High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor

Induktive Hochfrequenz-Bauelemente - Elektrische Eigenschaften und Messmethoden - Teil 1: Chipinduktivitäten im Nanohenry-Bereich

Composants inductifs à haute fréquence - Caractéristiques électriques et méthodes de mesure - Partie 1: Inductance à puce de l'ordre du nanohenry

Visokofrekvenčne induktivne komponente - Električne karakteristike in merilne metode - 1. del: Čipni induktor v območju nanohenrijev

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Public Enquiry End Date
27-Sep-2023
Current Stage
4020 - Public enquire (PE) (Adopted Project)
Start Date
13-Jul-2023
Due Date
30-Nov-2023

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SLOVENSKI STANDARD
oSIST prEN IEC 62024-1:2023
01-september-2023
Visokofrekvenčne induktivne komponente - Električne karakteristike in merilne
metode - 1. del: Čipni induktor v območju nanohenrijev
High frequency inductive components - Electrical characteristics and measuring methods
- Part 1: Nanohenry range chip inductor
Induktive Hochfrequenz-Bauelemente - Elektrische Eigenschaften und Messmethoden -
Teil 1: Chipinduktivitäten im Nanohenry-Bereich
Composants inductifs à haute fréquence - Caractéristiques électriques et méthodes de
mesure - Partie 1: Inductance à puce de l'ordre du nanohenry
Ta slovenski standard je istoveten z: prEN IEC 62024-1:2023
ICS:
29.100.10 Magnetne komponente Magnetic components
oSIST prEN IEC 62024-1:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 62024-1:2023

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oSIST prEN IEC 62024-1:2023
51/1441/CDV

COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62024-1 ED4
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-07-07 2023-09-29
SUPERSEDES DOCUMENTS:
51/1415/CD, 51/1424/CC

IEC TC 51 : MAGNETIC COMPONENTS, FERRITE AND MAGNETIC POWDER MATERIALS
SECRETARIAT: SECRETARY:
Japan Mr Takeshi Abe
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:


Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries”
clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for
submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
High frequency inductive components - Electrical characteristics and measuring methods - Part 1:
Nanohenry range chip inductor

PROPOSED STABILITY DATE: 2028

Copyright © 2023 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

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oSIST prEN IEC 62024-1:2023
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NOTE FROM TC/SC OFFICERS:

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oSIST prEN IEC 62024-1:2023
51/1441/CDV 3 IEC CDV 62024-1 © IEC 2023

1 CONTENTS
2
3 FOREWORD . 5
4 1 Scope . 7
5 2 Normative references . 7
6 3 Terms and definitions . 7
7 4 Inductance, Q-factor and impedance . 7
8 4.1 Inductance . 7
9 4.1.1 Measuring method . 7
10 4.1.2 Measuring circuit . 8
11 4.1.3 Mounting the inductor for the test . 9
12 4.1.4 Measuring method and calculation formula . 11
13 4.1.5 Notes on measurement . 12
14 4.2 Quality factor . 13
15 4.2.1 Measuring method . 13
16 4.2.2 Measuring circuit . 13
17 4.2.3 Mounting the inductor for test . 14
18 4.2.4 Measuring methods and calculation formula . 14
19 4.2.5 Notes on measurement . 14
20 4.3 Impedance . 14
21 4.3.1 Measuring method . 14
22 4.3.2 Measuring circuit . 14
23 4.3.3 Mounting the inductor for test . 14
24 4.3.4 Measuring method and calculation . 14
25 4.3.5 Notes on measurement . 14
26 5 Resonance frequency . 14
27 5.1 Self-resonance frequency . 14
28 5.2 Minimum output method . 15
29 5.2.1 General . 15
30 5.2.2 Measuring circuit . 15
31 5.2.3 Mounting the inductor for test . 15
32 5.2.4 Measuring method and calculation formula . 16
33 5.2.5 Note on measurement . 16
34 5.3 Measurement by analyzer . 16
35 5.3.1 Measurement by impedance analyzer and one-port network analyzer . 16
36 5.3.2 Measurement by two-port network analyzer . 16
37 6 DC resistance . 17
38 6.1 Voltage-drop method. 17
39 6.1.1 Measuring circuit . 17
40 6.1.2 Measuring method and calculation formula . 17
41 6.2 Bridge method . 17
42 6.2.1 Measuring circuit . 17
43 6.2.2 Measuring method and calculation formula . 18
44 6.3 Notes on measurement . 18
45 6.4 Measuring temperature . 18
46 7 S parameter. 18
47 7.1 Measurement set-up and procedure . 18

