SIST EN 60539-1:2008
(Main)Directly heated negative temperature coefficient thermistors -- Part 1: Generic specification
Directly heated negative temperature coefficient thermistors -- Part 1: Generic specification
This part of IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
Direkt geheizte temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten - Teil 1: Fachgrundspezifikation
Thermistors à coefficient de température négatif à chauffage direct -- Partie 1: Spécification générique
La CEI 60539-1:2008 s'applique aux thermistances à coefficient de température négatif à chauffage direct, typiquement constitués de matériaux faits d'oxyde de métal de transition dotés de propriétés semi-conductrices. Elle définit les termes normalisés, les procédures d'inspection et les méthodes d'essai utilisés dans les spécifications intermédiaires et particulières des composants électroniques dans le cadre de l'assurance qualité, ainsi qu'à d'autres fins.
Neposredno ogrevani termistorji z negativnim koeficientom - 1. del: Rodovna specifikacija (IEC 60539-1:2008)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60539-1:2008
01-julij-2008
1DGRPHãþD
SIST EN 60539-1:2003
Neposredno ogrevani termistorji z negativnim koeficientom - 1. del: Rodovna
specifikacija (IEC 60539-1:2008)
Directly heated negative temperature coefficient thermistors - Part 1: Generic
specification (IEC 60539-1:2008)
Direkt geheizte temperaturabhängige Widerstände mit negativem
Temperaturkoeffizienten - Teil 1: Fachgrundspezifikation (IEC 60539-1:2008)
Thermistors à coefficient de température négatif à chauffage direct - Partie 1:
Spécification générique (CEI 60539-1:2008)
Ta slovenski standard je istoveten z: EN 60539-1:2008
ICS:
31.040.30 Termistorji Thermistors
SIST EN 60539-1:2008 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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EUROPEAN STANDARD
EN 60539-1
NORME EUROPÉENNE
May 2008
EUROPÄISCHE NORM
ICS 31.040.30 Supersedes EN 60539-1:2002
English version
Directly heated negative temperature coefficient thermistors -
Part 1: Generic specification
(IEC 60539-1:2008)
Thermistors à coefficient de température Direkt geheizte temperaturabhängige
négatif à chauffage direct - Widerstände mit negativem
Partie 1: Spécification générique Temperaturkoeffizienten -
(CEI 60539-1:2008) Teil 1: Fachgrundspezifikation
(IEC 60539-1:2008)
This European Standard was approved by CENELEC on 2008-03-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60539-1:2008 E
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EN 60539-1:2008 - 2 -
Foreword
The text of document 40/1878A/FDIS, future edition 2 of IEC 60539-1, prepared by IEC TC 40,
Capacitors and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 60539-1 on 2008-03-01.
This European Standard supersedes EN 60539-1:2002. It constitutes a minor revision related to tables,
figures and references.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-12-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2011-03-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60539-1:2008 was approved by CENELEC as a European
Standard without any modification.
__________
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- 3 - EN 60539-1:2008
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60027-1 - Letter symbols to be used in electrical EN 60027-1 2006
technology -
Part 1: General
IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)
1) 2)
IEC 60062 - Marking codes for resistors and capacitors EN 60062 2005
+ corr. January 2007
IEC 60068-1 1988 Environmental testing -
+ A1 1992 Part 1: General and guidance EN 60068-1 1994
IEC 60068-2-1 2007 Environmental testing - EN 60068-2-1 2007
Part 2-1: Tests - Test A: Cold
IEC 60068-2-2 2007 Environmental testing - EN 60068-2-2 2007
Part 2-2: Tests - Test B: Dry heat
3)
IEC 60068-2-6 1995 Environmental testing - EN 60068-2-6 1995
Part 2-6: Tests - Test Fc: Vibration
(sinusoidal)
IEC 60068-2-11 1981 Environmental testing - EN 60068-2-11 1999
Part 2-11: Tests - Test Ka: Salt mist
IEC 60068-2-14 1984 Environmental testing -
+ A1 1986 Part 2-14: Tests - Test N: Change of EN 60068-2-14 1999
temperature
IEC 60068-2-17 1994 Environmental testing - EN 60068-2-17 1994
Part 2-17: Tests - Test Q: Sealing
IEC 60068-2-20 1979 Environmental testing -
+ A2 1987 Part 2-20: Tests - Test T: Soldering HD 323.2.20 S3 1988
IEC 60068-2-21 2006 Environmental testing - EN 60068-2-21 2006
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27 1987 Basic environmental testing procedures - EN 60068-2-27 1993
Part 2-27: Tests - Test Ea and guidance:
Shock
IEC 60068-2-29 1987 Environmental testing - EN 60068-2-29 1993
Part 2-29: Tests - Test Eb and guidance:
Bump
IEC 60068-2-32 1975 Environmental testing -
+ A2 1990 Part 2-32: Tests - Test Ed: Free fall EN 60068-2-32 1993
1)
Undated reference.
