Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan

IEC 62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM). This first edition cancels and replaces IEC TS 62239-1 published in 2015. This edition includes the following significant technical changes with respect to the previous edition: a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008; b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference table to SAE EIASTD4899 rev C clauses/ subclauses for guidance purposes only; c) added the analysis of component technical erratum d) updated Bibliography and reference documents

Luftfahrtelektronik-Prozessmanagement - Managementplan - Teil 1: Erstellung und Überarbeitung eines Managementplanes für elektronische Bauelemente

Gestion des processus pour l'avionique - Plan de gestion - Partie 1: Préparation et maintenance d'un plan de gestion des composants électroniques

l’IEC 62239-1:2018 définit les exigences pour la mise au point d'un plan de gestion des composants électroniques (ECMP) permettant de garantir que tous les composants électroniques de l'équipement du propriétaire du plan sont choisis et appliqués dans le cadre de processus contrôlés, compatibles avec l'application finale, et que les exigences techniques détaillées à l'Article 4 sont satisfaites. En général, le propriétaire d’un plan de gestion des composants électroniques (ECMP) complet est le fabricant d'équipements avioniques d'origine (OEM). Cette première édition annule et remplace la première édition de l’IEC TS 62239-1 parue en 2015. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) ajout de références aux spécifications SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, schémas de composants IECQ, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008; b) remplacement de l’Annexe C (transférée dans l'IEC TR 62240-2) par une table de références croisées avec les articles/paragraphes de la SAE EIASTD4899 rév. C, à titre de recommandation uniquement; c) ajout d’un erratum technique relatif à l’analyse des composants d) mise à jour de la Bibliographie et documents de référence

Upravljanje procesov v avioniki - Načrt upravljanja - 1. del: Priprava in vzdrževanje načrta upravljanja elektronskih komponent

IEC 62239-1:2018 določa zahteve za razvoj načrta upravljanja elektronskih komponent (ECMP), ki strankam zagotavlja, da so vse elektronske komponente v opremi lastnika načrta izbrane in uporabljene v nadzorovanih procesih, združljivih s končno uporabo, in da so izpolnjene tehnične zahteve, navedene v točki 4. Na splošno je lastnik načrta upravljanja elektronskih komponent (ECMP) proizvajalec originalne opreme za letalstvo (OEM).
Prva izdaja razveljavlja in nadomešča standard IEC TS 62239-1, objavljen leta 2015. Ta izdaja vključuje naslednje pomembne tehnične spremembe glede na prejšnjo izdajo:
a)   dodane reference na SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, sheme komponent IECQ, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008;
b)   zamenjan dodatek C (prenesen v IEC TR 62240-2), ki vključuje preglednico za navzkrižno sklicevanje na točke/podtočke standarda SAE EIASTD4899 rev C (samo kot vodilo);
c)   dodana analiza tehnične napake komponente;
d)   posodobljena bibliografija in referenčni dokumenti.

General Information

Status
Published
Publication Date
06-Dec-2018
Current Stage
6060 - Document made available
Due Date
07-Dec-2018
Completion Date
07-Dec-2018

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SLOVENSKI STANDARD
SIST EN IEC 62239-1:2019
01-februar-2019

8SUDYOMDQMHSURFHVRYYDYLRQLNL1DþUWXSUDYOMDQMDGHO3ULSUDYDLQY]GUåHYDQMH

QDþUWDXSUDYOMDQMDHOHNWURQVNLKNRPSRQHQW
Process management for avionics - Management plan - Part 1: Preparation and
maintenance of an electronic components management plan
Luftfahrtelektronik-Prozessmanagement -Managementplan - Teil 1: Erstellung und
Überarbeitung eines Managementplanes für elektronische Bauelemente

Gestion des processus pour l'avionique - Plan de gestion - Partie 1: Préparation et

maintenance d'un plan de gestion des composants électroniques
Ta slovenski standard je istoveten z: EN IEC 62239-1:2018
ICS:
03.100.50 Proizvodnja. Vodenje Production. Production
proizvodnje management
31.020 Elektronske komponente na Electronic components in
splošno general
49.060 /HWDOVNDLQYHVROMVND Aerospace electric
HOHNWULþQDRSUHPDLQVLVWHPL equipment and systems
SIST EN IEC 62239-1:2019 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62239-1:2019
---------------------- Page: 2 ----------------------
SIST EN IEC 62239-1:2019
EUROPEAN STANDARD EN IEC 62239-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2018
ICS 03.100.50; 31.020; 49.060
English Version
Process management for avionics - Management plan - Part 1:
Preparation and maintenance of an electronic components
management plan
(IEC 62239-1:2018)

