SIST EN ISO 9455-15:2001
(Main)Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:1996)
Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:1996)
Flußmittel zum Weichlöten - Prüfverfahren - Teil 15: Kupferkorrosionsprüfung (ISO 9455-15:1996)
Dieser Teil der ISO 9455 legt eine qualitative Methode fest zur Bestimmung der korrosiven Eigenschaften von Flußmittelrückständen auf einem Kupfersubstrat unter kontrollierbaren Umgebungsbedingungen. Die Prüfung ist anwendbar auf alle Flußmittel der Klasse 1 nach ISO 9454-1.
Flux de brasage tendre - Méthodes d'essai - Partie 15: Essai de corrosion du cuivre (ISO 9455-15:1996)
La présente partie de l'ISO 9455 prescrit une méthode qualitative pour la determination de l'agressivité de résidus de flux sur un substrat de cuivre lorsqu'il est soumis à des conditions d'environnement contrôlées.L'essai est applicable aux flux de type 1 définis dans l'ISO 9454-1
Talila za mehko spajkanje - Preskusne metode - 15. del: Korozijski preskus bakra (ISO 9455-15:1996)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN ISO 9455-15:2001
01-februar-2001
Talila za mehko spajkanje - Preskusne metode - 15. del: Korozijski preskus bakra
(ISO 9455-15:1996)
Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:1996)
Flußmittel zum Weichlöten - Prüfverfahren - Teil 15: Kupferkorrosionsprüfung (ISO 9455-
15:1996)
Flux de brasage tendre - Méthodes d'essai - Partie 15: Essai de corrosion du cuivre (ISO
9455-15:1996)
Ta slovenski standard je istoveten z: EN ISO 9455-15:1999
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
SIST EN ISO 9455-15:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST EN ISO 9455-15:2001
---------------------- Page: 2 ----------------------
SIST EN ISO 9455-15:2001
---------------------- Page: 3 ----------------------
SIST EN ISO 9455-15:2001
---------------------- Page: 4 ----------------------
SIST EN ISO 9455-15:2001
---------------------- Page: 5 ----------------------
SIST EN ISO 9455-15:2001
---------------------- Page: 6 ----------------------
SIST EN ISO 9455-15:2001
INTERNATIONAL IS0
STANDARD 9455-15
First edition
1996-09-01
Soft soldering fluxes -Test methods -
Part 15:
Copper corrosion test
Flux de brasage tendre - Mkthodes d ’essai -
Partie 15: Essai de corrosion du cuivre
Reference number
IS0 9455-l 5: 1996(E)
---------------------- Page: 7 ----------------------
SIST EN ISO 9455-15:2001
IS0 9455=15:1996(E)
Foreword
IS0 (the International Organization for Standardization) is a worldwide fed-
eration of national standards bodies (IS0 member bodies). The work of
preparing International Standards is normally carried out through IS0
technical committees. Each member body interested in a subject for
which a technical committee has been established has the right to be
represented on that committee. International organizations, governmental
and non-governmental, in liaison with ISO, also take part in the work. IS0
collaborates closely with the International Electrotechnical Commission
(IEC) on all matters of electrotechnical standardization.
Draft International Standards adopted by the technical committees are
circulated to the member bodies for voting. Publication as an International
Standard requires approval by at least 75 % of the member bodies casting
a vote.
International Standard IS0 9455-l 5 was prepared by Technical Com-
mittee lSO/TC 44, Welding and allied processes, Subcommittee SC 12,
Soldering and brazing materials.
IS0 9455 consists of the following parts, under the general title Soft
soldering fluxes - Test methods:
Part ? : Determination of non-volatile matter, gravime tric method
- Part 2: Determination of non-volatile matter, ebulliometric method
Part 6: De term&a Con of halide (excluding fluoride) content
Part 8: Determination of zinc con tent
Part 9: Determination of ammonia content
Part ? 0: Flux efficacy tests, solder spread method
- Part ? 1: Solubility of flux residues
- Part 12: Steel tube corrosion test
0 IS0 1996
All rights reserved. Unless otherwise specified, no part of this publication may be
reproduced or utilized in any form or by any means, electronic or mechanical, including
photocopying and microfilm, without permission in writing from the publisher.
International Organization for Standardization
Case Postale 56 l CH-1211 Geneve 20 l Switzerland
Printed in Switzerland
---------------------- Page: 8 ----------------------
SIST EN ISO 9455-15:2001
IS0 9455=15:1996(E)
0 IS0
- Part 73: De termination of flux spattering
- Part 14: Assessment of tackiness of flux residues
- Part 7 5: Copper corrosion test
- Part 16: Flux efficacy tests, wetting balance method
- Part 17: Surface insulation resistance comb test and electrochemical
migration test of flux residues
Annex A of this part of IS0 9455 is for information only.
---------------------- Page: 9 ----------------------
SIST EN ISO 9455-15:2001
This page intentionally left blank
---------------------- Page: 10 ----------------------
SIST EN ISO 9455-15:2001
INTERNATIONAL STANDARD @ IS0 IS0 9455=15:1996(E)
Soft soldering fluxes - Test methods -
Part 15:
Copper corrosion test
IEC 68-2-3:1969, Environmental testing - Part 2:
1 Scope
Tests - Test Ca: Damp heat, steady state.
