IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with...
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    • Standard
      403 pages
      English and French language

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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    • Standard
      49 pages
      English and French language

IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need...
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      57 pages
      English and French language

IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

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    • Standard
      45 pages
      English and French language

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass lamin...
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      80 pages
      English and French language

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

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    • Standard
      37 pages
      English and French language

IEC TR 61188-8:2021(E) describes the configuration of part shape data of semiconductor devices and electrical components registered in the CAD library. This document mainly describes the configuration of 2D and 3D parts shape data.

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    • Technical report
      17 pages
      English language

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

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    • Standard
      83 pages
      English and French language

Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.

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    • Standard
      23 pages
      English and French language

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This d...
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      87 pages
      English and French language

IEC 61189-5-504:2020 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues.

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    • Standard
      49 pages
      English and French language

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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    • Technical report
      115 pages
      English language

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
...
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      38 pages
      English and French language

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for ...
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      112 pages
      English and French language

IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

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    • Technical report
      23 pages
      English language

IEC 60068-2-82:2019 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press‑fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds, plastics and the like during the required test...view more

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      68 pages
      English and French language

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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    • Standard
      81 pages
      English and French language

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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    • Technical report
      12 pages
      English language

IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processe...
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      89 pages
      English and French language

IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

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    • Standard
      13 pages
      English and French language

IEC 61249-2-47:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 10...view more

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    • Standard
      22 pages
      English language

IEC 61249-2-45:2018 gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °...view more

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    • Standard
      45 pages
      English and French language
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    • Standard
      22 pages
      English language

IEC 61249-2-46:2018 gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °...view more

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    • Standard
      45 pages
      English and French language
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    • Standard
      22 pages
      English language

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the fo...
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    • Standard
      86 pages
      English and French language

IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the ele...
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      45 pages
      English language

IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with ...
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    • Standard
      19 pages
      English language

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance crit...
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    • Standard
      40 pages
      English and French language

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria...
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      66 pages
      English and French language

IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

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    • Standard
      47 pages
      English and French language

IEC 62090:2017 applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identifica...
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      64 pages
      English and French language

IEC 61188-7:2017 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.
This edition includes the following significant technical changes with respect to the previous edition:
a) Figure 1 has been corrected;
b) the term “rectangle” has generally been replaced by “polygon”;
c) level B has been indica...
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      40 pages
      English and French language

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations a...
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    • Standard
      110 pages
      English and French language

IEC TR 63051:2017(E) describes the main functional requirements for an HDLMath language and compares existing HDLMath languages from the viewpoint of designers. It is intended to accelerate the standardization of a mathematical algorithm design language and to help establish a new and good system modeling and verification environment.

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    • Technical report
      16 pages
      English language

IEC 62739-3:2017 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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    • Standard
      63 pages
      English and French language

IEC 61636:2016(E) is an implementation-independent specification for a software interface to information systems containing data pertinent to the diagnosis and maintenance of complex systems consisting of hardware, software, or any combination thereof. These interfaces will support service definitions for creating application programming interfaces (API) for the access, exchange, and analysis of historical diagnostic and maintenance information. This standard is published as a double logo IEC-IE...view more

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      29 pages
      English language

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is publishe...
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      194 pages
      English language

IEC 61636-1:2016(E) is the definition of an exchange format, utilizing XML, for exchanging data resulting from executing tests of a unit under test (UUT) via a test program in an automatic test environment. This standard is published as a double logo IEC-IEEE standard.

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    • Standard
      85 pages
      English language

IEC 61639-99:2016(E) is a component of the Software Interface for Maintenance Information Collection and Analysis (SIMICA). The SIMICA family of standards provides an implementation-independent software interfaces to information systems containing data pertinent to the diagnosis and maintenance of complex systems consisting of hardware, software, or any combination thereof. This standard defines EXPRESS information models and XML schemas that together define the common information elements suppo...view more

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      60 pages
      English language

IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.

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    • Technical specification
      16 pages
      English language

IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

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    • Standard
      32 pages
      English and French language

IEC 61189-2-719:2016 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

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    • Standard
      40 pages
      English and French language

IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.

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    • Standard
      53 pages
      English and French language

IEC 60068-3-13:2016 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components. This first edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant t...view more

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    • Standard
      55 pages
      English and French language

IEC 61249-2-44:2016 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum.

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    • Standard
      42 pages
      English and French language

IEC 61249-2-43:2016 gives requirements for properties of non-halogenated epoxide cellulose paper reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 100 °C minimum.

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    • Standard
      42 pages
      English and French language

IEC 61672-5:2016(E) defines an exchange format, utilizing extensible markup language (XML), for both the static description of a test adapter by defining the interface between the unit under test (UUT) and the test station, and the specific description of test adapter instance information.

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    • Standard
      18 pages
      English language

IEC 61671-6:2016(E) defines an exchange format, utilizing eXtensible Markup Language (XML), for both the static description of a test station, and the specific description of test station instance information.

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    • Standard
      23 pages
      English language