Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)

This part of IEC 60749 establishes a standard procedure for determining the preconditioning
of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs
representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this
document prior to being submitted to specific in-house reliability testing (qualification and/or
reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in
accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon
identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore,
the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to
ensure that it does not exceed the temperature at which the components are evaluated.
NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other
packages made with moisture-permeable materials.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen (IEC 60749-30:2020)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité (IEC 60749-30:2020)

IEC 60749-30:2020 est disponible sous forme de IEC 60749-30:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-30:2020 établit une procédure normalisée de détermination du préconditionnement pour les composants pour montage en surface (CMS) non hermétiques avant les essais de fiabilité. Cette méthode d’essai définit une refusion de préconditionnement pour les CMS à l’état solide non hermétiques représentative d’une opération de refusion de soudure multiple industrielle type. Les CMS sont soumis à la séquence de préconditionnement appropriée décrite dans le présent document avant d’être soumis aux essais de fiabilité sur place spécifiques (qualification et/ou surveillance de la fiabilité) pour évaluer la fiabilité à long terme (qui pourrait être affectée par la refusion de soudure). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout du nouvel Article 3; - extension de 6.7 concernant la refusion de soudure; - inclusion de notes explicatives et de clarifications.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 30. del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred preskušanjem zanesljivosti (IEC 60749-30:2020)

General Information

Status
Published
Publication Date
08-Oct-2020
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
07-Oct-2020
Due Date
12-Dec-2020
Completion Date
09-Oct-2020

RELATIONS

Buy Standard

Standard
SIST EN IEC 60749-30:2020
English language
15 pages
sale 10% off
Preview
sale 10% off
Preview

e-Library read for
1 day

Standards Content (sample)

SLOVENSKI STANDARD
SIST EN IEC 60749-30:2020
01-december-2020
Nadomešča:
SIST EN 60749-30:2005
SIST EN 60749-30:2005/A1:2011
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 30. del:
Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred
preskušanjem zanesljivosti (IEC 60749-30:2020)
Semiconductor devices - Mechanical and climatic test methods - Part 30:

Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC

60749-30:2020)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30:
Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor
Zuverlässigkeitsprüfungen (IEC 60749-30:2020)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie

30: Préconditionnement des composants pour montage en surface non hermétiques
avant les essais de fiabilité (IEC 60749-30:2020)
Ta slovenski standard je istoveten z: EN IEC 60749-30:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-30:2020 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 60749-30:2020
---------------------- Page: 2 ----------------------
SIST EN IEC 60749-30:2020
EUROPEAN STANDARD EN IEC 60749-30
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2020
ICS 31.080.01 Supersedes EN 60749-30:2005 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 30: Preconditioning of non-hermetic surface mount devices
prior to reliability testing
(IEC 60749-30:2020)

Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische

mécaniques et climatiques - Partie 30: Préconditionnement Prüfverfahren - Teil 30: Behandlung nicht hermetisch

des composants pour montage en surface non hermétiques verkappter oberflächenmontierbarer Bauelemente vor

avant les essais de fiabilité Zuverlässigkeitsprüfungen
(IEC 60749-30:2020) (IEC 60749-30:2020)

This European Standard was approved by CENELEC on 2020-09-21. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 60749-30:2020 E
---------------------- Page: 3 ----------------------
SIST EN IEC 60749-30:2020
EN IEC 60749-30:2020 (E)
European foreword

The text of document 47/2633(F)/FDIS, future edition 2 of IEC 60749-30, prepared by IEC/TC 47

“Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 60749-30:2020.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2021-06-21

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2023-09-21

document have to be withdrawn

This document supersedes EN 60749-30:2005 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60749-30:2020 was approved by CENELEC as a European

Standard without any modification.
---------------------- Page: 4 ----------------------
SIST EN IEC 60749-30:2020
EN IEC 60749-30:2020 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-4 - Semiconductor devices - Mechanical and EN 60749-4 -
climatic test methods - Part 4: Damp heat,
steady-state, highly accelerated stress test
(HAST)
IEC 60749-5 - Semiconductor devices - Mechanical and EN 60749-5 -
climatic test methods - Part 5: Steady-state
temperature humidity bias life test
IEC 60749-11 - Semiconductor devices - Mechanical and EN 60749-11 -
climatic test methods - Part 11: Rapid
change of temperature - Two-fluid-bath
method
IEC 60749-20 2020 Semiconductor devices - Mechanical and FprEN 60749-20 2020
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 60749-24 - Semiconductor devices - Mechanical and EN 60749-24 -
climatic test methods - Part 24:
Accelerated moisture resistance -
Unbiased HAST
IEC 60749-25 2003 Semiconductor devices - Mechanical and EN 60749-25 2003
climatic test methods - Part 25:
Temperature cycling
IEC 60749-33 - Semiconductor devices - Mechanical and EN 60749-33 -
climatic test methods - Part 33:
Accelerated moisture resistance -
Unbiased autoclave
---------------------- Page: 5 ----------------------
SIST EN IEC 60749-30:2020
---------------------- Page: 6 ----------------------
SIST EN IEC 60749-30:2020
IEC 60749-30
Edition 2.0 2020-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 30: Preconditioning of non-hermetic surface mount devices prior to
reliability testing
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 30: Préconditionnement des composants pour montage en surface non
hermétiques avant les essais de fiabilité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8669-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 60749-30:2020
– 2 – IEC 60749-30:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 6

