Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

General Information

Status
Published
Publication Date
21-Apr-2021
Current Stage
PPUB - Publication issued
Completion Date
22-Apr-2021
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IEC 62148-21:2021 - Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
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IEC 62148-21
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)
IEC 62148-21:2021-04(en)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
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---------------------- Page: 2 ----------------------
IEC 62148-21
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-9723-0

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 62148-21:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 Terminal position numbering ............................................................................................ 6

5 Code of package nominal dimensions .............................................................................. 6

6 Symbols and drawings ..................................................................................................... 6

7 Dimensions and tolerances .............................................................................................. 8

Bibliography .......................................................................................................................... 13

Figure 1 – S-FBGA and S-FLGA outline .................................................................................. 7

Figure 2 – Mechanical gauge drawing ..................................................................................... 8

Figure 3 – Array of terminal-existence areas ........................................................................... 8

Table 1 – Dimensions and tolerances ..................................................................................... 9

Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E

(informative) ......................................................................................................................... 11

Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA ...................... 12

D E
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IEC 62148-21:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –
Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)
FOREWORD

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IEC 62148-21 has been prepared by subcommittee 86C: Fibre optic systems and active devices,

of IEC technical committee 86: Fibre optics. It is an International Standard.

This second edition cancels and replaces the first edition published in 2019. This edition

constitutes a technical revision.

This edition includes the following significant technical change with respect to the previous

edition: specification of an electric guard band area around the optical terminal area, so as to

allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

---------------------- Page: 5 ----------------------
– 4 – IEC 62148-21:2021 © IEC 2021
The text of this International Standard is based on the following documents:
CDV Report on voting
86C/1684/CDV 86C/1710/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 62148 series, published under the general title Fibre optic active

components and devices – Package and interface standards, can be found on the IEC website.

The committee has decided that the contents of this do
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