oSIST prEN IEC 60115-2:2024

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

This part of IEC 60115 is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.  
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating.
These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole
technique.  
The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.

Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 2: Rahmenspezifikation: Niedrigbelastbare Schichtwiderstände mit Drahtanschlüssen für Durchsteckmontage auf Leiterplatten (THT)

Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification intermédiaire: Résistances à couches et à faible dissipation équipées de broches pour assemblage par trous traversants sur circuits imprimés (THT)

L’IEC 60115-2:2023 s’applique aux résistances fixes à couche, à faible dissipation, équipées de broches de sortie, utilisées dans les équipements électroniques, et qui sont généralement assemblées sur les cartes de circuit imprimé au moyen de la technologie à trous traversants (THT).
Ces résistances sont généralement décrites selon des types (différentes formes géométriques), des modèles (différentes dimensions) et des technologies de produit. L’élément résistif de ces résistances est généralement protégé par un revêtement de vernis enrobant. Ces résistances comportent des fils de sortie et sont principalement destinées à être montées sur une carte de circuits avec la technique des trous traversants.
Le présent document a pour objet d’énoncer les caractéristiques assignées et les caractéristiques préférentielles, de choisir dans l’IEC 60115-1 les procédures d’assurance de la qualité et les méthodes d’essai et de mesure appropriées, et de fixer les exigences de performances générales pour ce type de résistance.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) adoption des définitions des technologies de produit et des niveaux de classification de produit de la spécification générique, IEC 60115-1:2020;
b) examen des dimensions préférentielles du Tableau 1, et suppression de l’ancien modèle RA_0922;
c) amendement en 4.2 d’une base pour la spécification facultative de l’excentricité des broches, pour les résistances à broches axiales;
d) intégration en 5.3.8, en tant que méthode d’essai par défaut, de l’"essai de surcharge haute tension à impulsions périodiques" donné dans l’IEC 60115‑1:2020, 8.3, entraînant le remplacement de l’ancien "essai de surcharge à impulsions périodiques" donné dans l’IEC 60115‑1:2020, 8.4;
e) intégration en 5.3.19 et 5.3.20 de la révision de l’essai de brasabilité de l’IEC 60115‑1:2020, 11.1;
f) intégration en 5.3.22 de l’essai de résistance au solvant combiné de l’IEC 60115‑1:2020, 11.3;
g) intégration en 5.4.1, en tant qu’essai facultatif, de "l’essai d’endurance à la température ambiante" donné dans l’IEC 60115‑1:2020, 7.2 (figurant anciennement dans l’IEC 60115‑2:2014, Annexe C);
h) ajout de la forme d’ondes des impulsions 1,2/50 comme variante facultative en 5.4.2 à "l’essai de surcharge haute tension à une seule impulsion" donné dans l’IEC 60115‑1:2020, 8.2, appliqué avec la forme d’ondes des impulsions 10/700 spécifiée en 5.3.7;
i) intégration en tant qu’essais facultatifs des essais climatiques relatifs au "fonctionnement à basse température" de l’IEC 60115-1:2020, 10.2, et à "chaleur humide, essai continu, accéléré" de l’IEC 60115-1:2020, 10.5, respectivement en 5.4.4 et 5.4.5;
j) ajout de nouvelles recommandations en 6.2 sur la présentation des exigences de stabilité, ainsi que leurs écarts absolus et relatifs admis;
k) ajout de critères d’acceptation pour l’examen visuel en 6.5 et à l’Annexe B;
l) ajout d’un examen visuel pour l’emballage principal et l’emballage de proximité en 6.5.2 et en 7.2;
m) ajout de l’évaluation périodique des revêtements des sorties comme nouveau sujet de l’évaluation de la qualité en 9.8;
n) application de la numérotation corrigée des articles sur les essais de l’IEC 60115-1:2020;
o) ajout d’une nouvelle Annexe C pour synthétiser les exigences relatives à la qualité d’exécution pour l’assemblage de résistance à broches à couche, par exemple celles données dans l’ancienne série de normes IEC 61192