4 General description ......................................................................................................... 6

5 Test apparatus and materials .......................................................................................... 6

5.1 General ................................................................................................................... 6

5.2 Moisture chamber ................................................................................................... 7

5.3 Solder equipment .................................................................................................... 7

5.4 Optical microscope ................................................................................................. 7

5.5 Electrical test equipment ......................................................................................... 7

5.6 Drying (bake) oven.................................................................................................. 7

5.7 Temperature cycle chamber (optional) .................................................................... 7

6 Procedure ........................................................................................................................ 7

6.1 General ................................................................................................................... 7

6.2 Initial measurements ............................................................................................... 8

6.2.1 Electrical test ................................................................................................... 8

6.2.2 Visual inspection ............................................................................................. 8

6.3 Temperature cycling (optional) ................................................................................ 8

6.4 Drying (bake out) .................................................................................................... 8

6.5 Soak conditions for dry-packed SMDs ..................................................................... 8

6.5.1 General ........................................................................................................... 8

6.5.2 Method A for dry-packed SMDs in accordance with IEC 60749-20 ................... 8

6.5.3 Method B for dry-packed SMDs in accordance with IEC 60749‑20 ................... 8

6.6 Soak conditions for non-dry-packed SMDs in accordance with IEC 60749‑20 .......... 8

6.7 Solder reflow........................................................................................................... 9

6.7.1 Solder reflow procedure ................................................................................... 9

6.7.2 Solder attachment after reflow ......................................................................... 9

6.8 Flux application simulation (optional) .................................................................... 10

6.8.1 Flux application ............................................................................................. 10

6.8.2 Cleaning and drying after flux application ...................................................... 10

6.9 Final measurements .............................................................................................. 10

6.9.1 Electrical test ................................................................................................. 10

6.9.2 Visual inspection ........................................................................................... 10

6.10 Applicable reliability tests...................................................................................... 10

7 Summary ....................................................................................................................... 10

Table 1 – Preconditioning sequence flow – Method A (condition A2) in accordance with

IEC 60749-20 (dry-packed devices) ...................................................................................... 11

Table 2 – Preconditioning sequence flow – Method B (conditions B2 to B6) in

accordance with IEC 60749-20 (dry-packed devices) ............................................................ 11

Table 3 – Preconditioning sequence flow – Conditions A1 and B1 in accordance with

IEC 60749-20 (non dry-packed devices) ............................................................................... 12

---------------------- Page: 8 ----------------------
SIST EN IEC 60749-30:2020
IEC 60749-30:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 30: Preconditioning of non-hermetic surface
mount devices prior to reliability testing
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60749-30 has been prepared by IEC technical committee 47:

Semiconductor devices.
This second edition cancels and replaces the first edition published in 2005 and
Amendment 1:2011. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) inclusion of new Clause 3;
b) expansion of 6.7 on solder reflow;
c) inclusion of explanatory notes and clarifications.
---------------------- Page: 9 ----------------------
SIST EN IEC 60749-30:2020
– 4 – IEC 60749-30:2020 © IEC 2020
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2633/FDIS 47/2644/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60749 series, published under the general title Semiconductor

devices – Mechanical and climatic test methods, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 10 ----------------------
SIST EN IEC 60749-30:2020
IEC 60749-30:2020 © IEC 2020 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 30: Preconditioning of non-hermetic surface
mount devices prior to reliability testing
1 Scope

This part of IEC 60749 establishes a standard procedure for determining the preconditioning

of non-hermetic surface mount devices (SMDs) prior to reliability testing.

The test method defines the preconditioning flow for non-hermetic solid-state SMDs

representative of a typical industry multiple solder reflow operation.

These SMDs are subjected to the appropriate preconditioning sequence described in this

document prior to being submitted to specific in-house reliability testing (qualification and/or

reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in

accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon

identical temperature measurement by both t
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.