WG 9 - TC 49/WG 9
TC 49/WG 9
General Information
IEC 61837-2:2018 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016.
This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
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IEC 61240:2016 sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection. This edition includes the following significant technical changes with respect to the previous edition:
- outline drawings have been changed from three views (top, front and bottom) to that based on ISO layout in the third-angle projection, in which the view from the right has been added to the top, front and bottom views;
- reference line and geometrical dimensions of the package for enclosures have been changed for practical use;
- information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for frequency control and selection has been included in an annex.
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IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition:
- The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition.
- The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number.
- The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc.
- In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3.
- If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet.
- The configurations of the enclosures were revised as shown in Table 1.
This publication is to be read in conjunction with IEC 61240:2012.
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IEC 61837-4:2015 specifies the outline drawings and terminal lead connections for surface piezoelectric devices with hybrid enclosure outlines and is based on IEC 61240:2012 which standardized layout rules of outline drawings of surface-mounted device. This edition includes the following significant technical changes with respect to the previous edition:
- Outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below, instead of one set consisting of three views as provided in the previous edition.
- The configurations of the enclosures were revised as shown in Table 1.
This publication is to be read in conjunction with IEC 61240:2012.
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Specifies the outline drawings for surface acoustic wave (SAW) filters with leaded enclosures.
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