SIST EN 62610-4:2014

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets

This part of IEC 62610 specifies the test setup and test parameters for water supplied heat exchangers within single electronic cabinet configurations. The tests are focused on cabinets for the installation of high power dissipation electronic equipment. The cabinets concerned are from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The purpose of this standard is to provide comparable data for the cooling performance of cabinets according to defined test setups and cooling parameters.

Mechanische Bauweisen für elektronische Einrichtungen - Wärmemanagement - Teil 4: Kühlleistungsprüfungen für Wasser-Wärmetauscher in Elektronikschränken

Structures mécaniques pour équipements électroniques gestion thermique pour les armoires conformes aux séries CEI 60297 et CEI 60917 - Partie 4: Essais de performances de refroidissement pour les échangeurs de chaleur alimentés par de l'eau dans des baies

La CEI 62610-4:2013 spécifie les montages d'essai et les paramètres d'essai pour des échangeurs de chaleur alimentés par de l'eau dans des configurations à une seule baie électronique. Les essais portent sur des baies destinées à l'installation d'équipements électroniques à forte dissipation d'énergie. Les baies concernées sont conformes aux séries CEI 60297 (19 pouces) et CEI 60917 (25 mm). La présente norme a pour objectif de fournir des données comparables pour les performances de refroidissement des baies conformément aux montages d'essai et aux paramètres d'essai définis. Mots-clés: baies électroniques, refroidissement, échangeurs de chaleur alimentés par de l'eau

Mehanske strukture elektronske opreme - Obravnava toplotnih lastnosti omaric v skladu s serijama IEC 60297 in IEC 60917 - 4. del: Preskušanje hladilnih zmogljivosti vodnih toplotnih izmenjevalnikov v elektronskih omaricah

General Information

• Status: Published
• Publication Date: 20-Mar-2014
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 27-Feb-2014
• Due Date: 04-May-2014
• Completion Date: 21-Mar-2014
• Ref Project: EN 62610-4:2013 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62610-4:2014
01-april-2014
Mehanske strukture elektronske opreme - Obravnava toplotnih lastnosti omaric v
skladu s serijama IEC 60297 in IEC 60917 - 4. del: Preskušanje hladilnih
zmogljivosti vodnih toplotnih izmenjevalnikov v elektronskih omaricah
Mechanical structures for electronic equipment - Thermal management for cabinets in
accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for
water supplied heat exchangers in electronic cabinets
Mechanische Bauweisen für elektronische Einrichtungen - Wärmemanagement - Teil 4:
Kühlleistungsprüfungen für Wasser-Wärmetauscher in Elektronikschränken
Structures mécaniques pour équipements électroniques gestion thermique pour les
armoires conformes aux séries CEI 60297 et CEI 60917 - Partie 4: Essais de
performances de refroidissement pour les échangeurs de chaleur alimentés par de l'eau
dans des baies
Ta slovenski standard je istoveten z: EN 62610-4:2013
ICS:
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 62610-4:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62610-4:2014

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SIST EN 62610-4:2014

EUROPEAN STANDARD
EN 62610-4

NORME EUROPÉENNE
November 2013
EUROPÄISCHE NORM

ICS 31.240


English version


Mechanical structures for electronic equipment -
Thermal management for cabinets in accordance with IEC 60297 and IEC
60917 series -
Part 4: Cooling performance tests for water supplied heat exchangers in
electronic cabinets
(IEC 62610-4:2013)


Structures mécaniques pour équipements Mechanische Bauweisen für elektronische
électroniques – Gestion thermique pour Einrichtungen -
les armoires conformes aux séries CEI Wärmemanagement für Schränke nach
60297 et CEI 60917 – Partie 4: Essais de den Reihen IEC 60297 und IEC 60917 -
performances de refroidissement pour les Teil 4: Kühlleistungsprüfungen für
échangeurs de chaleur alimentés par de Wasser-Wärmetauscher in
l'eau dans des baies électroniques Elektronikschränken
(CEI 62610-4:2013) (IEC 62610-4:2013)



This European Standard was approved by CENELEC on 2013-09-19. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62610-4:2013 E

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SIST EN 62610-4:2014
EN 62610-4:2013 - 2 -

Foreword
The text of document 48D/542/FDIS, future edition 1 of IEC 62610-4, prepared by SC 48D, "Mechanical
structures for electronic equipment", of IEC TC 48, "Electromechanical components and mechanical
structures for electronic equipment" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 62610-4:2013.
The following dates are fixed:
(dop) 2014-06-19
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-09-19
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 62610-4:2013 was approved by CENELEC as a European
Standard without any modification.

