IEC 61837-3:2015

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures

IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition:
- The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition.
- The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number.
- The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc.
- In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3.
- If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet.
- The configurations of the enclosures were revised as shown in Table 1.
This publication is to be read in conjunction with IEC 61240:2012.

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 3: Enveloppes métalliques

L'IEC 61837-3:2015 est applicable aux enveloppes métalliques normalisées et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence; elle est fondée sur l'IEC 61240, qui a normalisé les règles de tracé des dessins d'encombrement des dispositifs à montage en surface. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- Le dessin d'encombrement est défini comme un ensemble de dessins composé de quatre vues, à savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, la vue de droite ayant été dessinée en option dans l'édition précédente.
- La hauteur du boîtier (G1) a été supprimée, la hauteur totale étant exprimée par la lettre-symbole G ou par un numéro en indice.
- Les dimensions de l'espacement entre les sorties sont présentées par la position centrale des sorties et sa valeur de base e est de 2,54 x n mm (n étant un entier) et 1,27 x n mm pour des dimensions de boîtier inférieures à 6 mm (voir l'IEC 61240:2012, 5.5). Si l'espacement entre les sorties n'est pas un multiple de la valeur de base, un numéro d'indice tel que e1, e2 est associé, par exemple e1, e2, etc. En présence de plusieurs valeurs d'espacement, le numéro en indice est suivi d'un trait d'union et de numéros tels que e1-1, e1-2 , etc.
- Dans les surfaces de contact des sorties, les longueurs de chaque plaquette de sortie sont désormais exprimées avec des valeurs maximales pour les besoins du client. Elles étaient exprimées en valeurs minimales dans l'édition précédente de l'IEC 61837-3.
- En présence de plusieurs enveloppes identiques de hauteur différente, chacune d'elles était exprimée par une barre oblique (/) et un numéro à deux chiffres placé après le nom de type de base. Les références d'identité sont données dans le tableau de la feuille.
- Les configurations des enveloppes ont été révisées comme indiqué au Tableau 1.
Cette publication doit être lue conjointement avec la CEI 61240:2012.

General Information

• Status: Published
• Publication Date: 14-Apr-2015
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
• Drafting Committee: WG 9 - TC 49/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 30-Apr-2015
• Completion Date: 15-Apr-2015

Relations

• Revises: IEC 61837-3:2000 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 3: Enveloppes métalliques

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IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 3: Enveloppes métalliques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-2598-1

– 2 – IEC 61837-3:2015  IEC 2015
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Metal enclosure dimensions. 6
6 Lead connections . 6
7 Designation of metal enclosures . 6
Bibliography . 20

Table 1 – Revised configurations . 6
Table 2 – Designation of metal enclosures . 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures
FOREWORD
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-3 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 2000. It constitutes a
technical revision.
This International Standard is to be read in conjunction with IEC 61240:2012.
This edition includes the following significant technical changes with respect to the previous
edition:
• The outline drawing is defined as one set of drawings consisting of four views, which are the
view from above, the front view, the view from the right, and the view from below; the view
from the right was drawn optionally in the previous edition.

– 4 – IEC 61837-3:2015  IEC 2015
• The height of package (G ) is eliminated, instead total height is expressed by the symbol
letter G or with a subscript number.
• The dimensions of terminal lead spacing are shown by the centre position of the terminal
leads and its basic value e is 2.54 × n mm (n is an integer) and 1,27 × n mm for package
dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not
a multiple of the basic value, a subscript number such as e , e is attached, e.g. e , e , etc.

