IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

Techniques d’assemblage avec appareil(s) intégré(s) - Partie 2-602: Lignes directrices pour un empilement de modules électroniques - Méthode d’évaluation de la connectivité électrique entre modules

L'IEC 62878-2-602:2021 spécifie les exigences et les méthodes d’évaluation de la connectivité électrique. Il s’applique aux empilements de modules électroniques.

General Information

• Status: Published
• Publication Date: 21-Jun-2021
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 6 - TC 91/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 01-Jul-2021
• Completion Date: 22-Jun-2021

Standards Content (Sample)

IEC 62878-2-602 ®
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Device embedding assembly technology –
Part 2-602: Guideline for stacked electronic module – Evaluation method of
inter-module electrical connectivity

Techniques d’assemblage avec appareil(s) intégré(s) –
Partie 2-602: Lignes directrices pour un empilement de modules électroniques –
Méthode d’évaluation de la connectivité électrique entre modules

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IEC 62878-2-602 ®
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Device embedding assembly technology –

Part 2-602: Guideline for stacked electronic module – Evaluation method of

inter-module electrical connectivity

Techniques d’assemblage avec appareil(s) intégré(s) –

Partie 2-602: Lignes directrices pour un empilement de modules électroniques –

Méthode d’évaluation de la connectivité électrique entre modules

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9894-7

– 2 – IEC 62878-2-602:2021  IEC 2021
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 6
5 Test apparatus . 7
6 Test specimen . 8
6.1 General . 8
6.2 Preparation of test specimen. 9
7 Evaluation test . 9
7.1 Test method . 9
7.2 Measurement . 9
7.3 Test procedure . 9
Annex A (informative) Specification of test specimen on outline size and terminal
layout. 11
Annex B (informative) Representative examples of stacking assembly methods . 12

Figure 1 – Stackable electronic module. 6
Figure 2 – Stacked electronic module . 7
Figure 3 – Test apparatus . 8
Figure 4 – Illustration of a typical test specimen . 9
Figure 5 – Input and output interface between test specimen and test apparatus . 10
Figure A.1 – Outline drawing of test specimen . 11

Table A.1 – The final specifications . 11
Table B.1 – Representative examples of stacking assembly methods . 12

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –

Part 2-602: Guideline for stacked electronic module –
Evaluation method of inter-module electrical connectivity

FOREWORD
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International Standard IEC 62878-2-602 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this International Standard is based on the following documents:
CDV Report on voting
91/1663/CDV 91/1720/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 62878-2-602:2021  IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62878 series, published under the general title Device embedding
assembly technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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INTRODUCTION
High-end servers, network systems and smart phones have been driving the electronic
assembly technologies for the last couple of decades. Any applications to e
...