This part of IS0 9455 specifies a qualitative method
for determination of the corrosive properties of flux
3 Principle
residues on a copper substrate, when subjected to
controlled environmental conditions. The test is appli-
cable to type 1 fluxes, as defined in IS0 9454-l.
A pellet of solder is melted in contact with the flux to
be tested on a test piece of copper sheet. The test
piece is then exposed to a controlled tempera-
ture/humidity environment and the resulting corrosion
2 Normative references
of the copper, if any, is assessed using a low-power
mrcroscope.
The following standards contain provisions which,
through reference in this text, constitute provisions of
this part of IS0 9455. At the time of publication, the
4 Reagents and materials
editions indicated were valid. All standards are subject
to revision, and parties to agreements based on this
part of IS0 9455 are encouraged to investigate the
Use only reagents of recognized analytical quality and
possibility of applying the most recent editions of the
only distilled, or deionized, water.
standards indicated below. Members of IEC and IS0
maintain registers of currently valid International Stan-
4.1 Ammonium peroxodisulfate solution, pre-
dards.
pared as follows.
IS0 1634-l :I 987, Wrought copper and copper alloy
Dissolve 250 g of ammonium peroxodisulfate
plate, sheet and strip - Part I: Technical conditions of
[(NH&&O~] in water and add cautiously 5 ml of sul-
delivery for plate, sheet and strip for general pur-
furic acid (density I,84 g/ml). Mix, cool, dilute to 1 litre
poses.
and mix. This solution is to be freshly prepared before
use.
IS0 9453:1990, Soft solder alloys - Chemical com-
positions and forms.
4.2 Sulfuric acid, 5 % (V/V) solution.
IS0 9454-l : 1990, Soft soldering fluxes - Classifi-
cation and requirements - Part 7 ,. Classification,
Add cautiously, with stirring, 50 ml of sulfuric acid
labeling and packaging.
(density I,84 g/ml) to 400 ml of water and mix. Cool,
dilute to 1 litre and mix well.
IS0 9455-l :I 990, Soft soldering fluxes - Test
methods - Part 7: Determination of non-volatile
4.3 Degreasing solvent, such as acetone or
matter, gravimetric method.
petroleum ether.
IS0 9455-2:1993, Soft soldering fluxes - Test
methods - Part 2: Determination of non-volatile
4.4 0,5 mm thick copper sheet, complying with
matter, ebulliometric method.
IS0 1634-1, grade Cu-ETP, condition HA.
---------------------- Page: 11 ----------------------
SIST EN ISO 9455-15:2001
0 IS0
IS0 9455=15:1996(E)
4.5 Solder wire or pellets, complying with Clamp each of the test pieces, in turn, centrally onto
the 27 mm diameter die of the cupping device (5.3).
IS0 9453, grade S-Sn63Pb37.
Using the 20 mm diameter steel ball, make a 3 mm
deep depression in the centre of each test piece by
forcing the ball into the die (see figure 1). One corner
5 Apparatus
of the test piece may be bent up to facilitate handling
with the tongs (5.6).
Usual laboratory apparatus and, in particular, the fol-
lowing.
Immediately before use, pretreat the test pieces in
5.1 Solder bath, either circular with diameter not accordance with the following sequence of operations
less than 120 mm, or rectangular with dimensions not
a) to h), ensuring that clean tongs (5.6) are used for
less than 100 mm x 75 mm, containing tin-lead solder handling.
having a liquidus less than 200 “C. The depth of the
solder in the bath shall be not less than 40 mm. The
Degre ase the test pieces with a suitable neutral
a)
bath shall be capable of being maintained at a tem-
organ1 c solven t(4.3 .
1
perature of (233 + 5) “C.
5.2 Humidity chamber, conforming to the tempera-
b) Immerse them in sulfuric acid solution (4.2) at
ture and humidity requirements of IEC 68-2-3, test Ca.
(65f 5)"C for 1 min to remove the tarnish film.
5.3 Cupping device (such as an Erichsen cupping
c) Immerse them in the ammonium peroxodisulfate
machine).
solution (4.1) at 20 “C to 25 “C for 1 min to etch
the surface uniformly.
The device shall be fitted with a 27 mm diameter die
and a 20 mm diameter steel ball (see figure I).
under running tap water for a maxi-
Wash them
4
5.4 Drying oven (air circulating), suitable for use at
of 5 s.
(60 k 2) “C .
Immer se them in su lfuric acid solutio n (4.2) at a
d
5.5 Low-power stereomicroscope, capable of x 20
tempe rat ure not grea ter than 2 5 “C for 1 min.
magnification, equipped with quartz-halogen illumi-
nation.
f) Wash them under running water for about 5 s and
5.6 Tongs, or other suitable mechanical device, to
rinse in distilled or deionized water. Immerse im-
lift the test piece from the surface of the molten
mediately in the degreasing solvent (4.3).
solder bath.
Allow the test pieces to dry in clean air.
9)
6 Preparation of tests pieces
h) Use the test pieces immediately or after a maxi-
mum storage period of up to 60 min in a closed
From a sheet of copper 0,5 mm thick (4.4), cut square
test pieces each 50 mm x 50 mm. container.
---------------------- Page: 12 ----------------------
SIST EN ISO 9455-15:2001
IS0 IS0 9455=15:1996(E)
Dimensions in millimetres
Figure 1 - Dimensions of penetrator, die and blank-holder
b) If the flux under test is in liquid form, first deter-
7 Procedure
mine its non-volatile matter content by the use of
the
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.