Distribution automation using distribution line carrier systems - Part 5-4: Lower layer profiles - Multi-carrier modulation (MCM) profile

Is a technical specification describing the requirements of the multicarrier modulation approach which incorporates the services provided by the physical layer entity and the MAC sublayer with the purpose of building up a set of standards for effective communication on MV and LV network for distribution line carrier systems, in the context of IEC 61334-1-1.
This publication is of high relevance for Smart Grid.

General Information

Status
Published
Publication Date
28-Jun-2001
Current Stage
PPUB - Publication issued
Start Date
30-Jun-2001
Completion Date
29-Jun-2001
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Technical specification
IEC TS 61334-5-4:2001 - Distribution automation using distribution line carrier systems - Part 5-4: Lower layer profiles - Multi-carrier modulation (MCM) profile
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37 pages
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TECHNICAL IEC
SPECIFICATION
TS 61334-5-4
Fi rs t edition
2001-06
Di stribu tion automati on using
distribution line carrier ssytems –
Part 5-4:
Lower laeyr pr ofiles –
Multi-carrier modul ati on (M CM ) pr ofile
Reference number
IEC/TS 61334-5-4:2001 (E)

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TECHNICAL IEC
SPECIFICATION
TS 61334-5-4
First edition
2001-06
Distribution automation using
distribution line carrier systems –
Part 5-4:
Lower layer profiles –
Multi-carrier modulation (MCM) profile
 IEC 2001  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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– 2 –TS 613 34-5-4  IEC:2001(E)
CONT ENTS
FOREWORD . .4
1Scope and obj ect.6
2Normative referenc es .6
3Def initions and abbreviations.6
3.1Def initions .6
3.2Abbreviations .7
4Lower layer pr ofile structure.8
4.1Physical layer.8
4.2MAC sublayer .9
5Physical layer spec if ic at ion.9
5.1Modul ation.9
5. 1.1Purpose.9
5. 1.2The multic arrier m odulation (MCM) principle.9
5.2Physical layer data format . 10
5. 2.1Purpose. 10
5. 2.2Transmission method,
...

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