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SIST EN 62610-4:2014
- 3 - EN 62610-4:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year
IEC 60297 Series Mechanical structures for electronic EN 60297 Series
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series


IEC 60917 Series Modular order for the development of EN 60917 Series
mechanical structures for electronic
equipment practices

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SIST EN 62610-4:2014

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SIST EN 62610-4:2014



IEC 62610-4

®


Edition 1.0 2013-08




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Mechanical structures for electronic equipment – Thermal management for

cabinets in accordance with IEC 60297 and IEC 60917 series –

Part 4: Cooling performance tests for water supplied heat exchangers in


electronic cabinets



Structures mécaniques pour équipements électroniques – Gestion thermique


pour les armoires conformes aux séries CEI 60297 et CEI 60917 –

Partie 4: Essais de performances de refroidissement pour les échangeurs de

chaleur alimentés par de l'eau dans des baies électroniques










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX R


ICS 31.240 ISBN 978-2-8322-1037-6



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62610-4:2014
– 2 – 62610-4 © IEC:2013
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope and object . 6
2 Normative references . 6
3 Terms and definitions, symbols and units . 6
3.1 Terms and definitions . 6
3.2 Symbols and units . 7
4 Performance test for the heat exchanger . 8
4.1 General . 8
4.2 Test setup . 9
4.2.1 Test room . 9
4.2.2 Simulating the equipment heat load in the test sample. 9
4.2.3 Chilled-water flow rate and temperatures . 10
4.2.4 Measurement of the air temperature . 10
4.2.5 Temperature difference between chilled water supply and equipment
air inlet temperature . 11
4.3 Assessment of the heat exchanger performance . 11
4.3.1 Determination of the cooling capacity by means of simplified tests . 11
4.3.2 Determination of the cooling capacity by way of an extended test . 12
4.3.3 Complete identification of the cooling capacity. 14
4.4 Electrical power consumption . 16
4.5 Water circuit pressure resistance . 16
Annex A (normative) Test conditions . 17
Annex B (normative) Test results . 18

Figure 1 – Principle of the heat exchanger performance test . 9
Figure 2 – Test setup of simplified tests . 12
Figure 3 – Test setup of extended tests . 14
Figure 4 – Test setup, test for complete identification of the cooling capacity . 15
Figure 5 – Diagram of electrical power consumption versus cooling capacity . 16
Figure 6 – Diagram of water pressure resistance versus water flow rate . 16
Figure B.1 – System cooling capacity and water flow rate . 19

Table B.1 – Test result recording template . 18
Table B.2 – Test for closed air loop air to water heat exchanger for high density
cooling systems for IT equipment and server cooling . 19

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SIST EN 62610-4:2014
62610-4 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________

MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 4: Cooling performance tests for water supplied
heat exchangers in electronic cabinets


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62610-4 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48D/542/FDIS 48D/545/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62610-4:2014
– 4 – 62610-4 © IEC:2013
A list of all parts of IEC 62610 series, under the general title Mechanical structures for
electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and
IEC 60917 series, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 62610-4:2014
62610-4 © IEC:2013 – 5 –
INTRODUCTION
Electronic cabinets of the IEC 60297 and IEC 60917 series are used for the housing of
electronic devices in many different fields of application. A wide field of application is
represented by installations of communication networks with electronic devices in information
technology (IT) environments. The classic way is to install rows of cabinets into defined foot
print patterns and interconnect them via cables managed from overhead cable trays or raised
floor cable management. So far, cooling has been facilitated by equipping the entire IT room
with air conditioning in order to provide for air flow and air temperatures required for the safe
operation of the electronic devices. With the growing heat load in data centers, this form of
cooling has become more and more inefficient. Thermal problems with respect to high-
performance electronic devices have become more difficult to solve. The environmental
aspect is gaining crucial importance forcing us to cut down on wasting resources and to
reduce CO emissions.
2
Alternatives to the air conditioning of rooms need to be looked at more closely. Under the
aspect of increasing cooling efficiency, there are some major concepts, two cases serve as
examples here:
Case 1. The equipped group of cabinets, with dedicated temperature control.
This method is the cold aisles / hot aisles arrangement of a smaller number of cabinets,
typically four to twelve. Its advantage over the air conditioning of rooms is the smaller air
volume which allows a focused heat management with optimised dimensioning of power
consumption for the cooling devices and increased temperatures in the warm zones of the
room. In such cases, efficiency can be increased by adopting exhaust heat recovery for room
heating in cold periods. Due to the improved energy efficiency contained aisles are becoming
more and more popular.
Case 2. Single cabinets with water-air heat exchangers.
This method is used for cabinets accommodating high-performance/heat dissipating electronic
equipment, typically servers and mainframe computers. Its advantage over the room air
conditioning or cold aisles consists in the high degree of constant air inlet temperature for
sensitive electronic devices. Closed air circulation within a cabinet allows a very precise
temperature control. The power consumption aspect may be similar to that of the cold aisle,
but the temperature control aspect is more important and favourable to a longer life-cycle of
costly equipment.
This standard has been created for case 2: Cooling performance tests for water-supplied heat
exchangers in single electronic cabinet configurations. The parameters with reference to the
described test sample are shown in diagrams which may be useful to provide for a
standardized calculation method for specific cabinet dimensions and heat exchanger cooling
requirements. The typical required cooling capacity for such cabinets is normally higher than
12 kW. The described test methods of this standard address a cooling capacity of more than
12 kW. However, since IT equipment varies the heat load to a cabinet the test also considers
values below 12 kW for partial heat load.

