ASTM F638-88(1995)e1

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

SCOPE
1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.  
1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

General Information

• Status: Historical
• Publication Date: 31-Dec-2000
• Technical Committee: F01 - Electronics

Relations

• Replaced By: ASTM F638-88(2001) - Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)
• Effective Date: 01-Jan-2001

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or
withdrawn. Contact ASTM International (www.astm.org) for the latest information.
e1
Designation: F 638 – 88 (Reapproved 1995)
AMERICAN SOCIETY FOR TESTING AND MATERIALS
100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Copyright ASTM
Standard Specification for
Fine Aluminum—1 % Magnesium Wire for Semiconductor
Lead-Bonding
This standard is issued under the fixed designation F 638; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
e NOTE—Keywords were added editorially in June 1995.
1. Scope 3.1.5 Spooling, packaging, and marking (see Section 11),
3.1.6 Buyer part number, and
1.1 This specification covers aluminum-1% magnesium al-
3.1.7 Special requirements such as for certificate of compli-
loy wire for internal connections in semiconductor devices and
ance (see Section 10).
is limited to wires of diameter up to and including 0.002 in.
(0.051 mm). For diameters larger than 0.0020 in. (0.051 mm),
4. Physical Requirements
the specifications are to be agreed upon between the purchaser
4.1 Elongation and breaking load ranges for the wire shall
and the supplier.
be specified by the purchaser. The maximum ranges of the
1.2 The values stated in inch-pound units are to be regarded
mechanical properties are listed in Table 1.
as the standard. The values stated in parentheses are for
4.2 Mechanical property requirements in ranges smaller
information only.
than those listed in Table 1 may be specified upon agreement
between the purchaser and the supplier.
2. Referenced Documents
2.1 ASTM Standards:
NOTE 1—The nature of aluminum-1 % magnesium alloy is such that the
mechanical properties of both as-drawn and annealed wires overlap
F 16 Test Methods for Measuring Diameter or Thickness of
2 considerably. It is also possible to vary the properties of the hard wire by
Wire and Ribbon for Electronic Devices and Lamps
changing manufacturing parameters and procedures. For these reasons, no
F 72 Specification for Gold Wire for Semiconductor Lead
distinction is made in this specification between the two types.
Bonding
F 205 Test Method for Measuring Diameter of Fine Wire by
5. Dimensions, Weights, and Permissible Variations
Weighing
5.1 Wire size shall be expressed as wire diameter in decimal
F 219 Test Methods of Testing Fine Round and Flat Wire
fractions of an inch (or millimetres) or as weight per unit
for Electron Devices and Lamps
length.
F 584 Practice for Visual Inspection of Semiconductor Lead
5.2 Tolerances for various size ranges are specified in Table
Bonding Wire
2.
2.2 Military Standard:
5.3 When wire size is expressed in terms of weight, the
MIL-STD-105 Sampling Procedures and Tables for Inspec-
following values shall be used:
tion by Attributes 3
5.3.1 Density of Aluminum-1 % Magnesium—2.7 g/cm
5.3.2 Weight of a 200-mm Length of Wire 0.0254 mm in
3. Ordering Information
Diameter—0.274 mg.
3.1 Orders for material under this specification shall include
6. Surface Finish
the following information:
3.1.1 Quantity,
6.1 The wire surface shall be clean and free of finger oils,
3.1.2 Composition (see Section 7),
lubricant residues, stains, and particulate matter.
3.1.3 Size (diameter) (see Section 5),
6.2 Mechanical damage to the wire surface such as nicks,
3.1.4 Breaking load and elongation (see Section 4),
scratches, and kinks shall be held to a minimum.
6.3 The nature and the extent of defects permitted to be
present on the surface of the wire shall be agreed between the
This specification is under the jurisdiction of ASTM Committee F-1 on
supplier and the purchaser.
Electronics and is the direct responsibility of Subcommittee F 01.07 on Intercon-
nection Bonding Carrier Bonding.
7. Chemical Requirements
Current edition approved May 27, 1988. Published July 1988. Originally
published as F 638 – 82. Last previous edition F 638 – 82.
7.1 The alloy composition shall be 1.00 6 0.15 % magne-
Annual Book of ASTM Standards, Vol 10.04.
sium and between 98.84 and 99.15 % aluminum. All other
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. elements are considered impurities.
F 638
TABLE 1 Elongation and Breaking Load, Aluminum-1 %
9.3 Chemical Analysis—Verify that the chemical require-
Magnesium Alloy
ments are satisfied by means of spectrographic analysis or
other means agreed upon between the purchaser and the
NOTE 1—Select the desired nominal breaking load and elongation for
the wire by specifying a range of mechanical properties that includes the
supplier.
A
desired values.
9.4 Surface Finish—Examine surface finish in accordance
with Practice F 584.
Breaking Load, g Elongation, %
Nominal Diameter, in.
Maximum Maximum
(mm)
min max min max 10. Certification
B C
Range Range
10.1 When agreed upon in writing by the purchaser and the
0.0005 (0.013) 1 5 2 0.5 2.0 1.5
0.0007 (0.018) 4 12 2 0.5 2.5 2.0
supplier, a certification shall be made the basis of acceptance of
0.0010 (0.025) 12 24 3 0.5 4.0 2.5
the material. This shall consist of a statement by the supplier,
0.0012 (0.030) 14 30 3 0.5 4.0 2.5
accompanied by a copy of the test results, that the material has
0.00125 (0.0318) 18 36 3 0.5 4.0 3.0
0.0015 (0.038) 25 60 4 0.5 5.0 3.0
been
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