IEC 62769-4:2015

Field Device Integration (FDI) - Part 4: FDI Packages

IEC 62769-4:2015 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI

L'IEC 62769-4:2015 définit les Paquetages FDI. L'architecture FDI complète est présentée à la Figure 1. Les composants architecturaux relevant du domaine d'application du présent document ont été mis en évidence dans cette figure.

General Information

• Status: Published
• Publication Date: 11-May-2015
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Drafting Committee: WG 7 - TC 65/SC 65E/WG 7
• Current Stage: DELPUB - Deleted Publication
• Start Date: 05-Feb-2021
• Completion Date: 15-Jun-2018

Relations

• Revised: IEC 62769-4:2021 - Field Device Integration (FDI) - Part 4: FDI Packages
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62769-4 ®
Edition 1.0 2015-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field Device Integration (FDI) –
Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –
Partie 4: Paquetages FDI
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IEC 62769-4 ®
Edition 1.0 2015-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field Device Integration (FDI) –

Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –

Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100 ISBN 978-2-8322-2640-7

– 2 – IEC 62769-4:2015  IEC 2015
CONTENTS
FOREWORD . 8
INTRODUCTION . 10
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, abbreviated terms and acronyms . 12
3.1 Terms and definitions . 12
3.2 Abbreviated terms and acronyms . 14
4 FDI Package Model . 14
4.1 Overview. 14
4.2 FDI Package Elements . 15
4.2.1 Package Catalog . 15
4.2.2 Electronic Device Description . 15
4.2.3 User Interface Plug-in . 16
4.2.4 Attachment . 17
4.3 FDI Package Types . 17
4.3.1 FDI Device Package . 17
4.3.2 FDI Communication Package . 18
4.3.3 FDI UIP Package . 19
4.3.4 FDI Profile Package . 19
5 FDI Package implementation . 21
5.1 Packaging technology . 21
5.2 Use of Open Packaging Conventions . 21
5.2.1 Unknown Parts . 21
5.2.2 Invalid Parts . 21
5.2.3 Unknown Relationships . 21
5.2.4 Interleaving. 21
5.2.5 Core Properties . 21
5.2.6 Thumbnails . 21
5.2.7 Digital signatures . 21
5.3 FDI Package Parts . 21
5.3.1 Package Catalog . 21
5.3.2 Electronic Device Description . 23
5.3.3 User Interface Plug-in . 23
5.3.4 Attachments . 26
6 FDI Package Versioning . 28
6.1 Version Scheme . 28
6.2 Versioned Elements . 29
6.3 Version hierarchy . 29
6.4 UIP compatibility . 31
7 Digital Signatures and Registration Certificates . 32
7.1 Signed Elements and Certification documents . 32
7.2 Signing mechanism . 33
7.3 FDI Package Originator, FDI Registration Authority. 33
7.4 FDI Host behavior . 33
Annex A (normative) File name conventions . 35