Gestion des processus pour l'avionique - Plan de gestion - Luftfahrtelektronik-Prozessmanagement - Managementplan

Partie 1: Préparation et maintenance d'un plan de gestion - Teil 1: Erarbeitung und Instandhaltung eines

des composants électroniques Managementplanes für elektronische Bauelemente
(IEC 62239-1:2018) (IEC 62239-1:2018)

This European Standard was approved by CENELEC on 2018-10-29. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62239-1:2018 E
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SIST EN IEC 62239-1:2019
EN IEC 62239-1:2018 (E)
European foreword

The text of document 107/320/CDV, future edition 1 of IEC 62239-1, prepared by IEC/TC 107

"Process management for avionics" was submitted to the IEC-CENELEC parallel vote and approved

by CENELEC as EN IEC 62239-1:2018.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2019-07-29

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2021-10-29

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62239-1:2018 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated:

IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC 60695-11-5 NOTE Harmonized as EN 60695-11-5
IEC 61193-2 NOTE Harmonized as EN 61193-2
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1
IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2
IEC 61760-4 NOTE Harmonized as EN 61760-4
IEC 61967 (series) NOTE Harmonized as EN 61967 (series)
IEC 61967-1 NOTE Harmonized as EN 61967-1
IEC 62435-1 NOTE Harmonized as EN 62435-1
IEC 62132 (series) NOTE Harmonized as EN 62132 (series)
IEC 62402 NOTE Harmonized as EN 62402
IEC 62435-1 NOTE Harmonized as EN 62435-1
ISO 9000 NOTE Harmonized as EN ISO 9000
ISO 9001 NOTE Harmonized as EN ISO 9001
ISO 9004 NOTE Harmonized as EN ISO 9004
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SIST EN IEC 62239-1:2019
EN IEC 62239-1:2018 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 62396 series Process management for avionics - Atmospheric - -
radiation effects
IEC 62396-1 2016 Process management for avionics - Atmospheric - -
radiation effects - Part 1: Accommodation of
atmospheric radiation effects via single event effects
within avionics electronic equipment
IEC/TS 62647-1 - Process management for avionics - Aerospace and - -
defence electronic systems containing lead-free
solder - Part 1: Preparation for a lead-free control plan
GEIA-STD-0005-1 - Performance Standard for Aerospace and High - -
Performance Electronic Systems Containing Lead-
Free Solder
IPC/JEDEC J- - Moisture/Reflow Sensitivity Classification for - -
STD-20 Nonhermetic Solid State Surface Mount Devices
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SIST EN IEC 62239-1:2019
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SIST EN IEC 62239-1:2019
IEC 62239-1
Edition 1.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
Gestion des processus pour l'avionique – Plan de gestion –
Partie 1: Préparation et maintenance d'un plan de gestion des composants
électroniques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-6033-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 62239-1:2019
– 2 – IEC 62239-1:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and abbreviated terms ........................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.2 Abbreviated terms ................................................................................................. 12

4 Technical requirements ................................................................................................. 14

4.1 General ................................................................................................................. 14