1 2 1 2
If there are plural spacing values, the subscript number is followed by a hyphen and numbers
such as e , e , etc.
1-1 1-2
• In terminal land areas, the lengths of each terminal pad are now expressed with maximum
values for consumer’s convenience. They were expressed as minimum values in the
previous edition of IEC 61837-3.
• If there are plural identical enclosures with different height, each enclosure was expressed
by a dash (/) and a two-digit number after the basic type name. The identity references are
given in the table of the sheet.
• The configurations of the enclosures were revised as shown in Table 1.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1118/FDIS 49/1140/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures
1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they
apply to SMDs for frequency control and selection in metal enclosures and is based on
IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240:2012, Piezoelectric devices – Preparation of outline drawings of surface mounted
devices (SMD) for frequency control and selection – General rules
3 Configuration of enclosures
The enclosures of the surface-mounted devices are made of metal with the formed lead
terminals based on the descriptive designation system for semiconductors – devices package.
All SMD enclosures described in this part of IEC 61837 are special surface mount types.
Therefore, the following designator is used.
– SMS (Surface-Mounted, Special)
4 Designation of types
The type designator consists of four parts as follows:
B C
A D
A: Configuration symbol of enclosures:
– SMS (Surface-Mounted, Special).
B: Structure of terminal leads
– L: folded leads type;
– J: folded leads type.
If there is a leadless type, it will have no mark.
See Clause 3 of IEC 61240:2012, Classification of SMD.
C: Number of terminal leads
– 6 – IEC 61837-3:2015  IEC 2015
D: 2-digit serial number
5 Metal enclosure dimensions
The dimensions given in this part of IEC 61837 apply to all completed SMD for frequency
control and selection. Only those dimensions are given which meet the requirements of
IEC 61240.
• If there are plural identical enclosures with different height (G), or different length (F), etc.
The symbol letter shall be expressed with a subscript number such as G , G , F , F etc.
1 2 1 2,
• The dimensions of terminal lead spacing shall be shown by the centre position of the
terminal leads and its basic value e is 2,54 × n mm (n is an integer) and 1,27 × n mm for
package dimensions smaller than 6 mm (see IEC 61240:2012, 5.5). If the terminal lead
spacing is not a multiple of the basic value, a subscript number such as e , e shall be
1 2
attached. If there are plural spacing values, the subscript number shall be followed by a
hyphen and numbers such as e , e , etc.
1-1 1-2
• If there are plural identical enclosures with different height, each enclosure was expressed
by the following dash (/) and two digit number after the basic type name. The identity
references are given in the table of the sheet.
6 Lead connections
Since SMS types of enclosures are special SMD type, they won’t have any specified lead
connections. However, lead connections shall always be given in the detail specification under
the agreement with customers.
7 Designation of metal enclosures
Table 2 sets out the designation of the metal enclosures as outlined in the following
specification sheets. All corresponding enclosures are listed in Table 1 below.
Table 1 – Revised configurations
Type Sheet No. Description
SMS-L4/01~03 Sheet 1 Maximum LP was changed from 1,2 to 1,4.
SMS-L4/04~07 Sheet 2 Maximum B was changed from 9,5 to 9,6.
Maximum LP was changed from 1,2 to 1,4.
SMS-J2/01~02 Sheet 12 Maximum B was changed from 4,7 to 5,0.
Minimum K was changed from 0,85 to 0,6.
Table 2 – Designation of metal enclosures
No. Type Sheet No. Description
1 SMS – L4/01
2 SMS – L4/02 Sheet 1 Metal, resistance-welded, four L-lead SMD outline
3 SMS – L4/03
4 SMS – L4/04
5 SMS – L4/05
Sheet 2 Metal, resistance-welded, four L-lead SMD outline
6 SMS – L4/06
7 SMS – L4/07
8 SMS – L3/01
9 SMS – L3/02 Sheet 3 Metal, resistance-welded, three L-lead SMD outline
10 SMS – L3/03
11 SMS – L3/04
Sheet 4 Metal, resistance-welded, three L-lead, SMD outline
12 SMS – L3/05
13 SMS – L3/06
14 SMS – L3/07 Sheet 5 Metal, resistance-welded, three L-lead, SMD outline
15 SMS – L3/08
16 SMS – L3/09
17 SMS – L3/10 Sheet 6 Metal, resistance-welded, three L-lead, SMD outline
18 SMS – L3/11
19 SMS – L3/12
20 SMS – L3/13 Sheet 7 Metal, resistance-welded, three L-lead SMD outline
21 SMS – L3/14
22 SMS – L3/15
23 SMS – L3/16
24 SMS – L3/17
Sheet 8 Metal, resistance-welded, three L-lead, SMD outline
25 SMS – L3/18
26 SMS – L3/19
27 SMS – L3/20
28 SMS – L3/21
29 SMS – L3/22
Sheet 9 Metal, resistance-welded, three L-lead SMD outline
30 SMS – L3/23
31 SMS – L3/24
32 SMS – L3/25
33 SMS – L3/26 Sheet 10 Metal, resistance-welded, three L-lead SMD outline
34 SMS – L3/27
35 SMS – J4/01 Sheet 11 Metal, resistance-welded, plastic frame, four J-lead SMD outline
36 SMS – J2/01
Sheet 12 Metal, resistance-welded, plastic frame, two J-lead SMD outline
37 SMS – J2/02
– 8 – IEC 61837-3:2015  IEC 2015

Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /01
B2 ― ― 6,40 /02
B3 ― ― 8,80 /03
Actual size
F1 ― ― 9,50 /01
F2 ― ― 10,80 /02
F3 ― ― 12,75 /03
G ― ― 4,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,90 Note 2
LP1 0,70 ― 1,40
LP2 1,20 ― 1,80
e ― 1,88 ―
B
e1-1 ― 7,50 ― /01
e1-2 ― 8,80 ― /02
e1-3 ― 10,80 ― /03
b1 ― ― 0,80
b2 ― ― 2,40
l1 ― ― 2,30
l2 ― ― 2,10
y ― ― 0,20
A
s
e
e
y
s b
K3
Metal jacket
b
(see Note 1)
e
e
K1
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, four L-lead SMD
Scale
5:1
outline – Type SMS-L4/01 ~ 03
Sheet 1
L
LP1 P2
G
F
l1
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,05
B1 ― ― 9,60 /04
B2 ― ― 10,70 /05
B3 ― ― 11,40 /06
B4 ― ― 13,50 /07
F1 ― ― 14,30 /04
Actual size F2 ― ― 15,50 /05
F3 ― ― 16,20 /06
F4 ― ― 18,30 /07
G ― ― 5,30
K1 2,90 ― 3,10
K2 0,15 ― 0,30
K3 0,38 ― 1,10 Note 2
LP1 0,70 ― 1,40
LP2 1,00 ― 1,70
e ― 2,44 ―
e1-1 ― 11,80 ― /04
e1-2 ― 13,00 ― /05
e1-3 ― 13,70 ― /06
e1-4 ― 16,00 ― /07
b1 ― ― 5,00
b2 ― ― 1,40
l1 ― ― 1,80
A
l2 ― ― 3,00
y ― ― 0,20
s
y s
e e
K
b
b
Metal jacket
(see Note1)
e e
K
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, four L-lead SMD
Scale
3:1
outline – Type SMS-L4/04 ~ 07
Sheet 2
L
P2 G B
L
P1
F
l
l2 1
K
e
– 10 – IEC 61837-3:2015  IEC 2015

Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /01
B2 ― ― 6,40 /02
Actual size
B3 ― ― 8,80 /03
F1 ― ― 9,50 /01
F2 ― ― 10,80 /02
F3 ― ― 12,75 /03
G ― ― 4,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,90 Note 2
LP1 0,70 ― 1,20
LP2 1,20 ― 1,80
e ― 3,75 ―
e1-1 ― 7,50 ― /01
e1-2 ― 8,80 ― /02
e1-3 ― 10,80 ― /03
b1 ― ― 0,80
b2 ― ― 2,40
l1 ― ― 2,30
l2 ― ― 2,10
A
y ― ― 0,20
s
s
y
b
e
K
Metal jacket
b
(See Note 1)
e
Terminal land areas
K
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/01 ~ 03
Sheet 3
B
G
L L
P1 P2
F
l
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 6,00 /04
B2 ― ― 8,00 /05
F1 ― ― 8,20 /04
F2 ― ― 10,20 /05
G ― ― 3,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,50 Note 2
LP1 0,70 ― 1,20
LP2 1,00 ― 1,30
e 3,50 3,75 4,00
e1-1 ― 6,80 ― /04
e1-2 ― 8,80 ― /05
b1 ― ― 0,80
b2 ― ― 2,60
l1 ― ― 2,10
l2 ― ― 1,70
y ― ― 0,20
A
s
y
s
e
b
K
Metal jacket
(See Note 1)
b
e
K
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD

