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CLC

CLC/BTTF 97-1 - Known Good Die

To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures. The requirements include those of general nature, vocabulary, mechanical material and connectivity. Specific requirements include test, quality, handling, thermal and electrical simulation.

Known Good Die

To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures. The requirements include those of general nature, vocabulary, mechanical material and connectivity. Specific requirements include test, quality, handling, thermal and electrical simulation.

General Information

Status
Inactive
Sector
V09 - SEMICONDUCTORS
Parent
CLC - CLC TC
Standardization Organization
ICS
Directive
Mandate
50
CLC
ES 59008-6-2:2001(Main)
Data requirements for semiconductor die -- Part 6-2: Data dictionary
SIST-TS ES 59008-6-2:2007

Superseded by EN 61360-4:2005

  • Technical specification
    22 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-4-2:2000(Main)
Data requirements for semiconductor die -- Part 4-2: Specific requirements and recommendations - Handling and storage
SIST-TS ES 59008-4-2:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by CLC/TR 62258-3:2007

  • Technical specification
    10 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-4-4:1999(Main)
Data requirements for semiconductor die -- Part 4-4: Specific requirements and recommendations - Electrical simulation
SIST-TS ES 59008-4-4:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-5:2006

  • Technical specification
    10 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-4-3:1999(Main)
Data requirements for semiconductor die -- Part 4-3: Specific requirements and recommendations - Thermal
SIST-TS ES 59008-4-3:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-6:2006

  • Technical specification
    8 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-6-1:1999(Main)
Data requirements for semiconductor die -- Part 6-1: Exchange data formats and data dictionary - Data exchange - DDX file format
SIST-TS ES 59008-6-1:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-2:2005

  • Technical specification
    38 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-3:1999(Main)
Data requirements for semiconductor die -- Part 3: Mechanical, material and connectivity requirements
SIST-TS ES 59008-3:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005

  • Technical specification
    11 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-2:1999(Main)
Data requirements for semiconductor die -- Part 2: Vocabulary
SIST-TS ES 59008-2:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005

  • Technical specification
    20 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
ES 59008-1:1999(Main)
Data requirements for semiconductor die -- Part 1: General requirements
SIST-TS ES 59008-1:2007

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005

  • Technical specification
    6 pages
    English language
    sale 10% off
    e-Library read for
    1 day
50