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48 7.1.1 General . 18
49 7.1.2 2-port S parameter . 19
50 7.1.3 Test fixture . 19
51 7.2 Calibrations and Verification of test setup . 21
52 7.2.1 General . 21
53 7.2.2 Calibration . 21
54 7.2.3 De-embedding . 24
55 7.3 Indirect Method of impedance . 24
56 7.3.1 Measurement set-up and procedure . 24
57 7.4 Evaluation from the 2-port S-parameter . 24
58 Annex A (normative) Mounting method for a surface mounting inductor . 27
59 A.1 Overview. 27
60 A.2 Mounting printed-circuit board and mounting land . 27
61 A.3 Solder . 27
62 A.4 Test condition . 27
63 A.5 Cleaning . 27
64
65 Figure 1 – Example of circuit for vector voltage/current method . 8
66 Figure 2 – Example of circuit for reflection coefficient method . 9
67 Figure 3 – Fixture A . 10
68 Figure 4 – Fixture B . 10
69 Figure 5 – Fixture C . 11
70 Figure 6 – Short device shape . 13
71 Figure 7 – Example of test circuit for the minimum output method . 15
72 Figure 8 – Self-resonance frequency test board (minimum output method) . 16
73 Figure 9 – Example of test circuit for voltage-drop method . 17
74 Figure 10 – Example of test circuit for bridge method . 18
75 Figure 11 – Schematic diagrams of the 2-port S-parameter measurement setup and the
76 network analyzer . 19
77 Figure 12 – S-parameter test fixture for two-terminal devices . 19
78 Figure 13 – Test fixture for a two-terminal device (Shunt connection) . 20
79 Figure 14 – Test fixture for a two-terminal device (Series connection) . 20
80 Figure 15 – Example of the standards for TRL calibration . 22
81 Figure 16 – Example of the standards for TRL calibration with microprobes . 23
82 Figure 17 – Example of full 2-port de-embedding with microprobes . 24
83 Figure 18 – 2-port measurement of a two-terminal device in shunt connection . 25
84 Figure 19 – 2-port measurement of a two-terminal device in series connection . 25
85
86 Table 1 – Dimensions of l and d . 10
87 Table 2 – Short device dimensions and inductances . 13
88
89
90
91

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92 INTERNATIONAL ELECTROTECHNICAL COMMISSION
93 ____________
94
95 HIGH FREQUENCY INDUCTIVE COMPONENTS –
96 ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
97
98 Part 1: Nanohenry range chip inductor
99
100 FOREWORD
101 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
102 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
103 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
104 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
105 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
106 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
107 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
108 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
109 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
110 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
111 consensus of opinion on the relevant subjects since each technical committee has representation from all
112 interested IEC National Committees.
113 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
114 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
115 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
116 misinterpretation by any end user.
117 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
118 transparently to the maximum extent possible in their national and regional publications. Any divergence between
119 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
120 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
121 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
122 services carried out by independent certification bodies.
123 6) All users should ensure that they have the latest edition of this publication.
124 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
125 members of its technical committees and IEC National Committees for any personal injury, property damage or
126 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
127 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
128 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
129 indispensable for the correct application of this publication.
130 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
131 rights. IEC shall not be held responsible for identifying any or all such patent rights.
132 IEC 62024-1 has been prepared by IEC technical committee 51: Magnetic components, ferrite
133 and magnetic powder materials. It is an international standard.
134 This fourth edition cancels and replaces the third edition published in 2017. This edition
135 constitutes a technical revision.
136 This edition includes the following significant technical changes with respect to the previous
137 edition:
138 a) addition of S parameter measuring;
139 b) addition of the inductance, Q-factor and impedance of an inductor is measured by the
140 reflection coefficient method with network analyzer.
141 c) addition of the resonance frequency of an inductor is measured by 2 port network analyzer
142 d) addition of the mounting method for a surface mounting inductor with Pb-free solder
143

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144 The text of this International Standard is based on the following documents:
CDV Report on voting
51/xxxx/FDIS 51/xxxx/RVD
145
146 Full information on the voting for its approval can be found in the report on voting indicated in
147 the above table.
148 The language used for the development of this International Standard is English.
149 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
150 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
151 at https://www.iec.ch/members_experts/refdocs. The main document types developed by IEC
152 are described in greater detail at https://www.iec.ch/standardsdev/publications.
153 A list of all parts of the IEC 62024 series, published under the general title High frequency
154 inductive components – Electrical characteristics and measuring methods, can be found on the
155 IEC website.
156 The committee has decided that the contents of this document will remain unchanged until the
157 stability date indicated on the IEC website under webstore.iec.ch in the data related to the
158 specific document. At this date, the document will be
159 • reconfirmed,
160 • withdrawn,
161 • replaced by a revised edition, or
162 • amended.
163
164