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SIST EN 62610-4:2014
– 6 – 62610-4 © IEC:2013
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 4: Cooling performance tests for water supplied
heat exchangers in electronic cabinets



1 Scope and object
This part of IEC 62610 specifies the test setup and test parameters for water supplied heat
exchangers within single electronic cabinet configurations. The tests are focused on cabinets
for the installation of high power dissipation electronic equipment. The cabinets concerned
are from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The purpose of this standard
is to provide comparable data for the cooling performance of cabinets according to defined
test setups and cooling parameters.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60297 (all parts), Dimensions of mechanical structures of the 482,6 mm (19 in) series
IEC 60917 (all parts), Modular order for the development of mechanical structures for
electronic equipment practices
3 Terms and definitions, symbols and units
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
cooling capacity

Q

removed heat load given by the electronic equipment mounted inside the electronic cabinet
[kW]
3.1.2
absolute humidity
mass content of water (gram of water) per defined mass of dry air (kilogram of air) [g/kg] g of
water per kg dry air
3.1.3
dummy
device to generate heat load similar to most common electronic devices in information
technology: horizontal air flow with air intake at the front and air outlet at the rear side of the
equipment.

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SIST EN 62610-4:2014
62610-4 © IEC:2013 – 7 –
Note 1 to entry: The air flow orientation is defined in IEC 60297 (19 in) and IEC 60917 (25 mm) standard series
cabinet design.
3.1.4
sensible cooling
cooling capacity to provide air temperature change only. The absolute humidity of air in
sensible cooling process is unchanged.
3.1.5
simplified test
this test method does not consider the influence of the heat transfer through the walls of the
electronic cabinet nor the heat transfer by leaking air in and out of the housing of the
electronic equipment
3.1.6
extended test
this test method does not consider the heat transfer by leaking air in and out of the housing of
the electronic equipment
3.2 Symbols and units
P electrical power consumption [kW]
el
T Temperature [°C]

Q heat flow of the cooling air [kW]
air
v air velocity (test result) [m/s]
air
2
A air cross-section [m ]
air
3
ρ air density (related to 101,325 kPa air pressure) [kg/m ]
air
c specific heat capacity of air [kJ/kgK]
p,air
δT temperature difference [K]
δT temperature difference of the chilled water between supply and return [K]
CW
δT temperature difference of the cooling air between equipment air inlet and air outlet
air
[K]
f
3
factor based on specific heat capacity of water [l/s, l/min, m /h]

Q heat flow in chilled water [kW]
CW
 3
V chilled-water flow [l/s, l/min, m /h]
CW

Q
cooling capacity [kW]

