IEC/TC 107 - IEC_TC_107

IEC 62668-1:2019 defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC 62668-2. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion. This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016. This edition includes the following significant technical changes with respect to the previous edition: a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-counterfeit requirements b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135; c) added reference to more GAO, OECD and ICC reports d) updated weblinks and other references; e) added new Annex E with figures describing how anti-counterfeit documents can be used in supply chains; f) added a reference to the new IECQ OD 3702 traceability audit; g) added new definition for re-manufactured components with a warning that these are not recommended.

IEC 62668-2:2019, defines requirements for avoiding the use of counterfeit, recycled and fraudulent components when these components are not purchased from the original component manufacturer (OCM) or are purchased from outside of franchised distributor networks for use in the aerospace, defence and high performance (ADHP) industries. This practice is used, as derogation, only when there are no reasonable or practical alternatives. NOTE: Typically this document is used in conjunction with IEC 62239-1 and IEC 62668-1, enabling ADHP industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains. Although developed for the ADHP industry, this document can be used by other high-performance and high-reliability industries, at their discretion. This first edition cancels and replaces the second edition of IEC TS 62668-2 published in 2016. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the second edition of IEC TS 62668-2: a) updates to the risk assessment process, including reference to SAE AS6081; b) updates to the test methods, including reference to the SAE AS6171 test methods published and in development; c) updates in line with IEC 62668-1 for definitions and references to DFARS.

IEC 62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM). This first edition cancels and replaces IEC TS 62239-1 published in 2015. This edition includes the following significant technical changes with respect to the previous edition: a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008; b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference table to SAE EIASTD4899 rev C clauses/ subclauses for guidance purposes only; c) added the analysis of component technical erratum d) updated Bibliography and reference documents

This document, which is in line with IEC/PAS 62435 relating to the management of obsolescence of electronic components, is first of all a practical guide to methods of long duration storage (more than 5 years) which summarizes the existing practices in the industry.

This standard specifies the methods for preparing and assembling the parts to be joined by wire wrapping, and the selection, calibration, use and certification of the wire wrapping tools. The required wire­wrapped connections are illustrated in Figure 1. This type of connection is similar to “Class A preferred” or “modified” connection detailed in MIL STD 1130, and NASA NHB 5300.4(3H). Only tested and qualified wire­wrapped connections are covered by this standard, which lists four wire sizes from 24 AWG to 30 AWG, and three terminal post sizes up to 1,78 mm maximum diagonal. The use of thicker wire and larger terminals are not advised. Thicker wire than 24 AWG is generally multistranded and terminated by soldering (see ECSS Q 70 08) or by crimping (see ECSS Q 70 26). Training and certification requirements for operators and inspectors are defined in 9.7 and in EN 13291 1.