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165 HIGH FREQUENCY INDUCTIVE COMPONENTS –
166 ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
167
168 Part 1: Nanohenry range chip inductor
169
170
171
172 1 Scope
173 This part of IEC 62024 specifies electrical characteristics and measuring methods for the
174 nanohenry range chip inductor that is normally used in high frequency (over 100 kHz) range.
175 2 Normative references
176 The following documents are referred to in the text in such a way that some or all of their content
177 constitutes requirements of this document. For dated references, only the edition cited applies.
178 For undated references, the latest edition of the referenced document (including any
179 amendments) applies.
180 IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
181 Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of defined
182 flammability (vertical burning test) copper-clad
183 IEC 62025-1, High frequency inductive components – Non-electrical characteristics and
184 measuring methods – Part 1: Fixed, surface mounted inductors for use in electronic and
185 telecommunication equipment
186 IEC 62674-1, High frequency inductive components - Part 1: Fixed surface mount inductors for
187 use in electronic and telecommunication equipment
188 ISO 6353-3, Reagents for chemical analysis – Part 3: Specifications – Second series
189 ISO 9453, Soft solder alloys – Chemical compositions and forms
190 3 Terms and definitions
191 No terms and definitions are listed in this document.
192 ISO and IEC maintain terminological databases for use in standardization at the following
193 addresses:
194 • IEC Electropedia: available at http://www.electropedia.org/
195 • ISO Online browsing platform: available at http://www.iso.org/obp
196 4 Inductance, Q-factor and impedance
197 4.1 Inductance
198 4.1.1 Measuring method
199 The inductance of an inductor is measured by either the vector voltage/current method
200 (impedance analyzer) or the reflection coefficient method (network analyzer).
201

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202 4.1.2 Measuring circuit
203 An example of the circuit for the vector voltage/current method is shown in Figure 1 and an
204 example of the circuit for the reflection coefficient method is shown in Figure 2.
Ev2
Inductor under test
R
Rg
L(Lx)
Ls
Cd
Ev1
Rs
G

Impedance analyzer
205
206 Key
207 R source resistance (50 Ω)
g
208 R resistor
209 L inductor under test
210 L inductance of inductor under test
x
211 C parallel capacitance of inductor under test
d
212 L series inductance of inductor under test
s
213 R series resistance of inductor under test
s
214 Ev , Ev vector voltmeter
1 2
215 G signal generator
216 Figure 1 – Example of circuit for vector voltage/current method
217

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218
L
R
G g
L
1
Ls
Cd
Ev1
Ev2
R
R
t1
t2
Rs

Inductor under test

Network analyzer
Test fixture
219

220 Key
221 R source resistance (50 Ω)
g
222 R , R termination resistor (50 Ω)
t1 t2
223 L inductor under test
224 C parallel capacitance of inductor under test
d
225 L series inductance of inductor under test
s
226 R series resistance of inductor under test
s
227 Ev , Ev vector voltmeter
1 2
228 G signal generator
229 L 50 Ω micro-strip line or equivalent transmission line
1
230 Figure 2 – Example of circuit for reflection coefficient method
231
232 4.1.3 Mounting the inductor for the test
233 4.1.3.1 General
234 The inductor shall be mounted in a test fixture as specified in the relevant standard. If no fixture
235 is specified, one of the following test fixtures A, B or C shall be used. The fixture used shall be
236 reported.
237 4.1.3.2 Fixture A
238 The shape and dimensions of fixture A shall be as shown in Figure 3 and Table 1.
239

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240
Structure of connection
to the measurement circuit
Electrical
l length
External electrode
Central electrode
Dielectric material
Inductor under test
IEC

241
242 Figure 3 – Fixture A
243 Table 1 – Dimensions of l and d
a
l d
Size of inductor under test
mm mm
1608 1,6 0,95
1005 1,0 0,60
0603 0,6 0,36
0402 0,4 0,26
0201 0,2 0,12
a
The outline dimensions of the surface mounted inductor shall be indicated by a four-digit number based on
two significant figures for each dimension L, and W (or H) (refer to IEC 62025-1).
244
245 The electrodes of the test fixture shall contact the electrodes of the inductor under test by
246 mechanical force provided by an appropriate method. This force shall be chosen so as to
247 provide satisfactory measurement stability without influencing the characteristics of the inductor.
248 The mechanical force shall be specified. A characteristic impedance of the structure between
249 the measurement circuit and the test fixture shall maintain a characteristic impedance as close
250 as possible to 50 Ω.
251 4.1.3.3 Fixture B
252 The test fixture B as shown in Figure 4 shall be used.
253
External electrode
254
255
256
Inductor under test
257
Central electrode
258
d
Dielectric material
259
260
Structure of connection with
261
measurement circuit
IEC
262
263 Figure 4 – Fixture B
d

