IEC 60317-0-1:2008

Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire

This part of IEC 60317 specifies general requirements of enamelled round copper winding wires with or without bonding layer. The main changes with respect to the previous edition are:
- addition of Grade 3 minimum insulation increases and maximum overall diameters for wires up to 0,071 mm nominal conductor diameter in Tables 1 and A.1;
- revisions to minimum increase in bonding layer for wires up to 0,100 mm nominal conductor diameter in Tables 2 and A.2;
- addition of Grade 3 dielectric breakdown requirements for wires up to 0,071 mm nominal conductor diameter; and
- new pin hole test requirement for Grade 3 polyurethane wires.
This standard is to be read in conjunction with the IEC 60851 series. The clause numbers used in this part of IEC 60317 are identical with the respective test numbers of IEC 60851.

Spécifications pour types particuliers de fils de bobinage - Partie 0-1: Exigences générales - Fil de section circulaire en cuivre émaillé

La présente partie de la CEI 60317 spécifie les exigences générales pour les fils de bobinage de section circulaire en cuivre émaillé avec ou sans couche adhérente. Les changements principaux par rapport à l'édition précédente sont:
- ajout, dans les Tableaux 1 et A.1, de l'accroissement minimal dû à l'isolant de Grade 3 et des diamètres extérieurs maximaux pour les fils de diamètre nominal du conducteur jusqu'à 0,071 mm;
- révisions apportées à l'accroissement minimal de la couche adhérente pour les fils de diamètre nominal du conducteur jusqu'à 0,100 mm, dans les Tableaux 2 et A.2;
- ajout des exigences de claquage du diélectrique de Grade 3 pour les fils de diamètre nominal du conducteur jusqu'à 0,071 mm; et
- nouvelle exigence de détection des microfissures en immersion pour les fils émaillés avec polyuréthanne de Grade 3.
Cette norme doit être lue conjointement avec la série CEI 60851. Les numéros d'articles dans la présente partie de la CEI 60317 sont identiques aux numéros d'essais respectifs de la CEI 60851.

General Information

• Status: Published
• Publication Date: 10-Mar-2008
• ICS: 29.060.10 - Wires
• Technical Committee: TC 55 - Winding wires
• Drafting Committee: WG 1 - TC 55/WG 1
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 07-Oct-2013

Relations

• Revises: IEC 60317-0-1:1997/AMD2:2005 - Amendment 2 - Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire
• Effective Date: 05-Sep-2023
• Revises: IEC 60317-0-1:1997 - Specifications for particular types of winding wires - Part 0: General requirements - Section 1: Enamelled round copper wire
• Effective Date: 05-Sep-2023
• Revises: IEC 60317-0-1:1997/AMD1:1999 - Amendment 1 - Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire
• Effective Date: 05-Sep-2023
• Revised: IEC 60317-0-1:2013 - Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60317-0-1
Edition 3.0 2008-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Specifications for particular types of winding wires –
Part 0-1: General requirements – Enamelled round copper wire

Spécifications pour types particuliers de fils de bobinage –
Partie 0-1: Exigences générales – Fil de section circulaire en cuivre émaillé

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IEC 60317-0-1
Edition 3.0 2008-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Specifications for particular types of winding wires –
Part 0-1: General requirements – Enamelled round copper wire

Spécifications pour types particuliers de fils de bobinage –
Partie 0-1: Exigences générales – Fil de section circulaire en cuivre émaillé

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
U
CODE PRIX
ICS 29.060.10 ISBN 2-8318-9636-3

– 2 – 60317-0-1 © IEC:2008
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references.7
3 Terms, definitions and general notes on methods of test and appearance.7
3.1 Terms and definitions .7
3.2 General notes on methods of test .9
3.3 Appearance .9
4 Dimensions.9
4.1 Conductor diameter .9
4.2 Out of roundness of conductor (nominal conductor diameters over 0,063 mm) .12
4.3 Minimum increase in diameter due to the insulation and the bonding layer
(nominal conductor diameters over 0,063 mm).12
4.3.1 Enamelled wires without a bonding layer .12
4.3.2 Enamelled wires with a bonding layer .12
4.4 Maximum overall diameter .12
4.4.1 Enamelled wires without a bonding layer .12
4.4.2 Enamelled wires with a bonding layer .12
5 Electrical resistance.12
6 Elongation .13
7 Springiness.13
7.1 Nominal conductor diameters from 0,080 mm up to and including 1,600 mm .13
7.2 Nominal conductor diameters over 1,600 mm.13
8 Flexibility and adherence .15
8.1 Mandrel winding test (nominal conductor diameters up to and including
1,600 mm) .15
8.2 Stretching test (nominal conductor diameters over 1,600 mm).15
8.3 Jerk test (nominal conductor diameters up to and including 1,000 mm) .15
8.4 Peel test (nominal conductor diameters over 1,000 mm) .15
9 Heat shock .15
9.1 Nominal conductor diameters up to and including 1,600 mm .15
9.2 Nominal conductor diameters over 1,600 mm.16
10 Cut-through .16
11 Resistance to abrasion .16
12 Resistance to solvents .16
13 Breakdown voltage .16
13.1 Nominal conductor diameters up to and including 0,100 mm .17
13.2 Nominal conductor diameters over 0,100 mm up to and including 2,500 mm.17
13.3 Nominal conductor diameters over 2,500 mm.18
14 Continuity of insulation (nominal conductor diameters up to and including
1,600 mm) .19
15 Temperature index.19
16 Resistance to refrigerants .19
17 Solderability.19

60317-0-1 © IEC:2008 – 3 –
18 Heat or solvent bonding .19
19 Dielectric dissipation factor .19
20 Resistance to transformer oil .19
21 Loss of mass .19
23 Pin hole test .20
30 Packaging .20

Annex A (informative) Dimensions for intermediate nominal conductor diameters (R 40) .21
Annex B (informative) Method for the calculation of linear resistance .24
Annex C (informative) Resistance .26

Bibliography .28

Table 1 – Dimensions of enamelled wires (R 20) .10
Table 2 – Dimensions of enamelled wires with a bonding layer (R 20).11
Table 3 – Electrical resistances .12
Table 4 – Elongation .13
Table 5 – Springiness.14
Table 6 – Mandrel winding.15
Table 7 – Heat shock .16
Table 8 – Breakdown voltage .17
Table 9 – Breakdown voltage .18
Table 10 – Breakdown voltage.18
Table 11 – Continuity of insulation.19
Table 12 – Maximum number of pin holes.20
Table A.1 – Dimensions of enamelled wires (R 40) .21
Table A.2 – Dimensions of enamelled wires with a bonding layer (R 40).22
Table B.1 – Ratios .24
Table C.1 – Electrical resistances .26

– 4 – 60317-0-1 © IEC:2008
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SPECIFICATIONS FOR PARTICULAR TYPES
OF WINDING WIRES –
Part 0-1: General requirements –
Enamelled round copper wire
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organiza
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