components required to produce
a subassembly and is often referred to as the contract electronic manufacturer (CEM) or electronics manufacturing
services (EMS).
[SOURCE: IEC 62668-1:2019, 3.1.22]
3.1.23
supplier
company which provides to another an electronic component which is identified by the logo or
name marked on the device
Note 1 to entry: A supplier can be an OCM, a franchised distributor or agent, a non-franchised distributor, broker,
reseller, OEM, CEM, and EMS etc.
[SOURCE: IEC 62668-1:2019, 3.1.23]
3.1.24
suspect component
electronic component which has lost supply chain traceability back to the original
manufacturer and which may have been misrepresented by the supplier or manufacturer and
may meet the definition of fraudulent or counterfeit component
Note 1 to entry: Suspect components may include but are not limited to:
1) counterfeit components;
2) recycled components coming from uncontrolled recycling operations carried outside of the OEM, franchised
network and OEM business where typically it has been fraudulently sold to the OEM as being in a new unused
condition.
[SOURCE: IEC 62668-1:2019, 3.1.24]
3.1.25
traceability
ability to have for an electronic component its full trace back to the original component
manufacturer
Note 1 to entry: This traceability means that every supplier in the supply chain is prepared to legally declare in
writing that they know and can identify their source of supply, which goes back to the original manufacturer and
can confirm that the electronic components are brand new and were handled with appropriate handling precautions
including ESD and MSL. This authenticates the electronic components being supplied are unused, brand new
components with no ESD, MSL or other damage. This ensures that the electronic components are protected by any
manufacturer’s warranties, have all of their useful life remaining and function according to the manufacturer’s
published data sheet, exhibiting the expected component life in the application for the OEM’s reliability predictions
and product warranty.
[SOURCE: IEC 62668-1:2019, 3.1.25]
3.1.26
untraceable
property of electronic components which have lost their traceability (see 3.1.25)
[SOURCE: IEC 62668-1:2019, 3.1.26]
3.2 Abbreviated terms
ACTF Semiconductor Industries Association Anti Counterfeit Task Force
ADHP aerospace, defence and high performance
CEM contract electronic manufacturer

COTS commercial off-the-shelf
CSAM C-mode scanning acoustic microscopy
DLA Defense Logistics Agency
DMSMS diminishing manufacturing sources and material shortages
DPA destructive physical analysis
DSCC Defence Supply Centre Columbus (see http://www.dscc.dla.mil/), now known as
DLA
EMS electronics manufacturing services
ERAI Electronic Reseller Association International (see http://www.erai.com)
ESCO Electronic Systems Challenges and Opportunities (see
http://www.esco.org.uk/about-v2/ )
ESD electrostatic discharges
G-19 SAE Counterfeit Electronic Parts Committee
GIDEP Government-Industry Data Exchange Program
GIFAS Groupement des Industries Françaises Aéronautiques et Spatiales (French
Aerospace Association)
HTRB high temperature reverse bias
IDEA Independent Distributors of Electronics Association
LDC lot date code
LTB last time buy
MSL moisture sensitivity level
MTBF mean time between failure
MTTF mean time to failure
OCM original component manufacturer
OEM original equipment manufacturer
SEM scanning electron microscopy
4 Technical requirements
4.1 General
IEC 62668-1 minimises counterfeiting, recycling and fraudulent activities by providing
guidelines and requirements for maintaining intellectual property and recommends purchasing
traceable components from the OCMs or their franchised distributors (see Annex A).
IEC 62668-1 references this document when purchasing components outside of the
franchised distributor network in order to avoid and manage suspect components (see 3.1.24
for the definition of “suspect component” and Figure 1).
NOTE 1 Obsolescence management is a major contributor in counterfeiting prevention. IEC 62239-1, IEC 62402
and SAE STD-0016 provide guidelines regarding component obsolescence.
NOTE 2 Suspect components require reporting in USA DFARS 252.246.7007 and DFARS 252.246.7008 supply
chains. See also reporting aspects in 4.5.11.

