Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Amendement 1 - Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc : Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force)

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Status
Published
Publication Date
18-Jun-2019
Current Stage
PPUB - Publication issued
Completion Date
19-Jun-2019
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IEC 60068-2-69:2017/AMD1:2019 - Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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IEC 60068-2-69
Edition 3.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
IEC 60068-2-69:2017-03/AMD1:2019-06(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60068-2-69
Edition 3.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-0000-0

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60068-2-69:2017/AMD1:2019
 IEC 2019
FOREWORD

This amendment has been prepared by IEC technical committee 91: Electronics assembly

technology.
The text of this amendment is based on the following documents:
FDIS Report on voting
91/1566/FDIS 91/1580/RVD

Full information on the voting for the approval of this amendment can be found in the report

on voting indicated in the above table.

The committee has decided that the contents of this amendment and the base publication will

remain unchanged until the stability date indicated on the IEC website under

"http://webstore.iec.ch" in the data related to the specific publication. At this date, the

publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________

Figure 2 – Arrangement for the test apparatus (solder globule wetting balance method)

Replace key item 2 for with "Globule support block".
7.1.5 Solder mass for solder globule wetting balance method
Replace the 1 paragraph with the following:

For the solder globule wetting balance method, the solder shall be in the form of pellets or cut

wire (here after referred to as "solder pellet") with a mass of 200 mg ± 10 mg for use on the

4 mm diameter globule support block pin (here after referred to as "pin"), 100 mg ± 10 mg for

use on 3,2 mm diameter pin, 25 mg ± 2,5 mg for use on the 2 mm diameter pin,
5 mg ± 0,5 mg for use on the 1 mm pin. Refer to Table 3.
Replace Table 3 with the following new table:
---------------------- Page: 4 ----------------------
IEC 60068-2-69:2017/AMD1:2019 – 3 –
 IEC 2019
Table 3 – Pin diameter and solder pellet mass
Pin diameter Solder pellet mass
mm mg
1 5 ± 0,5
25 ± 2,5
3,2
100 ± 10
4 200 ± 10
Replace the last sentence of the 2 paragraph with following sentence:
Refer to C.5.1.1 c) regarding the concave aluminium body head.
8.2.3 Solder globule wetting balance procedure
Replace the 2 paragraph with the following:

Select the appropriate pin diameter for the component to be tested. Recommended pin

diameters are given in Table 7.
nd th
Replace the 2 sentence of the 6 paragraph with the following:

High-activated rosin base as specified in 7.2.1 shall be applied to the solder globule.

Table 7 – Recommended solder globule wetting balance test conditions

In the header row, replace "Pin size" with "Pin diameter" and replace "Globule mass" with

"Solder pellet mass".
Figure 4 – Immersion conditions for solder globule method
Replace Figure 4 with the following new figure:
---------------------- Page: 5 ----------------------
– 4 – IEC 60068-2-69:2017/AMD1:2019
 IEC 2019
Key
1 Horizontal line 2 Solder globule
3 Globule support block 4 Iron pin
Figure 4 – Immersion conditions for solder globule method
8.2.4.1 Test specimen
Replace the content with the following:

The test specimen shall be a full board, a section of a board or the test specimen as specified

in the relevant specification. If the relevant specification does not specify the test specimen,

the test specimens shown in Figure 5 may be used.
Figure 5 – Suggested wetting balance test specimens and soldering immersion
Replace Figure 5 with the following new figure:
---------------------- Page: 6 ----------------------
IEC 60068-2-69:2017/AMD1:2019 – 5 –
 IEC 2019
Dimensions in millimetres
NOTE The figures on the right-hand side show the alternative configurations.
Symbol Width Length Pad-to-pad pitch Pad extension beyond the edge
B 1,9 round 4,0 —
C 3,18 4,52 4,0 0,51
[SOURCE: IPC 003c-4-2]
a) Test specimen for solder bath method
Dimensions in millimetres
Symbol Width Length Symbol Width Length Symbol Width Length
D10 0,698 5 0,899 2 D17 1,798 3 3,200 4 D24 0,500 4 1,798 3
D11 0,549 4 0,698 5 D18 2,999 7 2,999 7 D25 0,599 4 2,199 6
D12 0,800 1 1,000 8 D19 0,170 2 1,600 2 D33 1,899 9 3,799 8
D13 1,000 8 1,099 8 D20 0,248 9 1,600 2 D35 0,500 4 round
D14 0,899 2 1,399 5 D21 0,299 7 1,600 2 D36 0,599 4 round
D15 1,300 5 1,498 6 D22 0,350 5 1,798 3
D16 1,600 2 1,798 3 D23 0,399 8 1,798 3
[SOURCE: NPL Report MATCA(A)03, Figures 2 and 3 (TB26)]
b) Test specimen for solder globule method
Figure 5 – Suggested wetting balance test specimens for printed boards
---------------------- Page: 7 ----------------------
– 6 – IEC 60068-2-69:2017/AMD1:2019
 IEC 2019
8.2.4.2 Procedure
Replace the title with "Printed board test procedure".

Insert a new Subclause 8.2.4.2.1 entitled "Procedure for solder bath method" and move the

existing contents of 8.2.4.2 into this new subclause with the following modifications.

st st
Replace the 1 sentence of the 1 paragraph with the following:

The test specimens shall be dipped in the flux to the full depth to be soldered for 5 s to 10 s.

st nd
Replace the 1 sentence of the 2 paragraph with the following:

Hang the specimen on the apparatus so that its lower edge is 10 mm ± 1 mm above the solder

bath to preheat it for 20 s ± 1 s.
st nd rd
Replace the 1 and 2 sentences of the 3 paragraph with the following:

The flux-covered surface shall be immersed only once in the molten solder to a depth of

0,2 mm ± 0,1 mm, and the angle of immersion shall be 20° to 40°, as shown in Figure 6.

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