31.080 - Semiconductor devices

IEC 60747-17:2020(E) specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler. It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation. This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision. This edition includes the following significant te...view more

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is
destructive.

This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the sol...view more

This part of IEC 60749 establishes a standard procedure for determining the preconditioning
of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs
representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this
document prior to being submitted to specific in-house reliability testing (qualificati...view more

The contents of the corrigendum of September 2020 have been included in this copy.

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety
tests, as well as the measuring methods for photocouplers.
NOTE The term "optocoupler" can also be used instead of "photocoupler".

IEC 60747-17:2020 specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision.
This edition includes the following significant te...view more

This part of IEC 60749 specifies the procedural requirements for performing valid endurance,
retention and cross-temperature tests based on a qualification specification. Endurance and
retention qualification specifications (for cycle counts, durations, temperatures, and sample
sizes) are specified in JESD47 or are developed using knowledge-based methods such as in
JESD94.

This part of the IEC 62435 series on long-term storage is applied to passive electronic devices
in long-term storage that can be used as part of obsolescence mitigation strategy. Longterm
storage refers to a duration that can be more than 12 months for product scheduled for
storage. Storage typically begins when components are packed at the originating supplier
where the pack date or date code are assigned to the product. It is the responsibility of the
distributor and the customer to contr...view more

This part of IEC 61643 specifies standard test circuits and methods for thyristor surge
suppressor (TSS) components. These surge protective components, SPCs, are specially
formulated thyristors designed to limit overvoltages and divert surge currents by clamping and
switching actions. These SPCs are used in the construction of surge protective devices
(SPDs) and equipment used in Information & Communications Technologies (ICT) networks
with voltages up to AC 1 000 V and DC 1 500 V. This doc...view more

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- inco...view more

IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder...view more

IEC 60749-41:2020 specifies the procedural requirements for performing valid endurance, retention and cross-temperature tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or are developed using knowledge-based methods such as in JESD94.

This document specifies performance requirements for electronic controlgear for use on DC or
AC supplies up to 1 000 V (alternating current at 50 Hz or 60 Hz) and with an output
frequency which can deviate from the supply frequency, associated with LED modules
according to IEC 62031. Controlgear for LED modules specified in this document are
designed to provide constant voltage or current. Deviations from the pure voltage and current
types do not exclude the gear from this document.
NOTE 1...view more

IEC 60747-5-5:2020(E) specifies the terminology, essential ratings, characteristics, safety tests, as well as the measuring methods for photocouplers.
Note: The term "optocoupler" can also be used instead of "photocoupler".
This edition includes the following significant technical changes with respect to the previous edition:
a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5;
b) editorial corrections on the use of VIORM;
c) editorial corrections on ...view more

IEC 62373-1:2020 provides the measurement procedure for a fast BTI (bias temperature instability) test of silicon based metal-oxide semiconductor field-effect transistors (MOSFETs).
This document also defines the terms pertaining to the conventional BTI test method.

IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test proce...view more

The contents of the corrigendum of September 2020 have been included in this copy.

IEC 63068-3:2020 provides definitions and guidance in use of photoluminescence for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies photoluminescence images and emission spectra to enable the detection and categorization of the defects in SiC homoepitaxial wafers.

DAV on 2020-02-28.