4.2 Component selection ............................................................................................ 14

4.2.1 General........................................................................................................ 14

4.2.2 Application conditions for use ...................................................................... 15

4.2.3 Availability and durability ............................................................................. 15

4.2.4 Additional performance ................................................................................ 15

4.2.5 Component identification ............................................................................. 15

4.3 Component application ......................................................................................... 16

4.3.1 General........................................................................................................ 16

4.3.2 Electromagnetic compatibility (EMC) ............................................................ 16

4.3.3 Derating and stress analysis ........................................................................ 16

4.3.4 Thermal analysis .......................................................................................... 18

4.3.5 Mechanical analysis ..................................................................................... 18

4.3.6 Testing, testability, and maintainability ......................................................... 19

4.3.7 Avionics radiation environment .................................................................... 19

4.3.8 Management of lead-free termination finish and soldering ............................ 19

4.3.9 Counterfeited, fraudulent and recycled component avoidance ...................... 20

4.3.10 Moisture and corrosion ................................................................................ 20

4.3.11 Additional customer related application requirements .................................. 20

4.4 Component qualification ........................................................................................ 20

4.4.1 General........................................................................................................ 20

4.4.2 Minimum component qualification requirements ........................................... 21

4.4.3 Original component manufacturer quality management ................................ 21

4.4.4 Original component manufacturer process management approval ................ 21

4.4.5 Demonstration of component qualification .................................................... 22

4.4.6 Qualification of components from a supplier that is not qualified .................. 23

4.4.7 Distributor process management approval ................................................... 24

4.4.8 Subcontractor assembly facility quality and process management

approval ........................................................................................................ 24

4.5 Continuous component quality assurance ............................................................. 25

4.5.1 General quality assurance requirements ...................................................... 25

4.5.2 Ongoing component quality assurance ......................................................... 25

4.5.3 Plan owner in-house continuous monitoring ................................................. 25

4.5.4 Component design and manufacturing process change monitoring .............. 26

4.6 Component dependability ...................................................................................... 26

4.6.1 General........................................................................................................ 26

4.6.2 Component availability and associated risk assessment .............................. 26

4.6.3 Component obsolescence ............................................................................ 27

4.6.4 Proactive measures ..................................................................................... 27

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IEC 62239-1:2018 © IEC 2018 – 3 –

4.6.5 Component obsolescence awareness .......................................................... 27

4.6.6 Reporting ..................................................................................................... 27

4.6.7 Semiconductor reliability, wear out and lifetime ............................................ 28

4.6.8 Reliability assessment ................................................................................. 28

4.7 Component compatibility with the equipment manufacturing process .................... 28

4.8 Component data ................................................................................................... 29

4.8.1 General........................................................................................................ 29

4.8.2 Minimum component data requirements ....................................................... 30

4.9 Configuration control ............................................................................................. 30

4.9.1 General........................................................................................................ 30

4.9.2 Alternative components................................................................................ 30

4.9.3 Alternative sources ...................................................................................... 30

4.9.4 Equipment change documentation ............................................................... 31

4.9.5 Customer notifications and approvals .......................................................... 31

4.9.6 Focal organization ....................................................................................... 31

5 Plan administration requirements ................................................................................... 31

5.1 Plan organization .................................................................................................. 31

5.2 Plan terms and definitions ..................................................................................... 31

5.3 Plan focal point ..................................................................................................... 31

5.3.1 Primary interface ......................................................................................... 31

5.3.2 Plan focal point responsibilities .................................................................... 32

5.4 Plan references..................................................................................................... 32

5.5 Plan applicability ................................................................................................... 32

5.6 Plan implementation ............................................................................................. 32

5.6.1 ECMP compliance ........................................................................................ 32

5.6.2 Plan objectives ............................................................................................ 32

5.6.3 Plan owner's subcontracted activities ........................................................... 33

5.7 Plan acceptance ................................................................................................... 33

5.8 Plan maintenance ................................................................................................. 33

Annex A (informative) Requirement matrix for IEC 62239-1 ................................................. 34

Annex B (informative) Typical qualification requirements and typical component

minimum qualification requirements ...................................................................................... 50

Annex C (informative) IEC 62239-1 cross-references to SAE EIA-STD-4899 for

guidance ............................................................................................................................... 53

Annex D (informative) Guidelines for environmental protection techniques and for

comparison of components specifications ............................................................................. 56

Bibliography .......................................................................................................................... 70

Figure 1 – Suspect components perimeter ............................................................................ 20

Table A.1 – Requirements matrix .......................................................................................... 34

Table B.1 – Typical qualification requirements and typical component minimum

qualification requirements ..................................................................................................... 50

Table C.1 – Cross-reference overview between IEC 62239-1 and SAE EIA-STD-4899,

for guidance .......................................................................................................................... 53

Table D.1 – Environmental protection techniques to be considered during the avionics

design process ..................................................................................................................... 56

Table D.2 – Guidelines for the comparison of internationally available component

specifications – Microcircuits .............................................................................................. 61

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SIST EN IEC 62239-1:2019
– 4 – IEC 62239-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of
an electronic components management plan
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62239-1 has been prepared by IEC technical committee 107:

Process management for avionics.
IEC 62239-1 cancels and replaces IEC TS 62239-1 published in 2015.