Q
cooling capacity of the IT equipment [kW]
S

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SIST EN 62610-4:2014
– 8 – 62610-4 © IEC:2013
4 Performance test for the heat exchanger
4.1 General
For testing the heat exchanger performance, the following parameters shall be applied:
The heat load of the dummy equipment shall be unchanged during the test. The heat
dissipation of the heat load dummies shall be measured during the test and be recorded in the
test report as the main result of the test according to Table B.1. The determination of the heat
dissipation of the heat load shall be measured in accordance to the electrical power
consumption.
During all measurements all control function and algorithm of the tested unit shall be disabled.
The air temperature in front of the electronic equipment (between its front panel and door)
shall be in the range defined in Annex A, with a max. tolerance of ± 1 K at the different
temperature sensors. The temperature difference between air inlet and air outlet of the
dummy heat loads shall be equal or less than the temperature difference defined in Annex A.
The measured temperature difference during the test shall be recorded in the test report. The
temperature difference of the air temperature in the test report shall be determined with an
accuracy of 0,2 K.
The maximum temperature difference between the chilled water supply temperature and air
inlet temperature of the equipment dummies shall be equal or less than the temperature
difference defined in Annex A. This temperature difference during the test shall be measured
as average after all temperatures are stabilized. The measured temperature difference as test
result shall be recorded as outlined in Table B.1. During the test the chilled water supply
temperature can fluctuate within the range of 1 K. The temperature difference of the air
temperature in the test report shall be determined with an accuracy of
0,1 K. The temperature difference of the water temperature in the test report shall be
recorded within an accuracy of 0,1 K. See Table B.1.
During the test the pressure resistance of the air water heat exchanger between chilled water
supply and chilled water return of the chilled water system shall not exceed the pressure
difference defined in Annex A. This pressure resistance shall include all hydraulic components
for the heat exchanger operation e.g. modulating valves, balancing valves, connectors. The
pressure difference and the relation to the chilled water flow rate shall be recorded in the
table and the chart in according Annex B.
The water temperature increase between heat exchanger in and out is a result of the test and
shall be recorded in the test report in the table according to Annex B. The chilled water flow
rate shall be recorded in the test report as a test result according to the table and chart in
Annex B. The flow rate shall be selected to a value such that the maximum pressure
difference according to Annex A is not exceeded. The flow rate shall be measured within a
tolerance of ± 2 %. The measured pressure difference shall be recorded in the test report
according to the table and chart in Annex B.
The air temperature of the test chamber shall be in the same range as the temperature inside
the cabinet, in front of the electronic equipment.
For the determination of the test changing humidity conditions of the test room are not
recognized. The cooling capacity is considered as 100 % sensible cooling. That means
according the test room conditions described in 4.2.1 and the chilled water feed temperature
tolerance of ± 1 K the chilled water feed temperature shall be higher than 12 °C. See
Figure 1.

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SIST EN 62610-4:2014
62610-4 © IEC:2013 – 9 –
Chilled water return
temperature
Temperature

difference of
chilled water
Chilled
water
Cooling Supply air
Chilled water feed
capacity
to cool equipment
temperature
[kW]
temperature
Cooling
air
Temperature
difference of
cooling air
Air intake
temperature
IEC  2110/13


Figure 1 – Principle of the heat exchanger performance test
4.2 Test setup
4.2.1 Test room
The test sample (a closed cabinet for electronic equipment with a built-in air-water heat
exchanger) is installed in an environment of precisely defined temperature and humidity,
called a test room. This test room is expected to maintain the test conditions during testing
within the required test conditions.
• air temperature of the test room equal to air inlet temperature of the equipment dummy
[°C ± 2 K] see Annex A
• absolute humidity 8 g ± 0,5 g water per kg dry air (dew-point temperature 10,5 °C).
For the course of the test it is assumed that the absolute humidity inside the test room and
inside the sample will be balanced with each other.
The test is to be performed at the standard air pressure of 101,325 kPa. Should that prove
impossible, all airflows are to be recalculated in accordance with the air density altered in
dependence on air pressure. Critical for the test is the air-mass flow resulting at an air
pressure of 101,325 kPa. The enthalpy of the air needs to be calculated to the standard
atmospheric pressure conditions.
4.2.2 Simulating the equipment heat load in the test sample
The test sample (cabinet) is to be populated with simulated electronic equipment, such as a
server. The simulated electronic equipment is also referred to as “dummies”. The dummies
are installed to the mounting points as provided for by the cabinets according to IEC 60297
and IEC 60917. The air-intake is at the front panel of the dummy and exits at the rear of the
dummy. The dummies are designed in such a manner that a change in heat loss can be
measured. The mechanical design of the heat load shall avoid any outgoing heat radiation
(leaks).
The electrical power consumption by the dummies is to be recorded by measurement. The
electrical power consumption shall be recorded in the test report according the table in

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SIST EN 62610-4:2014
– 10 – 62610-4 © IEC:2013
Annex B. It is assumed that the sample is charged by the entire electrical power in the form of
heat load.
The airflow generated by the dummies shall be adjustable. During the test, the airflow is to be
selected in such a way that the air pressure rise between the front and the rear of the
dummies is less than the limit defined at Annex A. The dummy installation shall provide
separation of the cold air zone and the warm air zone. The pressure difference between the
front and the rear of the heat exchanger shall be recorded in the test report according to the
table in Annex B.
4.2.3 Chilled-water flow rate and temperatures
During the test, the temperatures and the temperature diffe
...