Scale
5:1
outline – Type SMS-L3/04 ~ 05
Sheet 4
G
B
L L
P1 P2
F
l
l
K
e
– 12 – IEC 61837-3:2015  IEC 2015

Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /06
B2 ― ― 6,00 /07
B3 ― ― 8,00 /08
Actual size
F1 ― ― 6,20 /06
F2 ― ― 8,00 /07
F3 ― ― 10,00 /08
G ― ― 4,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,50 Note 2
LP1 0,70 ― 1,20
LP2 0,80 ― 1,60
e 5,30 5,60 5,90
e1-1 ― 5,00 ― /06
e1-2 ― 5,90 ― /07
e1-3 ― 7,90 ― /08
b1 ― ― 2,60
b2 ― ― 0,80
l1 ― ― 1,70
l2 ― ― 2,10
A
y ― ― 0,20
s
s
y
e b
L
P2
Metal jacket
l
(see Note 1) 1
e
K
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/06 ~ 08
Sheet 5
G
B
L
P1 K
F
b
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /09
B2 ― ― 6,00 /10
B3 ― ― 8,00 /11
F1 ― ― 7,70 /09
F2 ― ― 8,00 /10
Actual size
F3 ― ― 10,00 /11
G ― ― 3,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,50 Note 2
LP1 0,70 ― 1,20
LP2 0,80 ― 1,60
e 5,30 5,60 5,90
e1-1 ― 5,00 ― /09
e1-2 ― 5,90 ― /10
e1-3 ― 7,90 ― /11
b1 ― ― 2,60
b2 ― ― 0,80
l1 ― ― 1,70
l2 ― ― 2,10
y ― ― 0,20
A
s
y
s
e
L
P2
b
Metal jacket
l
(see Note 1)
K
e
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/09 ~ 11
Sheet 6
G
B
K
L
P1
F
b
l1
K
e
– 14 – IEC 61837-3:2015  IEC 2015

Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,05
B1 ― ― 10,70 /12
B2 ― ― 11,40 /13
B3 ― ― 13,50 /14
F1 ― ― 15,50 /12
Actual size
F2 ― ― 16,20 /13
F3 ― ― 18,30 /14
G ― ― 5,30
K1 2,90 3,10
K2 0,15 ― 0,30
K3 0,40 ― 1,10 Note 2
LP1 0,70 ― 1,20
LP2 1,10 ― 1,70
e  4,88
e1-1 ― 13,00 ― /12
e1-2 ― 13,70 ― /13
e1-3 ― 16,00 ― /14
b1 ― ― 3,40
b2 ― ― 1,40
l1 ― ― 1,60
l2 ― ― 2,10
y ― ― 0,20
A
s
y s
e
K
b
b
Metal jacket
(see Note 1)
e
Terminal land areas
K
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD
Scale
3:1
outline – Type SMS-L3/12 ~ 14
Sheet 7
L G
P2
L
P1 B
F
l l
2 1
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,05
B1 ― ― 5,10 /15
B2 ― ― 6,60 /16
B3 ― ― 9,70 /17
B4 ― ― 10,70 /18
B5 ― ― 11,40 /19
Actual size
B6 ― ― 13,50 /20
F1 7,15 ― 7,85 /15
F2 8,65 ― 9,35 /16
F3 10,95 ― 11,65 /17
F4 12,75 ― 13,45 /18
F5 13,45 ― 14,15 /19
F6 15,55 ― 16,25 /20
G ― ― 5,30
K1 1,50 ― 2,00
K2 0,40 ― 0,48
K3 0,40 ― 0,48 Note
LP1 0,40 ― 0,48
LP2 1,50 ― 2,10
e 4,67 4,90 5,08
e1-1 ― 7,05 ― /15
e1-2 ― 8,55 ― /16
e1-3 ― 11,65 ― /17
e1-4 ― 12,65 ― /18
e1-5 ― 13,35 ― /19
e1-6 ― 15,45 ― /20
b1 ― ― 0,70
A b2 ― ― 2,20
l1 ― ― 1,80
l2 ― ― 0,70
y ― ― 0,20
s
y s
e
b
L
P2
l
e
K
Terminal land areas
IEC
NOTE This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD outline – Scale