This first edition cancels and replaces the first edition of IEC TS 62239-1 published in2015.

This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR
62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA
STD 0008;
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SIST EN IEC 62239-1:2019
IEC 62239-1:2018 © IEC 2018 – 5 –

b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference

table to SAE EIASTD4899 rev C clauses/subclauses for guidance purposes only;
c) added the analysis of component technical erratum in 4.8.2;
d) updated Bibliography and reference documents.
The text of this international standard is based on the following documents:
CDV Report on voting
107/320/CDV 107/333/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 62239 series under the general title Process management for

avionics – Management plan, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
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SIST EN IEC 62239-1:2019
– 6 – IEC 62239-1:2018 © IEC 2018
INTRODUCTION

This document provides the structure for avionics equipment manufacturers, subcontractors,

maintenance facilities, and other aerospace component users to develop their own electronic

component management plan (ECMP), hereinafter also referred to as ‘plan’. This document

states objectives to be accomplished. The plan does not describe specific requirements and

those who prepare plans in compliance with this document will document processes that are

the most effective and efficient for them in accomplishing the objectives of this document. In

order to allow flexibility in implementing and updating the documented processes, plan owners

are encouraged to refer to their own internal process documents instead of including detailed

process documentation within their plans.

NOTE The equipment manufacturer, often called in the industry the original equipment manufacturer (OEM) is in

general considered as the plan owner.
This component management document is intended for aerospace users of electronic

components. This document is not intended for use by the manufacturers of electronic

components. Components selected and managed according to the requirements of a plan

compliant with this document may be approved by the concerned parties for the proposed

application, and for other applications with equal or less severe requirements.

Organizations that prepare such plans may prepare a single plan and use it for all relevant

products supplied by the organization or may prepare a separate plan for each relevant

product or customer.
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SIST EN IEC 62239-1:2019
IEC 62239-1:2018 © IEC 2018 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of
an electronic components management plan
1 Scope

This part of IEC 62239 defines the requirements for developing an electronic components

management plan (ECMP) to guarantee to customers that all of the electronic components in

the equipment of the plan owner are selected and applied in controlled processes compatible

with the end application and that the technical requirements detailed in Clause 4 are

accomplished.

In general, the plan owner of a complete electronic components management plan (ECMP) is

the avionics original equipment manufacturer (OEM).

NOTE SAE EIA-STD-4899 can be used to comply with the requirements of IEC 62239-1 where applicable (see

Annex C), to enable the plan owner to harmonise its plan for both documents.
This document provides an aid in the aerospace certification process.

Although developed for the avionics industry, this process can be applied by other industrial

sectors.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 62396 (all parts), Process management for avionics – Atmospheric radiation effects

IEC 62396-1:2016, Process management for avionics – Atmospheric radiation effects –

Part 1: Accommodation of atmospheric radiation effects via single event effects within

avionics electronic equipment

IEC TS 62647-1, Process management for avionics – Aerospace and defence electronic

systems containing lead-free solder – Part 1: Preparation for a lead-free control plan

GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic

Systems Containing Lead-Free Solder

IPC/JEDEC J-STD-20, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State

Surface Mount Devices
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SIST EN IEC 62239-1:2019
– 8 – IEC 62239-1:2018 © IEC 2018
3 Terms, definitions and abbreviated terms

For the purposes of this document, the following terms, definitions and abbreviated terms

apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

NOTE In their plan, plan owners can use alternative definitions consistent with convention in their company.

3.1 Terms and definitions
3.1.1
environment

applicable environmental conditions (as described in the equipment specification) that the

equipment is able to withstand without loss or degradation in equipment performance

throughout its manufacturing cycle and maintenance life (the length of which is defined by the

plan owner in conjunction with customers)
3.1.2
purchased
bought outside the plan owner's organization, from an independent supplier

Note 1 to entry: This indicates that the plan owner does not manufacture this in-house.

3.1.3
capable
capacity of a component to be used successfully in the intended application
3.1.4
certified
assessed to and compliant with an applicable certification body
3.1.5
characterization

process of testing a sample of components to determine the key electrical parameter values

that can be expected of all produced components of the type tested
3.1.6
componen
...

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