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264 The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
265 test by mechanical force provided by an appropriate method. This force shall be chosen so as
266 to provide satisfactory measurement stability without influencing the characteristics of the
267 inductor. The mechanical force shall be specified.
268 A characteristic impedance of the structure between the measurement circuit and the test
269 fixture shall maintain a characteristic impedance as close as possible to 50 Ω.
270 Dimension d shall be specified between parties concerned.
271 4.1.3.4 Fixture C
272 The test fixture C as shown in Figure 5 shall be used.
50 Ω micro-strip

Earth plane covering whole bottom

IEC
273
274 Figure 5 – Fixture C
275 The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
276 test by mechanical force provided by an appropriate method. This force shall be chosen so as
277 to provide satisfactory measurement stability without influencing the characteristics of the
278 inductor. The mechanical force shall be specified.
279 A characteristic impedance of the structure between the measurement circuit and the test
280 fixture shall maintain a characteristic impedance as close as possible to 50 Ω.
281 Dimensions of the patterns of the fixture and material of the fixture shall be specified between
282 parties concerned.
283 4.1.4 Measuring method and calculation formula
284 Inductance L of the inductor L is defined by the vector sum of reactance caused by L and C
x s d
285 (see Figure 1 or Figure 1). The frequency f of the signal generator output signal shall be set to
286 a frequency as separately specified. The inductor under test shall be connected to the
287 measurement circuit by using the test fixture as described above. Vector voltage E and E shall
1 2
288 be measured by vector voltage meters Ev and Ev , respectively. The inductance L shall be
1 2 x
289 calculated by the following formula (1) and formula (2) for vector voltage/current method, or
290 formula (3) through formula (5) for reflection coefficient method:
[ ]
𝑙𝑙𝑙𝑙𝑍𝑍
𝑥𝑥
                                                             (1)
𝐿𝐿 =
𝑥𝑥
𝜔𝜔
𝐸𝐸
1
𝑍𝑍 =𝑅𝑅 (2)
𝑥𝑥
𝐸𝐸
2
291
292 where
293 L is the inductance of the inductor under test;
x
W
t1
t2

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294 lm is the imaginary part of the complex value;
295 Z is the impedance of the inductor under test;
x
296 R is the resistance of the resistor;
297 E is the value indicated on vector voltmeter Ev ;
1 1
298 E is the value indicated on vector voltmeter Ev ;
2 2
299 ω is the angular frequency: 2πf.
300
[ ]
𝑙𝑙𝑙𝑙𝑍𝑍
𝑥𝑥
                                                             (3)
𝐿𝐿 =
𝑥𝑥
𝜔𝜔
𝐸𝐸
1
                           𝑍𝑍  =  𝑅𝑅                              (4)
𝑥𝑥
𝐸𝐸
2
𝐸𝐸
1
𝑆𝑆 = (5)
11
𝐸𝐸
2
301 where
302 L is the inductance of the inductor under test;
x
303 lm is the imaginary part of the complex value;
304 Z is the impedance of the inductor under test;
x
305 S is the reflection coefficient of the inductor under test;
11
306 Z is the system impedance of the measurement system (50 Ω);
0
307 E is the value indicated on vector voltmeter Ev ;
1 1
308 E is the value indicated on vector voltmeter Ev ;
2 2
309 ω is the angular frequency: 2πf.
310
311 4.1.5 Notes on measurement
312 4.1.5.1 General
313 The electrical length of the test fixture shall be compensated by an appropriate method followed
314 by open-short compensation. If an electrical length that is not commonly accepted is used, it
315 shall be specified. Open-short compensation shall be calculated by the following formula:
Z − B
m c
316 Z = A (6)
x c
1− Z C
m c
317 A = 1 + j0 (7)
c
Z −(1− Y Z )Z − Z Y Z
sm om sm ss sm os ss
318 B = (8)
c
1− Y Z Y Z
om sm os ss
Y −(1− Y Z )Y − Y Y Z
om om sm os om os ss
319 C = (9)
c
1− Y Z Y Z
om sm os ss
320 where
321 Z is the impedance measurement value after compensation;
x
322 Z is the impedance measurement value before compensation;
m

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323 Z is the impedance measurement value of the short device;
sm
324 Z is the short device inductance as define
...

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