Type SMS-L3/15 ~ 20 3:1
Sheet 8
B
L
P1 K3
G
F
b
l
K
e
– 16 – IEC 61837-3:2015  IEC 2015
(Voir Note 1)
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /21
B2 ― ― 6,00 /22
B3 ― ― 8,00 /23
B4 ― ― 8,80 /24
Actual size
F1 6,40 ― 7,00 /21
F2 7,30 ― 7,90 /22
F3 9,30 ― 9,90 /23
F4 10,10 ― 10,70 /24
G ― ― 3,80
K1 1,40 ― 1,60
K2 0,40 ― 0,50
K3 0,40 ― 0,50 Note
LP1 0,40 ― 0,50
LP2 1,20 ― 1,60
e 5,00 5,15 5,30
e1-1 ― 6,30 ― /21
e1-2 ― 7,20 ― /22
e1-3 ― 9,20 ― /23
e1-4 ― 10,00 ― /24
b1 ― ― 1,80
b2 ― ― 0,70
l1 ― ― 0,70
A
l2 ― ― 1,80
y ― ― 0,20
s
e
y s
L
P2
b
l
K
e
Terminal land areas
IEC
NOTE This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD outline – Scale

Type SMS-L3/21 ~ 24 5:1
Sheet 9
G B
L K
P1 3
F
b
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /25
B2 ― ― 6,00 /26
B3 ― ― 8,00 /27
Actual size
F1 ― ― 7,20 /25
F2 ― ― 8,10 /26
F3 ― ― 10,10 /27
G ― ― 2,60
K1 1,25 ― 1,35
K2 0,20 ― 0,30
K3 0,30 ― 0,40 Note
LP1 0,20 ― 0,30
LP2 1,20 ― 1,60
e 5,00 5,15 5,30
e1-1 ― 6,90 ― /25
e1-2 ― 7,80 ― /26
e1-3 ― 9,80 ― /27
b1 ― ― 1,80
b2 ― ― 0,70
l1 ― ― 0,70
l2 ― ― 1,80
y ― ― 0,20
A
s
y s
e
b
L
P2
l
e
K
Terminal land areas
IEC
NOTE This portion of the lead may be re-shaped under pressure.

Metal, resistance-welded, three L-lead SMD outline – Scale
Type SMS-L3/25 ~ 27 5:1
Sheet 10
B
L K
P1 3
G
F
b2
l
K
e1
– 18 – IEC 61837-3:2015  IEC 2015

Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 12,00
B ― ― 5,20
F ― ― 5,50
G ― ― 8,20
Actual size
K 0,70 ― 1,40
L 1,00 ― 1,40
B
e ― 4,90 ―
e ― 4,00 ―
b ― ― 2,00
l ― ― 2,00
A
y ― ― 0,15
s
y s
b
e
K
e
Terminal land areas
IEC
Metal, resistance-welded, plastic frame, four J-lead SMD Scale
outline – Type SMS-J4/01 3:1
Sheet 11
L G
B
B
e
F
e
l
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,60
B ― ― 5,00
G ― ― 3,50 /01
Actual size 1
G ― ― 5,00 /02
K1 0,6 ― 1,15
F 11,80 ― 13,50
L 3,30 ― 3,90
B
e ― 8,80 ―
b ― ― 1,35
l ― ― 3,90
y ― ― 0,15
A
F
s
y s
e
l
L
B
e
Terminal land areas
IEC
Metal, resistance-welded, plastic frame, two J-lead

Scale
SMD outline – Type SMS-J2/01 ~ 02
3:1
Sheet 12
K
G
B
b
– 20 – IEC 61837-3:2015  IEC 2015
Bibliography
IEC 60122-2:1983, Quartz crystal units for frequency control and selection – Part 2: Guide to
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