– 14 – IEC 62668-2:2019 © IEC 2019

Figure 1 – Suspect components perimeter
4.2 Overview
OEM companies have numerous sourcing channels available to procure components for their
equipment. It is the original equipment manufacturer's (OEM) responsibility to ensure that its
electronic component procurement process is robust.
As a rule, the original equipment manufacturer, or subcontractor (which includes purchasing
agents acting on its behalf), which places orders for these components, orders directly from a
component manufacturer, the manufacturer representative or its franchised distributor. This is
the only supply system that can guarantee component compliance with specifications and
component origin (see IEC 62668-1).
Under exceptional circumstances, and after having exhausted all options within the franchised
system and after having reviewed other possible alternatives, the OEM can decide to
purchase components through a non-franchised distribution network. Purchasing through non-
franchised channels is considered a derogation process for which the OEM is fully
responsible.
The OEM is responsible for ensuring that its products do not include counterfeit components.
Moreover, it guarantees that the reliability of its equipment is not affected when this
equipment includes components purchased from non-franchised sources.
The OEM shall have anti-counterfeit management plans in place, to comply with
IEC 62668-1.
Subclauses 4.3 to 4.5 apply to OEMs and their subcontractors when purchasing components
from sources of supply other than from the OCM or from franchised distributors.
However, there are the following exclusions to this document:
1) In situations where purchasing agents are under contract to the OEMs to order
components on their behalf, the purchasing agent is considered to be ‘the OEM’ and is not
considered to be a non-franchised distributor.
2) In situations where an approved logistics supply agency, for example the DLA in the USA,
supplies components for logistics purposes to a national defence customer and associated
OEMs, the approved logistics supply agency is not considered to be a non-franchised
distributor.
4.3 Risks associated with purchasing from non-franchised distributors
4.3.1 General
There are the following risks to consider (see 4.3.2 to 4.3.7).
Various risk assessment tools exist which the OEM can consider when assessing risks. For
example:
1) ISO 31000 describes risk management and IEC/ISO 31010 describes risk management
techniques together with ISO Guide 73 on risk management vocabulary.
2) The iNEMI project on counterfeit components, i.e. its assessment methodology and metric
development, provides three free internet based anti-counterfeit calculator tools using
spreadsheets (see Annex C).
3) SAE AS6171 includes a thorough risk assessment of the supplier, the product, and the
application with various adjustment factors (see Annex D); it then defines the type of
component anti-counterfeit mitigation testing needed using the SAE AS6171 series of anti-
counterfeit component test methods as well as the SAE Counterfeit Defect Coverage
(CDC) tool.
4) ISO 28000 addresses security management for the supply chain.
This document advises the OEM on the relevant risk assessment tools, test methods and
considerations that are available for use. It allows the OEM options depending on overall risk
(see 4.5.5), when determining which anti-counterfeit risk mitigation tests to use (see Annex B).
This includes the option of using the SAE AS6171 series in full, partially or not at all.
4.3.2 Origin of risks
Counterfeit and fraudulent products have been repeatedly identified by electronic equipment
manufacturers. The purchase, use and reselling of fraudulent components are illegal. A major
difficulty lies in recognizing these fraudulent components, as electronic components can be
counterfeited in many ways. Increased market demand encourages this illicit activity and
counterfeiters continue to improve their manufacturing processes, the disguises they use and
their falsification methods. The equipment manufacturer shall take all necessary measures,
both internally and with regard to its chosen supplier, to ensure that components acquired are
OCM (original component manufacturer) produced, that they have not been modified,
remarked, or previously installed in applications, nor undergone testing, which might impact
their performance or reliability.
Fraud and specifically counterfeiting of electronic components has most often been detected
with components supplied by brokers or non-franchised distributors. Therefore, the
information that follows in this document will refer essentially to this type of supplier which
cannot generally supply traceability back to the OCM. The electronic equipment manufacturer
should remember, however, to use caution when purchasing from any source outside of a
franchised network.
4.3.3 Quality risks
4.3.3.1 General
Quality risks include the following.
4.3.3.2 Lots
There is a high risk of receiving non-homogeneous lots of components, having different
manufacturing dates/codes and produced at various manufacturing sites. A large lot of
obsolete components with a single lot date code (LDC) should be considered suspect by the
purchaser (risks of refurbished/relabeled components for example).

– 16 – IEC 62668-2:2019 © IEC 2019
4.3.3.3 Packaging
The origin and storage conditions of the components proposed by non-franchised distributors
are generally unknown. This presents a risk that the components proposed by a non-
franchised distributor were not stored under manufacturer-recommended conditions. This is
important for components that are sensitive to electrostatic discharges (ESDs) or moisture.
These components can also have been removed from their original packaging and handled
without the proper protective measures.
4.3.3.4 Disassembled or recycled and re-manufactured components
4.3.3.4.1 Disassembled or recycled components
There is a great risk that these components were recovered from board or equipment at the
end of their life cycles or no longer in use. As component removal conditions are strictly
unknown, the integrity, performance and reliability of the components cannot be guaranteed.
4.3.3.4.2 Re-manufactured components
See 3.1.17 for the definition of “re-manufactured component”.
Re-manufactured components are not addressed in this document and it is recommended that
they be avoided for civil avionics use as they can lead to an unacceptable risk of equ
...