Stalni upori za elektronsko opremo - 2. del: Področna specifikacija: Tankoplastni upori nizke moči z izvodi za montažo skozi prehodne luknje tiskanih vezij

General Information

• Status: Not Published
• Public Enquiry End Date: 26-Dec-2024
• ICS: 31.040.10 - Fixed resistors
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 4020 - Public enquire (PE) (Adopted Project)
• Start Date: 09-Oct-2024
• Due Date: 26-Feb-2025
• Ref Project: prEN IEC 60115-2:2024 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

Relations

• Amended By: oSIST prEN IEC 60115-2:2024/oprAA:2024 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)
• Effective Date: 17-Oct-2023
• Revises: SIST EN 60115-2:2015 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification : Fixed low-power non-wirewound resistors
• Effective Date: 17-Oct-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-december-2024
Stalni upori za elektronsko opremo - 2. del: Področna specifikacija: Tankoplastni
upori nizke moči z izvodi za montažo skozi prehodne luknje tiskanih vezij
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-
power film resistors with leads for through-hole assembly on circuit boards (THT)
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 2:
Rahmenspezifikation: Niedrigbelastbare Schichtwiderstände mit Drahtanschlüssen für
Durchsteckmontage auf Leiterplatten (THT)
Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification
intermédiaire: Résistances à couches et à faible dissipation équipées de broches pour
assemblage par trous traversants sur circuits imprimés (THT)
Ta slovenski standard je istoveten z: prEN IEC 60115-2:2024
ICS:
31.040.10 Fiksni upor Fixed resistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD DRAFT
prEN IEC 60115-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2024
ICS 31.040.10 Will supersede EN 60115-2:2015
English Version
Fixed resistors for use in electronic equipment - Part 2: Sectional
specification: Low-power film resistors with leads for through-
hole assembly on circuit boards (THT)
(IEC 60115-2:2023)
To be completed Festwiderstände zur Verwendung in Geräten der Elektronik
(IEC 60115-2:2023) - Teil 2: Rahmenspezifikation: Niedrigbelastbare
Schichtwiderstände mit Drahtanschlüssen für
Durchsteckmontage auf Leiterplatten (THT)
(IEC 60115-2:2023)
This draft European Standard is submitted to CENELEC members for enquiry.
Deadline for CENELEC: 2024-12-27.

The text of this draft consists of the text of IEC 60115-2:2023 (40/2943/CDV).

If this draft becomes a European Standard, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

This draft European Standard was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 78789 Ref. No. prEN IEC 60115-2:2024 E

European foreword
This document (prEN IEC 60115-2:2024) consists of the text of document IEC 60115-2:2023, prepared
by IEC/TC 40 " Capacitors and resistors for electronic equipment".
This document is currently submitted to the Enquiry.
The following dates are proposed:
• latest date by which the existence of this document (doa) dor + 6 months
has to be announced at national level
• latest date by which this document has to be (dop) dor + 12 months
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) dor + 36 months
conflicting with this document have to be withdrawn (to be confirmed or
modified when voting)
This document will supersede EN 60115-2:2015 and all of its amendments and corrigenda (if any).
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure of the generic specification EN 60115-1:2023, where
the tests of prior Clause 4 are given in Clauses 6 to 12 now;
b) the definitions of product technologies and product classification levels of the generic specification,
EN 60115-1:2023, have been adopted;
c) the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA-0922 has
been removed;
d) a basis for the optional specification of the lead eccentricity of axial leaded resistors has been
amended in 4.2;
e) the ‘periodic-pulse high-voltage overload test’ of EN 60115-1:2023, 8.3 has been adopted as default
test method in 5.3.8, thereby replacing the legacy test ‘periodic-pulse overload test’ of EN 60115-
1:2023, 8.4;
f) the revised solderability test of EN 60115-1:2023, 11.1 has been adopted in 5.3.19 and 5.3.20;
g) the combined solvent resistance test of EN 60115-1:2023, 11.3 has been adopted in in 5.3.22;
h) the ‘endurance at room temperature test’ of EN 60115-1:2023, 7.2 (prior Annex C of
EN 60115-2:2015) has been adopted as an optional test in 5.4.1;
i) the ‘single-pulse high-voltage overload test’ of EN 60115-1:2023, 8.2, applied with the pulse shape
10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50
in 5.4.2;
j) climatic tests for ‘operation at low temperature’ of EN 60115-1:2023, 10.2, and for ‘damp heat,
steady state, accelerated’ of EN 60115-1:2023, 10.5, have been adopted as optional tests in 5.4.4.
and 5.4.5, respectively;
k) new guidance is provided in 6.2 on the presentation of stability requirements with their permissible
absolute and relative deviations;
l) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
m) visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2
n) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
o) a new Annex C has been added to summarize workmanship requirements for the assembly of
leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
p) the informative Annex F (prior Annex B) on radial formed styles has been amended with details on
a formed Z-bend style for surface-mount assembly.
Preceding documents on the subject covered by this specification have been:
— EN 60115-2:2015
— EN 140100:2008, EN 140100:1996 + EN 140100:1996/A1:2001
— CECC 40 100:1980-00, 1973-00

