SIST EN 300 417-4-2 V1.1.1:2003

Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification

ICS proforma for ETS 300 417-4-1

Prenos in multipleksiranje (TM) – Generične zahteve za prenosno funkcionalnost opreme – 4-2. del: Funkcije plasti poti pri sinhroni digitalni hierarhiji (SDH)– Proforma specifikacija izjave o skladnosti izvedbe (ICS)

General Information

• Status: Published
• Publication Date: 30-Nov-2003
• ICS: 33.040.20 - Transmission systems
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Dec-2003
• Due Date: 01-Dec-2003
• Completion Date: 01-Dec-2003
• Ref Project: ETSI EN 300 417-4-2 V1.1.1 (1999-06) - Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.XQNFLRQDOQRVWTransmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification33.040.20Prenosni sistemTransmission systemsICS:Ta slovenski standard je istoveten z:EN 300 417-4-2 Version 1.1.1SIST EN 300 417-4-2 V1.1.1:2003en01-december-2003SIST EN 300 417-4-2 V1.1.1:2003SLOVENSKI
STANDARD



SIST EN 300 417-4-2 V1.1.1:2003



EN 300 417-4-2 V1.1.1 (1999-06)European Standard (Telecommunications series)Transmission and Multiplexing (TM);Generic requirements of transport functionality of equipment;Part 4-2: Synchronous Digital Hierarchy (SDH)path layer functions;Implementation Conformance Statement (ICS)proforma specificationSIST EN 300 417-4-2 V1.1.1:2003



ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)2ReferenceDEN/TM-01015-4-2 (3v10iico.PDF)KeywordsSDH, testingETSIPostal addressF-06921 Sophia Antipolis Cedex - FRANCEOffice address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: [phone]
Fax: [phone]Siret N° 348 623 562 00017 - NAF 742 CAssociation à but non lucratif enregistrée à laSous-Préfecture de Grasse (06) N° 7803/[e-mail] copies of this ETSI deliverablecan be downloaded fromhttp://www.etsi.orgIf you find errors in the present document, send yourcomment to: [e-mail] NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© European Telecommunications Standards Institute 1999.All rights reserved.SIST EN 300 417-4-2 V1.1.1:2003



ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)3ContentsIntellectual Property Rights.11Foreword.11Introduction.121Scope.132References.133Definitions and abbreviations.143.1Definitions.143.2Abbreviations.144Conformance to this ICS proforma specification.17Annex A (normative):ICS proforma for EN 300 417-4-1.18A.1Guidance for completing the ICS proforma.18A.1.1Purposes and structure.18A.1.2Abbreviations and conventions.18A.1.3Instructions for completing the ICS proforma.20Annex B (normative):ICS proforma for S4 Path Layer.21B.1Identification of the implementation.21B.1.1Date of the statement.21B.1.2Implementation Under Test (IUT) identification.21B.1.3System Under Test (SUT) identification.22B.1.4Product supplier.22B.1.5Client.23B.1.6ICS contact person.23B.2Identification of the EN.24B.3Global statement of conformance of S4 Path Layer.24B.4S4 Path Layer functions.24B.4.1S4 Path Layer Description.24B.4.2VC-4 Layer Transmission Tables.30B.4.2.1VC-4 Layer Connection Function: S4_C.30B.4.2.1.1Routing process.30B.4.2.1.2Unequipped VC generation.30B.4.2.1.3SNC protection process.31B.4.2.2VC-4 Layer Trail Termination Functions: S4_TT_So, S4_TT_Sk, S4m_TT_Sk, S4s_TT_So andS4s_TT_Sk.34B.4.2.2.1In service error monitoring process.34B.4.2.2.2Remote indicator monitoring process.35B.4.2.2.2.1VC-4 Remote Defect Indication (VC-4 RDI).35B.4.2.2.2.2VC-4 Remote Error Indication (S4 REI).36B.4.2.2.3Trail Trace Identifier.37B.4.2.2.4Supervisory Unequipped indication.39B.4.2.3Activation/deactivation of VC-4 Layer payload Adaptation Functions (S4/P4x_A, S4/P4e_A,S4/TUG_A, S4/DQDB_A, S4/Avp_A and S4/TSS1_A).39B.4.2.4VC-4 Layer to P4x Layer Adaptation Functions: S4/P4x_A_So and S4/P4x_A_Sk.40B.4.2.4.1VC-4 Layer to P4x Layer frequency justification and bitrate adaptation processes.40B.4.2.4.2Justification control.41B.4.2.4.3Smoothing and jitter limiting process.42B.4.2.4.4Payload type processing.42B.4.2.4.5H4 byte processing.43SIST EN 300 417-4-2 V1.1.1:2003



ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)4B.4.2.5VC-4 Layer to P4e Layer Adaptation Functions: S4/P4e_A_So and S4/P4e_A_Sk.43B.4.2.5.1VC-4 Layer to P4e Layer frequency justification and bitrate adaptation processes.44B.4.2.5.2Justification control.45B.4.2.5.3Smoothing and jitter limiting process.45B.4.2.5.4Frame Alignment process.46B.4.2.5.5Payload type processing.46B.4.2.5.6H4 byte processing.47B.4.2.6VC-4 Layer to VC-3, VC-2, VC-12 and VC-11 Layer Compound Adaptation Functions:S4/SX_A_So and S4/SX_A_Sk.47B.4.2.6.1VC-4 Layer to TUG Adaptation Functions: S4/TUG_A_So and S4/TUG_A_Sk.47B.4.2.6.1.1Payload type processing.48B.4.2.6.1.2Multiframe Indicator processing.48B.4.2.6.1.3Fixed Stuff insertion.49B.4.2.6.2TUG to VC-3/2/12/11 Layer Adaptation Functions: TUG/S3_A_So, TUG/S3_A_Sk,TUG/S2_A_So, TUG/S2_A_Sk, TUG/S12_A_So, TUG/S12_A_Sk, TUG/S11*_A_So andTUG/S11*_A_Sk.49B.4.2.6.2.1TUG to VC-3/2/12/11 Layer frequency justification and bitrate adaptation processes.51B.4.2.6.2.2TUG to VC-3/2/12/11 Layer alignment process.53B.4.2.6.2.3VC-4 Layer to VC-3/2/12/11 Layer multiplexing and demultiplexing processes.63B.4.2.7VC-4 Layer to DQDB Layer Adaptation Functions: S4/DQDB_A_So and S4/DQDB_A_Sk.64B.4.2.7.1DQDB slot payload scrambling/descrambling.65B.4.2.7.2DQDB slot boundary indication/delineation process.66B.4.2.7.3Link Status Signal processing.67B.4.2.7.4Payload type processing.68B.4.2.7.5DQDB Layer management information transport.68B.4.2.8VC-4 Layer to ATM Layer Compound Adaptation Functions: S4/Avp_A_So and S4/Avp_A_Sk.68B.4.2.9VC-4 Layer to LC Layer Adaptation Function: S4/LC_A_So.68B.4.2.10VC-4 Layer to TSS1 Layer Adaptation Functions: S4/TSS1_A_So and S4/TSS1_A_Sk.69B.4.2.10.1Payload type processing.69B.4.2.10.2H4 byte processing.70B.4.2.11VC-4 Layer to P0s Layer Adaptation Functions: S4/P0s_A_So and S4/P0s_A_Sk.70B.4.2.11.1VC-4 Layer to P0s Layer frequency justification and bitrate adaptation processes.70B.4.2.11.2Data latching and smoothing process.71B.4.3VC-4 Layer Linear Trail Protection Transmission Tables.72B.4.3.1VC-4 Layer Linear Trail Protection Connection Function: S4P_C.73B.4.3.2VC-4 Layer Linear Trail Protection Trail Termination Functions: S4P_TT_So and S4P_TT_Sk.74B.4.3.3VC-4 Layer Linear Trail Protection Adaptation Functions:S4/S4P_A_So and S4/S4P_A_Sk.74B.4.3.3.1VC-4 Layer to VC-4 Protection Layer multiplexing and demultiplexing processes.74B.4.4VC-4 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.75B.4.4.1APS externally initiated commands.75B.4.4.2APS automatically initiated commands.76B.4.4.3APS generalities.77B.4.4.4APS sub-processes.77B.4.4.5APS status report.78B.4.5VC-4 Tandem Connection Sub-layer Transmission Tables.79B.4.5.1VC-4 Tandem Connection Sub-layer Trail Termination Functions: S4D_TT_So, S4D_TT_Sk andS4Dm_TT_Sk.79B.4.5.1.1In service error monitoring process.79B.4.5.1.2Tandem Connection Error Count processes.80B.4.5.1.3Tandem Connection Multiframe Alignment process.81B.4.5.1.4VC-4 Tandem Connection Remote indicator monitoring process.81B.4.5.1.4.1VC-4 Tandem Connection Remote Defect Indication (TC RDI).81B.4.5.1.4.2VC-4 Tandem Connection Remote Error Indication (TC REI).82B.4.5.1.5VC-4 Tandem Connection Outgoing indicator monitoring process.83B.4.5.1.5.1VC-4 Tandem Connection Outgoing Defect Indication (TC ODI).83B.4.5.1.5.2VC-4 Tandem Connection Outgoing Error Indication (TC OEI).84B.4.5.1.6Tandem Connection Trace Identifier.85B.4.5.2VC-4 Tandem Connection to VC-4 Layer Adaptation Functions: S4D/S4_TT_So and S4D/S4_A_Sk.86B.4.6VC-4 Layer Defect, Consequent Action, Defect Correlation and Performance Monitoring Tables.87B.4.6.1Port Status Management.87SIST EN 300 417-4-2 V1.1.1:2003



ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)5B.4.6.2Defect detection and clearance criteria.87B.4.6.3Consequent action activation and clearance criteria.93B.4.6.4Defect correlation.99B.4.6.5Performance monitoring.101B.4.6.5.1Near End Performance monitoring.101B.4.6.5.2Far End Performance monitoring.102B.4.7VC-4 Layer Linear Trail Protection Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.102B.4.7.1Consequent action activation and clearance criteria.102B.4.7.2Defect correlation.103B.4.8VC-4 Tandem Connection Sub-layer Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.103B.4.8.1Port Status Management.103B.4.8.2Defect detection and clearance criteria.104B.4.8.3Consequent action activation and clearance criteria.106B.4.8.4Defect correlation.110B.4.8.5Performance monitoring.112B.4.8.5.1Near End Performance monitoring.112B.4.8.5.2Far End Performance Monitoring.112B.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.113Annex C (normative):ICS proforma for S3 Path Layer.114C.1Identification of the implementation.114C.1.1Date of the statement.114C.1.2Implementation Under Test (IUT) identification.114C.1.3System Under Test (SUT) identification.115C.1.4Product supplier.115C.1.5Client.116C.1.6ICS contact person.116C.2Identification of the EN.117C.3Global statement of conformance of S3 Path Layer.117C.4S3 Path Layer functions.117C.4.1S3 Path Layer Description.117C.4.2VC-3 Layer Transmission Tables.121C.4.2.1VC-3 Layer Connection Function: S3_C.121C.4.2.1.1Routing process.121C.4.2.1.2Unequipped VC generation.122C.4.2.1.3SNC protection process.122C.4.2.2VC-3 Layer Trail Termination Functions: S3_TT_So, S3_TT_Sk, S3m_TT_Sk, S3s_TT_So andS3s_TT_Sk.124C.4.2.2.1In service error monitoring process.125C.4.2.2.2Remote indicator monitoring process.126C.4.2.2.2.1VC-3 Remote Defect Indication (VC-3 RDI).126C.4.2.2.2.2VC-3 Remote Error Indication (S3 REI).127C.4.2.2.3Trail Trace Identifier.128C.4.2.2.4Supervisory Unequipped indication.129C.4.2.3Activation/deactivation of VC-3 Layer payload Adaptation Functions (S3/P31x_A, S3/P31e_A,S3/Avp_A and S3/TSS3_A).130C.4.2.4VC-3 Layer to P31x Layer Adaptation Functions: S3/P31x_A_So and S3/P31x_A_Sk.131C.4.2.4.1VC-3 Layer to P31x Layer frequency justification and bitrate adaptation processes.131C.4.2.4.2Justification control.133C.4.2.4.3Smoothing and jitter limiting process.133C.4.2.4.4Payload typeSignal Label processing.134C.4.2.4.5H4 byte processing.134C.4.2.5VC-3 Layer to P31e Layer Adaptation Functions: S3/P31e_A_So and S3/P31e_A_Sk.135C.4.2.5.1VC-3 Layer to P31e Layer frequency justification and bitrate adaptation processes.135C.4.2.5.2Justification control.137C.4.2.5.3Smoothing and jitter limiting process.137SIST EN 300 417-4-2 V1.1.1:2003



ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)6C.4.2.5.4Frame Alignment process.138C.4.2.5.5Payload typeSignal Label processing.138C.4.2.5.6H4 byte processing.139C.4.2.6VC-3 Layer to ATM Layer Compound Adaptation Functions: S3/Avp_A_So and S3/Avp_A_Sk.139C.4.2.7VC-4 Layer to LC Layer Adaptation Function: S3/LC_A_So.139C.4.2.8VC-3 Layer to TSS3 Layer Adaptation Functions: S3/TSS3_A_So and S3/TSS3_A_Sk.139C.4.2.8.1Payload typeSignal Label processing.140C.4.2.8.2H4 byte processing.140C.4.2.9VC-3 Layer to P0s Layer Adaptation Functions: S3/P0s_A_So and S3/P0s_A_Sk.140C.4.2.9.1VC-3 Layer to P0s Layer frequency justification and bitrate adaptation processes.141C.4.2.9.2Data latching and smoothing process.142C.4.3VC-3 Layer Linear Trail Protection Transmission Tables.142C.4.3.1VC-3 Layer Linear Trail Protection Connection Function: S3P_C.143C.4.3.2VC-3 Layer Linear Trail Protection Trail Termination Functions: S3P_TT_So and S3P_TT_Sk.144C.4.3.3VC-3 Layer Linear Trail Protection Adaptation Functions:S3/S3P_A_So and S3/S3P_A_Sk.144C.4.3.3.1VC-3 Layer to VC-3 Protection Layer multiplexing and demultiplexing processes.144C.4.4VC-3 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.145C.4.4.1APS externally initiated commands.145C.4.4.2APS automatically initiated commands.146C.4.4.3APS generalities.147C.4.4.4APS switch performance.148C.4.4.5APS sub-processes.148C.4.4.6APS signal interpretation.149C.4.4.7APS status report.149C.4.5VC-3 Tandem Connection Sub-layer Transmission Tables.150C.4.5.1VC-3 Tandem Connection Sub-layer Trail Termination Functions: S3D_TT_So, S3D_TT_Sk andS3Dm_TT_Sk.150C.4.5.1.1In service error monitoring process.150C.4.5.1.2Tandem Connection Error Count process.151C.4.5.1.3Tandem Connection Multiframe Alignment process.152C.4.5.1.4VC-3 Tandem Connection Remote indicator monitoring process.152C.4.5.1.4.1VC-3 Tandem Connection Remote Defect Indication (TC RDI).152C.4.5.1.4.2VC-3 Tandem Connection Remote Error Indication (TC REI).153C.4.5.1.5VC-3 Tandem Connection Outgoing indicator monitoring process.154C.4.5.1.5.1VC-3 Tandem Connection Outgoing Defect Indication (TC ODI).154C.4.5.1.5.2VC-3 Tandem Connection Outgoing Error Indication (TC OEI).155C.4.5.1.6Tandem Connection Trace Identifier.156C.4.5.2VC-3 Tandem Connection to VC-3 Layer Adaptation Functions: S3D/S3_TT_So and S3D/S3_A_Sk.157C.4.6VC-
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