Data requirements for semiconductor die -- Part 3: Mechanical, material and connectivity requirements

CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005

Zahtevani podatki za polprevodniška integrirana vezja - 3. del: Mehanske zahteve ter zahteve za materiale in povezljivost

General Information

Status
Withdrawn
Publication Date
15-Sep-1999
Technical Committee
Drafting Committee
Current Stage
6060 - Document made available - Publishing
Start Date
16-Sep-1999
Completion Date
16-Sep-1999

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Technical specification
TS ES 59008-3:2007
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Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TS ES 59008-3:2007
01-januar-2007
Zahtevani podatki za polprevodniška integrirana vezja - 3. del: Mehanske zahteve
ter zahteve za materiale in povezljivost
Data requirements for semiconductor die -- Part 3: Mechanical, material and connectivity
requirements
Ta slovenski standard je istoveten z: ES 59008-3:1999
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST-TS ES 59008-3:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST-TS ES 59008-3:2007

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SIST-TS ES 59008-3:2007
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