A.1 Identification . 35
A.2 FDI Package filename convention . 35
Annex B (informative) FDI Package creation . 36
B.1 General . 36
B.2 Tools and components . 36
B.2.1 Overview . 36
B.2.2 FDI Reference Implementation/Common EDD Engine . 36
B.2.3 FDI Package IDE . 36
B.2.4 FDI Device Package Conformance Test Tool . 36
B.3 Development . 36
B.3.1 FDI Package core development . 36
B.3.2 User Interface Plug-in development . 37
B.3.3 FDI Package Attachment development . 37
B.3.4 FDI Package binding and packaging . 38
B.3.5 Conformance Test . 38
Annex C (informative) FDI Package deployment . 39
C.1 General . 39
C.2 Scenarios . 39
C.2.1 FDI Package deployment to PC based client/server systems . 39
C.2.2 FDI Package deployment to an FDI standalone system . 40
Annex D (informative) Example . 42
D.1 General . 42
D.2 Open Packaging Conventions . 42
D.2.1 Overview . 42
D.2.2 Parts. 42
D.2.3 Relationships . 43
D.2.4 OPC core features . 43
D.2.5 OPC additional features . 44
D.3 Creation and handling of FDI Packages . 45
D.4 FDI Device Package example . 45
D.4.1 Overview . 45
D.4.2 User Interface Plug-in . 49
D.4.3 EDD reference to UIP . 51
D.4.4 FDI Registration Certificate . 51
Annex E (normative) Schema . 52
E.1 Target Namespace . 52
E.2 Catalog . 52
E.3 ClassificationIdT . 52
E.4 CommunicationProfileT . 52
E.5 CommunicationRoleT . 53
E.6 CommunicationServerT . 53
E.7 DeviceTypeT . 53
E.8 FdiRegistrationCert . 54
E.9 FdiRegistrationCertT . 54
E.10 HexStringT . 55
E.11 InterfaceT . 55
E.12 ListOfCommunicationProfilesT . 56
E.13 ListOfDeviceImagesT . 56

– 4 – IEC 62769-4:2015  IEC 2015
E.14 ListOfDeviceTypesT . 57
E.15 ListOfDocumentsT . 57
E.16 ListOfInterfacesT . 57
E.17 ListOfLocalizedStringsT . 58
E.18 ListOfProtocolSupportFilesT . 58
E.19 ListOfRegDeviceTypesT . 59
E.20 ListOfRegistrationsT . 59
E.21 ListOfSupportedDeviceRevisionsT . 59
E.22 ListOfSupportedUipsT . 60
E.23 ListOfUipVariantsT . 60
E.24 LocalizedStringT . 60
E.25 PackageT . 61
E.26 PackageTypeT . 62
E.27 PlatformT . 62
E.28 RegDeviceTypeT . 63
E.29 RegistrationT . 63
E.30 RelationshipIdT . 63
E.31 String256T . 64
E.32 SupportedUipT . 64
E.33 UipCatalog . 64
E.34 UipStyleT . 65
E.35 UipT . 65
E.36 UipVariantT . 66
E.37 UuidT . 66
E.38 VersionSupportedT . 67
E.39 VersionT . 67
Annex F (normative) Communication protocol specific profiles . 68
Annex G (informative) FDI Package life-cycle use cases . 69
G.1 New Device Type . 69
G.2 Replacement of Device . 69
G.3 Firmware enhancements . 69
G.4 FDI Package life-cycle polices . 70
G.5 FDI Package update . 70
G.6 FDI Package upgrade . 70
G.7 FDI Package replacement/exchange . 70
G.8 FDI Package uninstallation . 70
Annex H (normative) Health Status Method . 72
H.1 Background. 72
H.2 Device Health Status Model . 72
H.3 Standard EDD Method signature . 72
H.4 Performance considerations . 73
Annex I (normative) Modular devices . 74
I.1 Concept . 74
I.2 EDDL usage profile . 74
I.3 Processing recommendations . 75
I.3.1 Monolithic device with device variants . 75
I.3.2 Remote IOs . 75
I.3.3 How to identify the top level topology element . 75

I.3.4 Packaging details example . 75
Annex J (normative) FDI Communication Packages for FDI Communication Server . 77
J.1 General . 77
J.2 Protocol Support File . 77
J.3 CommunicationProfile definition . 77
J.4 Profile Device . 77
J.5 Protocol version information . 77
J.6 Associating a Package with an FDI Communication Server . 77
J.7 Handling of Catalog elements . 77
J.8 Example. 78
Annex K (normative) FDI Profile for EDDs . 79
K.1 Overview. 79
K.2 Entry Point to Online handling . 79
K.3 Entry Point to Offline handling. 79
K.4 Upload and Download . 79
K.5 Initial Data Set . 79
K.6 Method GetHealthStatus . 79
K.7 Actions . 79
K.7.1 Pre- and Post-Read Actions . 79
K.7.2 Pre- and Post-Write Actions . 80
K.7.3 Refresh Actions on Variables . 80
K.7.4 Actions on BIT_ENUMERATION . 80
K.8 Shared files . 80
Bibliography . 81