IEC 60115-2 ®
Edition 4.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –

Part 2: Sectional specification: Low-power film resistors with leads for through-

hole assembly on circuit boards (THT)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6467-6

– 2 – IEC 60115-2:2023 © IEC 2023
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
3.1 Terms . 10
3.2 Product technologies . 11
3.3 Product classification . 11
4 Preferred characteristics . 11
4.1 General . 11
4.2 Style and dimensions . 11
4.2.1 Preferred styles and outline dimensions. 11
4.2.2 Length of excessive coating or welding bead . 13
4.2.3 Lead wire spacing . 13
4.2.4 Lead eccentricity . 14
4.3 Preferred climatic categories . 15
4.4 Resistance . 16
4.5 Tolerances on resistance . 16
4.6 Rated dissipation P . 16
4.7 Limiting element voltage U . 16
max
4.8 Insulation voltage U . 17
ins
4.9 Insulation resistance R . 17
ins
5 Tests and test severities . 17
5.1 General provisions for tests applied by this specification . 17
5.2 Preparation of specimens . 18
5.2.1 Drying . 18
5.2.2 Mounting of components on test boards . 18
5.2.3 Mounting of components on a test rack . 21
5.3 Details of applied tests . 23
5.3.1 Resistance . 23
5.3.2 Temperature coefficient of resistance . 23
5.3.3 Temperature rise . 23
5.3.4 Endurance at the rated temperature 70 °C . 23
5.3.5 Endurance at a maximum temperature: UCT . 24
5.3.6 Short-term overload . 24
5.3.7 Single-pulse high-voltage overload test . 25
5.3.8 Periodic-pulse high-voltage overload test . 26
5.3.9 Electrostatic discharge (ESD) test . 27
5.3.10 Visual examination . 27
5.3.11 Gauging of dimensions . 28
5.3.12 Detail dimensions . 28
5.3.13 Robustness of terminations . 28
5.3.14 Vibration . 29
5.3.15 Rapid change of temperature . 29
5.3.16 Rapid change of temperature, ≥ 100 cycles . 29
5.3.17 Climatic sequence . 29
5.3.18 Damp heat, steady state . 30

IEC 60115-2:2023 © IEC 2023 – 3 –
5.3.19 Solderability, with lead-free solder . 30
5.3.20 Solderability, with SnPb solder . 31
5.3.21 Resistance to soldering heat . 32
5.3.22 Solvent resistance . 32
5.3.23 Insulation resistance . 32
5.3.24 Voltage proof . 32
5.3.25 Flammability . 33
5.4 Optional and/or additional tests . 33
5.4.1 Endurance at room temperature .
...