ASTM F1227-89(1999)
(Test Method)Test Method for Total Mass Loss of Materials and Condensation of Outgassed Volatiles on Microelectronics-Related Substrates (Withdrawn 2000)
Test Method for Total Mass Loss of Materials and Condensation of Outgassed Volatiles on Microelectronics-Related Substrates (Withdrawn 2000)
SCOPE
1.1 This test method covers various thermoplastics and thermosets routinely used in the microelectronics industry. This test method covers a screening technique to determine volatile content of these materials when exposed to a vacuum environment. Two parameters are measured: total mass loss (TML) and collected volatile condensable materials (CVCM).
1.2 This test method describes the test apparatus and related operating procedures for evaluating the mass loss of materials being subjected to 25°, 70° or 125°C at less than 5 Pa (0.05 mbars) for 24 h. The lowest temperature simulates storage conditions, while the middle and upper temperatures simulate soft bake and hard bake conditions encountered during microelectronics manufacturing. The overall mass loss can be classified into noncondensables and condensables. The latter are characterized herein as being capable of condensing on a silicon wafer, glass plate, aluminum disk or other substrate, maintained at a temperature of 18°C. Note 1-Unless otherwise noted, the tolerances are 18°C + 3°C, 25°C + 1°C, 70°C + 1°C, and 125°C + 1°C.
1.3 Any thermoplastic or thermoset can be tested. The materials may be tested in the "as-received" condition or prepared for test after various curing or manufacturing steps.
1.4 This test method is primarily a screening technique for materials and is not necessarily valid for computing actual contamination on a system or component because of possible differences in configuration, temperatures, and material processing. The three temperatures allow testing with respect to maximum expected service temperature. Also, many polymers cannot be tested at 125°C as they melt or undergo glass transition above 70°C.
1.5 The use of materials that are deemed acceptable in accordance with this test method does not ensure that the system or component will remain uncontaminated. Therefore, subsequent functional, developmental, and qualification tests should be used, as necessary, to ensure that material performance is satisfactory.
1.6 No data is yet available to evaluate minimum sample sizes. Sample sizes as small as 130 mg have been used.
1.7 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
General Information
Standards Content (Sample)
Designation: F 1227 – 89 (Reapproved 1999)
Standard Test Method for
Total Mass Loss of Materials and Condensation of
Outgassed Volatiles on Microelectronics-Related
1
Substrates
This standard is issued under the fixed designation F 1227; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 1.6 No data is yet available to evaluate minimum sample
sizes. Sample sizes as small as 130 mg have been used.
1.1 This test method covers various thermoplastics and
1.7 The values stated in SI units are to be regarded as the
thermosets routinely used in the microelectronics industry. This
standard. The values given in parentheses are for information
test method covers a screening technique to determine volatile
only.
content of these materials when exposed to a vacuum environ-
1.8 This standard does not purport to address all of the
ment. Two parameters are measured: total mass loss (TML)
safety concerns, if any, associated with its use. It is the
and collected volatile condensable materials (CVCM).
responsibility of the user of this standard to establish appro-
1.2 This test method describes the test apparatus and related
priate safety and health practices and determine the applica-
operating procedures for evaluating the mass loss of materials
bility of regulatory limitations prior to use.
being subjected to 25, 70, or 125°C at less than 5 Pa (0.05
mbars) for 24 h. The lowest temperature simulates storage
2. Referenced Documents
conditions, while the middle and upper temperatures simulate
2.1 ASTM Standards:
soft bake and hard bake conditions encountered during micro-
E 595 Test Method for Total Mass Loss and Collected
electronics manufacturing. The overall mass loss can be
Volatile Condensable Materials from Outgassing in a
classified into noncondensables and condensables. The latter
2
Vacuum Environment
are characterized herein as being capable of condensing on a
silicon wafer, glass plate, aluminum disk or other substrate,
3. Terminology
maintained at a temperature of 18°C.
3.1 Definitions:
NOTE 1—Unless otherwise noted, the tolerances are 18°C 6 3°C, 25°C
3.1.1 collected volatile condensable material (CVCM)—the
6 1°C, 70°C 6 1°C, and 125°C 6 1°C.
quantity of outgassed matter from a test specimen that con-
1.3 Any thermoplastic or thermoset can be tested. The denses on a silicon wafer maintained at a specific constant
materials may be tested in the “as-received” condition or
temperature for a specified time. CVCM is expressed as a
prepared for test after various curing or manufacturing steps. percentage of the initial specimen mass and is calculated from
1.4 This test method is primarily a screening technique for
the condensate mass determined from the difference in mass of
materials and is not necessarily valid for computing actual the silicon wafer before and after the test.
contamination on a system or component because of possible
3.1.2 total mass loss (TML)—total mass of material out-
differences in configuration, temperatures, and material pro-
gassed from a specimen that is maintained at a specified
cessing. The three temperatures allow testing with respect to constant temperature and operating pressure for a specified
maximum expected service temperature. Also, many polymers
time. TML is calculated from the mass of the specimen as
cannot be tested at 125°C as they melt or undergo glass measured before and after the test and is expressed as a
transition above 70°C.
percentage of the initial specimen mass.
1.5 The use of materials that are deemed acceptable in
4. Summary of Test Method
accordance with this test method does not ensure that the
system or component will remain uncontaminated. Therefore, 4.1 The test specimen may be a raw material or cut from a
subsequent functional, developmental, and qualification tests device. It may be preferable to obtain samples from completed
should be used, as necessary, to ensure that material perfor- devices, so that any volatiles that are released during the
mance is satisfactory. manufacturing process are not included in TML. A specimen is
added to a clean, preweighed boat and boat and specimen are
weighed. The loaded boat is then inserted into a sample
1
This test method is under the jurisdiction of ASTM Committee E-21 on Space chamber in the copper heating bar. Up to 16 specimens can be
Simulation and Applications of Space Technology and is the direct responsibility of
Subcommittee E21.05 on Contamination.
2
Current edition approved May 26, 1989. Published July 1989. Annual Book of ASTM Standards, Vol 15.03.
Copyright © ASTM, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, United States.
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F 1227
tested simultaneously in the apparatus. The sample chambers
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