Figure 1 – FDI architecture diagram . 11
Figure 2 – FDI Package Model . 14
Figure 3 – Architectural mapping . 15
Figure 4 – User Interface Plug-in Reference Model . 16
Figure 5 – Multiple FDI Packages referencing a common UIP . 17
Figure 6 – FDI Device Package . 18
Figure 7 – FDI Communication Package . 19
Figure 8 – FDI UIP Package . 19
Figure 9 – FDI Profile Package . 20
Figure 10 – Device Function and Parameter sets (type and profile specific) . 20
Figure 11 – Catalog Element . 22
Figure 12 – User Interface Plug-in . 23
Figure 13 – UIP Catalog . 25
Figure 14 – FDI Registration Certificate . 28
Figure 15 – Version hierarchy . 30
Figure 16 – UIP Version Support concept . 32
Figure 17 – FDI Package signing . 33
Figure B.1 – Tools used for FDI Package development . 37
Figure D.1 – Parts and relationships in a package . 42
Figure D.2 – Creating an FDI Package with the content files . 45
Figure D.3 – FDI Device Package example . 46

– 6 – IEC 62769-4:2015  IEC 2015
Figure D.4 – User Interface Plug-in example (fancytrend.uip) . 49
Figure I.1 – Modular device's package . 74

Table 1 – UIP Platform . 17
Table 2 – Package Catalog Part . 22
Table 3 – EDD part . 23
Table 4 – User Interface Plug-in part . 24
Table 5 – UIP Catalog part. 25
Table 6 – UIP Variant part . 26
Table 7 – Image part . 26
Table 8 – Documentation part . 26
Table 9 – Protocol Support File Part . 27
Table 10 – FDI Registration Certificate Part . 27
Table 11 – Versioned Elements . 29
Table 12 – Influence on FDI Package Version . 30
Table A.1 – FDI Package naming convention . 35
Table D.1 – Examples of standard MIME media types that can be used in FDI
Packages . 44
Table D.2 – Examples of FDI-custom MIME media types that can be used in FDI
Packages . 44
Table E.1 – Enumerations of CommunicationRoleT . 53
Table E.2 – Elements of CommunicationServerT . 53
Table E.3 – Elements of DeviceTypeT . 54
Table E.4 – Elements of FdiRegistrationCertT. 55
Table E.5 – Elements of InterfaceT . 55
Table E.6 – Elements of ListOfCommunicationProfilesT . 56
Table E.7 – Elements of ListOfDeviceImagesT . 57
Table E.8 – Elements of ListOfDeviceTypesT . 57
Table E.9 – Elements of ListOfDocumentsT . 57
Table E.10 – Elements of ListOfInterfacesT . 58
Table E.11 – Elements of ListOfLocalizedStringsT . 58
Table E.12 – Elements of ListOfProtocolSupportFilesT . 58
Table E.13 – Elements of ListOfRegDeviceTypesT . 59
Table E.14 – Elements of ListOfRegistrationsT . 59
Table E.15 – Elements of ListOfSupportedDeviceRevisionsT . 60
Table E.16 – Elements of ListOfSupportedUipsT . 60
Table E.17 – Elements of ListOfUipVariantsT. 60
Table E.18 – Attributes of LocalizedStringT . 61
Table E.19 – Elements of PackageT . 61
Table E.20 – Enumerations of PackageTypeT . 62
Table E.21 – Enumerations of PlatformT . 62
Table E.22 – Elements of RegDeviceTypeT . 63
Table E.23 – Elements of RegistrationT . 63
Table E.24 – Elements of SupportedUipT. 64