2)
Valid edition at date of issue.
3)
EN 60068-2-6 is superseded by EN 60068-2-6:2008, which is based on IEC 60068-2-6:2007.
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EN 60539-1:2008 - 4 -
Publication Year Title EN/HD Year
IEC 60068-2-38 1974 Environmental testing - EN 60068-2-38 1999
Part 2-38: Tests - Test Z/AD: Composite
temperature/humidity cyclic test
IEC 60068-2-45 1980 Environmental testing - EN 60068-2-45 1992
A1 1993 Part 2-45: Tests - Test XA and guidance: A1 1993
Immersion in cleaning solvents
IEC 60068-2-52 1996 Environmental testing - EN 60068-2-52 1996
Part 2-52: Tests - Test Kb: Salt mist, cyclic
(sodium chloride solution)
IEC 60068-2-54 2006 Environmental testing - EN 60068-2-54 2006
Part 2-54: Tests - Test Ta: Solderability
testing of electronic components by the
wetting balance method
IEC 60068-2-58 2004 Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-69 2007 Environmental testing - EN 60068-2-69 2007
Part 2-69: Tests - Test Te: Solderability
testing of electronic components for surface
mounting devices (SMD) by the wetting
balance method
IEC 60068-2-78 2001 Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
1)
IEC 60294 - Measurement of the dimensions of a - -
cylindrical component having two axial
terminations
1)
IEC 60410 - Sampling plans and procedures for inspection - -
by attributes
IEC 60617 Data- Graphical symbols for diagrams - -
base
1)
IEC 60717 - Method for the determination of the space - -
required by capacitors and resistors with
unidirectional terminations
1) 2)
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
1)
IEC QC 001002-3 - IEC Quality Assessment System - -
for Electronic Components (IECQ) - Rules of
Procedure -
Part 3: Approval procedures
1)
ISO 1000 - SI units and recommendations for the use of - -
their multiples and of certain other units
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IEC 60539-1
Edition 2.0 2008-02
INTERNATIONAL
STANDARD
QC 430 000
Directly heated negative temperature coefficient thermistors –
Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.040.30 ISBN 2-8318-9584-7
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– 2 – 60539-1 © IEC:2008(E)
CONTENTS
FOREWORD.4
1 General .6
1.1 Scope.6
1.2 Normative references .6
2 Technical data.8
2.1 Units, symbols and terminology .8
2.2 Terms and definitions .8
2.3 Preferred values.16
2.4 Marking .16
3 Quality assessment procedures.17
3.1 General .17
3.2 Primary stage of manufacture.17
3.3 Structurally similar components.17
3.4 Qualification approval procedures .18
3.5 Quality conformance inspection.18
3.6 Certified test records of released lots .18
3.7 Delayed delivery.19
3.8 Release for delivery under qualification approval before the completion of
group B tests.19
3.9 Alternative test methods .19
3.10 Unchecked parameters.19
4 Test and measurement procedures.19
4.1 General .19
4.2 Standard atmospheric conditions for testing .19
4.3 Drying and recovery .20
4.4 Mounting (for surface mount thermistors only) .20
4.5 Visual examination and check of dimensions.21
4.6 Zero-power resistance.22
4.7 B-value or resistance ratio.22
4.8 Insulation resistance (for insulated types only) .23
4.9 Voltage proof (for insulated types only) .26
4.10 Resistance/temperature characteristic.26
4.11 Dissipation factor (δ) .26
4.12 Thermal time constant by ambient temperature change (τ ) .28
a
4.13 Thermal time constant by cooling after self-heating (τ ) .28
c
4.14 Robustness of terminations (not applicable to surface mount thermistors) .29
4.15 Resistance to soldering heat .30
4.16 Solderability .31
4.17 Rapid change of temperature .32
4.18 Vibration.32
4.19 Bump .33
4.20 Shock.33
4.21 Free fall (if specified in the detail specification) .33
