ASTM D3808-96

Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion

SCOPE
1.1 This test method covers a simple qualitative procedure for quickly screening whether an adhesive will, under recommended application conditions, bond to a given substrate without actually making bonded assemblies.  
1.2 The values stated in SI units are to be regarded as the standard. The values in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 09-Oct-2001
• ICS: 83.180 - Adhesives
• Technical Committee: D14 - Adhesives
• Drafting Committee: D14.40 - Adhesives for Plastics

Relations

• Replaced By: ASTM D3808-01 - Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion
• Effective Date: 10-Oct-2001

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: D 3808 – 96
Standard Test Method for
Qualitative Determination of Adhesion of Adhesives to
Substrates by Spot Adhesion
This standard is issued under the fixed designation D 3808; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 4.4 The mode of failure is readily evident by examining
whether the bond separated adhesively or cohesively, either in
1.1 This test method covers a simple qualitative procedure
the adhesive or substrate.
for quickly screening whether an adhesive will, under recom-
mended application conditions, bond to a given substrate
5. Significance and Use
without actually making bonded assemblies.
5.1 This is a quick, simple, and inexpensive test method for
1.2 The values stated in SI units are to be regarded as the
qualitatively determining, without the need to prepare bonded
standard. The values in parentheses are for information only.
test specimens, whether the adhesive under consideration will
1.3 This standard does not purport to address all of the
bond to a particular substrate. If the results are acceptable, then
safety concerns, if any, associated with its use. It is the
standard quantitative adhesive test procedures can be used to
responsibility of the user of this standard to establish appro-
obtain quantitative measurements of the adhesive’s perfor-
priate safety and health practices and determine the applica-
mance.
bility of regulatory limitations prior to use.
5.2 This test method can also be used to compare relative
2. Referenced Documents adhesion of several adhesives.
5.3 It can be used to determine whether an adhesive will
2.1 ASTM Standards:
2 continue to adhere to the substrate under specified environmen-
D 907 Terminology of Adhesives
tal conditions.
E 171 Specification for Standard Atmospheres for Condi-
3 5.4 It can be used to evaluate adhesion of a particular
tioning and Testing Flexible Barrier Materials
adhesive to a variety of substrates.
3. Terminology 5.5 It can be used to obtain “subjective” comparative data
between several adhesives on a given substrate by noting the
3.1 Definitions—Many of the terms used in this test method
relative ease of failure between the adhesives tested.
are defined in Terminology D 907.
5.6 It should be most applicable to adhesives that cure or set
3.1.1 spot adhesion, n—a qualitative method of determining
when exposed to “air” (ambient, heated, etc.) and could be
adhesion by attempting to pry a “spot” of cured adhesive from
used for anaerobic adhesives if testing is carried out in an
a substrate.
oxygen-free atmosphere.
4. Summary of Test Method
6. Apparatus
4.1 Spots of adhesive (size can vary, but generally about 6
1 6.1 No special equipment is needed for application of the
mm ( ⁄4 in.) in diameter) are placed onto a substrate using the
adhesive to the test substrate(s). When using hot-melt adhe-
application procedure and curing conditions acceptable to both
sives, for example, it would be desirable to have a hand-gun
user and supplier of the adhesive.
applicator or equivalent apparatus to allow deposition of the
4.2 The substrate preparation and environmental exposure
hot-melt at a recommended application temperature. The use of
of the spot of adhesive after cure or setting can be varied as
such equipment is not mandatory as a hot plate can be used to
desired.
melt a quantity of the hot melt to the application temperature in
4.3 The determination of whether an adhesive bonds to the
a deformable container such as an aluminum weighing dish.
substrate is made by simply trying to pry the spot of adhesive
Upon reaching proper temperature, the hot melt can be poured
from the substrate.
onto the substrate after forming a pouring spout
...