Table E.25 – Enumerations of UipStyleT . 65
Table E.26 – Elements of UipT . 65
Table E.27 – Elements of UipVariantT . 66
Table F.1 – Communication protocol interest groups (alphabetical order) . 68
Table G.1– Device Replacement Guidelines . 69
Table G.2 – Firmware enhancement guidelines . 70
Table H.1 – Health Status State . 72
Table J.1 – Catalog Mapping . 77
Table J.2 – Handling of Catalog elements . 77

– 8 – IEC 62769-4:2015  IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –

Part 4: FDI Packages
FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
International Standard IEC 62769-4 has been prepared by subcommittee 65E: Devices and
integration in enterprise systems, of IEC technical committee 65: Industrial-process
measurement, control and automation.
The text of this standard is based on the following documents:
CDV Report on voting
65E/347/CDV 65E/424/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62769 series, published under the general title Field Device
Integration (FDI), can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 10 – IEC 62769-4:2015  IEC 2015
INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents concerning
a) method for the supplying and installation of device-specific functionalities, see Patent
Family DE10357276;
b) method and device for accessing a functional module of automation system, see Patent
Family EP2182418;
c) methods and apparatus to reduce memory requirements for process control system
;
software applications, see Patent Family US2013232186
d) extensible device object model, see Patent Family US12/893,680.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holders of these patent rights have assured the IEC that he/she is willing to negotiate
licences either free of charge or under reasonable and non-discriminatory terms and
conditions with applicants throughout the world. In this respect, the statement of the holder of
this patent right is registered with IEC. Information may be obtained from:
a) ABB Research Ltd
Claes Rytoft
Affolterstrasse 4
Zurich, 8050
Switzerland
b) Phoenix Contact GmbH & Co KG
Intellectual Property, Licenses & Standards
Flachsmarktstrasse 8, 32825 Blomberg
Germany
c) Fisher Controls International LLC
John Dilger, Emerson Process Management LLLP
st
301 S. 1 Avenue, Marshaltown, Iowa 50158
USA
d) Rockwell Automation Technologies, Inc.
1 Allen-Bradley Drive
Mayfield Heights, Ohio 44124
USA
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

FIELD DEVICE INTEGRATION (FDI) –

Part 4: FDI Packages
1 Scope
This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated
in Figure 1. The architectural components that are within the scope of this document have
been highlighted in this figure.
User Interface
FDI Package
Description
FDI Package
User
Device Business User
Interface
Definition User Logic Interface User
FDI Client Business Plug-in
Device
Interface Interface
Definition Logic
Description Plug-in
UID
Interpreter
UID
FDI Server
UIP
Information Model Management
Services
Information Model Business Logic
User Interface Processor
OPC UA
Plug-in
Device Object
Business
Device Object
Logic
Device Object
User Interface Services
Platform UI Services
(Drawing, Input Devices)
System Services
OPC UA
Services
OPC UA Client OPC UA
Services
System
Communication
Communication
Hardware
Server
Specified by this part of this International Standard
Data
Store
Specified by other parts of this International Standard
Not specified by this International Standard

Figure 1 – FDI architecture diagram
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device
Description Language (EDDL)
OPC UA
Hosting Services
Device Access
Services
OPC UA Services
Business Logic
Interface
– 12 – IEC 62769-4:2015  IEC 2015
IEC 61804-3 , Function blocks (FB) for process control and Electronic Device Description
Language (EDDL) – Part 3: EDDL syntax and semantics
IEC 61804-4:– , Function blocks (FB) for process control and Electronic device description
language (EDDL) – Part 4: EDD interpretation
IEC 62769-1, Field Device Integration (FDI) – Part 1: Overview
NOTE IEC 62769-1 is technically identical to FDI-2021.
IEC 62769-5, Field Device Integration (FDI) – Part 5: FDI Information Model
NOTE IEC 62769-5 is technically identical to FDI-2025.
IEC 62769-6, Field Devic
...