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60539-1 © IEC:2008(E) – 3 –
4.22 Thermal shock (if specified in the detail specification) .34
4.23 Cold (if required by the sectional specification) .34
4.24 Dry heat (if required by the sectional specification) .34
4.25 Damp heat, steady state.35
4.26 Endurance.35
4.27 Shear (adhesion) test .40
4.28 Substrate bending test .40
4.29 Component solvent resistance.41
4.30 Solvent resistance of marking.41
4.31 Salt mist (if required by the sectional specification) .41
4.32 Sealing (if required by the sectional specification) .41
4.33 Composite temperature/humidity cycle (if required by the sectional
specification).41
Annex A (normative) Interpretation of sampling plans and procedures as described in
IEC 60410 for use within the IEC quality assessment system for electronic
components (IECQ) .43
Annex B (normative) Rules for the preparation of detail specifications for capacitors
and resistors for electronic equipment .44
Annex C (informative) Typical examples of mountings for measurements of directly
heated thermistors .45
Figure 1 – Typical resistance-temperature characteristic for NTC thermistors .10
Figure 2 – Decreased power dissipation curve .12
Figure 3 – Maximum current derating.14
Figure 4 – Zero-power resistance measuring basic circuit .22
Figure 5 – Test method 1 .23
Figure 6 – Test method 2 .24
Figure 7 – Test method 2 .24
Figure 8 – Test method 3 .25
Figure 9 – Test method 4 .25
Figure 10 – Example of test chamber.27
Figure 11 – Dissipation factor measuring circuit.27
Figure 12 – Thermal time constant measuring circuit .29
Figure 13 – Endurance at room temperature with I evaluating circuit.36
max.25
Figure 14 – Maximum permissible capacitance test circuit (method 1) .39
Figure 15 – Maximum permissible capacitance test circuit (method 2) .39
Figure C.1 – Mounting for measurements of surface mount thermistors .45
Table 1 – Upper and lower category temperatures and duration of the damp heat test.16
Table 2 – Tensile force .30
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– 4 – 60539-1 © IEC:2008(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT
THERMISTORS –
Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60539-1 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This second edition cancels and replaces the first edition published in 2002 and constitutes a
minor revision related to tables, figures and references.
The text of this standard is based on the following documents:
FDIS Report on voting
40/1878A/FDIS 40/1895/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
---------------------- Page: 9 ----------------------
60539-1 © IEC:2008(E) – 5 –
The QC number that appears on the front cover of the publication is the specification number
in the IEC Quality Assessment System for Electronic Components (IECQ).
IEC 60539 consists of the following parts, under the general title Directly heated negative
temperature coefficient thermistors:
Part 1: Generic specification
Part 2: Sectional specification: Surface mount negative temperature coefficient thermistors
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
---------------------- Page: 10 ----------------------
– 6 – 60539-1 © IEC:2008(E)
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT
THERMISTORS –
Part 1: Generic specification
1 General
1.1 Scope
This part of IEC 60539 is applicable to directly heated negative temperature coefficient
thermistors, typically made from transition metal oxide materials with semiconducting
properties.
It establishes standard terms, inspection procedures and methods of test for use in sectional
and detail specifications of electronic components for quality assessment or any other
purpose.
1.2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60027-1, Letter symbols to be used in electrical technology – Part 1: General
IEC 60050, International Electrotechnical Vocabulary (IEV)
IEC 60062, Marking codes for resistors and capacitors
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992)
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Tests A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Tests B: Dry heat
IEC 60068-2-6:1995, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-11:1981, Environmental testing – Part 2-11: Tests – Test Ka: Salt mist
IEC 60068-2-14:1984, Environmental testing – Part 2-14: Tests – Test N: Change of
temperature
Amendment 1 (1986)
IEC 60068-2-17:1994, Environmental testing – Part 2-17: Tests – Test Q: Sealing
IEC 60068-2-20:1979, Environmental testing – Part 2-20: Tests – Test T: Soldering
Amendment 2 (1987)
IEC 60068-2-21:2006, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
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60539-1 © IEC:2008(E) – 7 –
IEC 60068-2-27:1987, Environmental testing – Part 2-27: Tests – Test Ea and guidance:
Shock
IEC 60068-2-29:1987, Environmental testing – Part 2-29: Tests – Test Eb and guidance:
Bump
IEC 60068-2-32:1975, Environmental testing – Part 2-32: Tests – Test Ed: Free fall
Amendment 2 (1990)
IEC 60068-2-38:1974, Environmental testing – Part 2-38: Tests – Test Z/AD: Composite
temperature/humidity cyclic test
IEC 60068-2-45:1980, Environmental testing – Part 2-45: Tests – Test XA and guidance:
Immersion in cleaning solvents
Amendment 1 (1993)
IEC 60068-2-52:1996, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic
(sodium chloride solution)
IEC 60068-2-54:2006, Environmental testing – Part 2-54: Tests – Test Ta: Solderability
testing of electronic components by the wetting balance method
IEC 60068-2-58:2004, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-69:2007, Environmental testing – Part 2-69: Tests – Test Te: Solderability
testing of electronic components for surface mounting devices (SMD) by the wetting balance
method
IEC 60068-2-78:2001, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat,
steady state
IEC 60294, Measurement of the dimensions of a cylindrical component having two axial
terminations
IEC 60410, Sampling plans and procedures for inspection by attributes
IEC 60617, Graphical symbols for diagrams
IEC 60717, Method for the determination of the space required by capacitors and resistors
with unidirectional terminations
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad
IECQ 001002-3, IEC Quality Assessment System for Electronic Components (IECQ) – Rules
of procedure – Part 3: Approval procedures
ISO 1000, SI units and recommendations for the use of their multiples and of certain other
units
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– 8 – 60539-1 © IEC:2008(E)
2 Technical data
2.1 Units, symbols and terminology
Units, graphical symbols, letter symbols and terminology should, whenever possible, be taken
from the following publications:
– IEC 60027-1
– IEC 60050
– IEC 60617
– ISO 1000
When further items are required, they should be derived in accordance with the principles of
the publications listed above.
2.2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
2.2.1
type
products having similar design features manufactured by the same techniques and falling
within the manufacturer's usual range of ratings for these products
NOTE 1 Mounting accessories are ignored, provided they have no significant effect on the test results.
NOTE 2 Ratings cover the combination of
– electrical ratings;
– sizes;
– climatic category.
NOTE 3 The limits of the range of ratings should be given in the detail specification.
2.2.2
style
variation within a type having specific nominal dimensions and characteristics
2.2.3
thermistor
thermally sensitive semiconducting resistor whose primary function is to exhibit an important
change in electrical resistance with a change in body temperature
2.2.4
negative temperature coefficient thermistor (NTC)
thermistor in which the resistance decreases with increasing temperature
2.2.5
directly heated negative temperature coefficient thermistor
thermistor which obtains its resistance variation by the changes of physical conditions such as
current through it, ambient temperature, humidity, wind velocity, gas, etc.
2.2.6
indirectly heated negative temperature coefficient thermistor
thermistor which obtains its resistance variation primarily by the change of temperature of the
thermistor, due to the change of a current through a separate heater which is in close contact
with, but electrically insulated from, the thermistor element
NOTE The temperature of the thermistor can also be changed by the changes of physical conditions such as
current through the thermistor element itself, ambient temperature, humidity, wind velocity, gas, etc
...
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