ASTM F508-77(1997)e1

Standard Practice for Specifying Thick-Film Pastes

SCOPE
1.1 This practice covers the writing of specifications for thick-film pastes for electronics.  
1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.  
1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.

General Information

• Status: Historical
• Publication Date: 31-Dec-1990
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.03 - Metallic Materials, Wire Bonding, and Flip Chip

Relations

• Replaced By: ASTM F508-77(2002) - Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
• Effective Date: 10-Dec-2002

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn. Contact
ASTM International (www.astm.org) for the latest information.
e1
Designation: F 508 – 77 (Reapproved 1997)
AMERICAN SOCIETY FOR TESTING AND MATERIALS
100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Copyright ASTM
Standard Practice for
Specifying Thick-Film Pastes
This standard is issued under the fixed designation F 508; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
e NOTE—Keywords were added editorially in December l997.
1. Scope profile across the surface of the dried film.
2.3.1.3 Firing Profile—The specification profile for each
1.1 This practice covers the writing of specifications for
specific style of paste.
thick-film pastes for electronics.
2.3.1.4 Firing Atmosphere—For each style of paste and
1.2 The practice provides a guide for the routine procedure
firing profile, the specification should define the firing atmo-
to be followed in specifying for procurement thick-film pastes
sphere.
for use in manufactured circuits. Specific requirements, in-
2.3.1.5 Test Substrate—The specification should specify
tended applications, and test methods should be included or
and identify the composition of the test substrate and the
identified in each paste specification. In addition, each speci-
surface on which the paste is to be deposited.
fication should include basic information to facilitate procure-
2.3.2 Test Pattern—Where applicable, the specification
ment, preparation, quality control, lot shipment identifications,
should include a layout and description of a suitable test pattern
and shipping of such pastes.
for evaluating printed and fired pastes. The specification should
1.3 The practice covers the development of specifications
also include a list and functions of other materials required to
for fireable, thick-film pastes, including resistor, conductor,
perform the specified tests, that is, terminations, leads, etc.
dielectric, and overglaze pastes.
Consideration should be given to compatibility requirements
2. Specification Form and Content
for all materials used.
2.4 Quality Control—The specification should identify the
2.1 Form—Each specification should be prepared in con-
quality control procedures to be employed. Such procedures
formance with Form and Style for ASTM Standards.
should include: a sampling plan, a sequence for each exami-
2.2 Procurement Information—Information pertinent to
nation and test specified, and corresponding requirements for
procurement should include the procuring organization’s
each method of examination or test.
name, location, address, telephone number, and the name of the
2.5 Handling and Storing—Each specification should in-
procurement agent, or anyone else involved in procurement or
clude the method of handling and storing the pastes.
with the technical details of the specifications.
2.6 Performance Tests:
2.3 Technical Information—Each specification should cover
2.6.1 Individual procurement specifications should include
the specific technical details, the performance requirements,
requirements for each selected applicable test, inspection, and
and the precision or accuracy of measurements necessary for
examination listed in Table 1 and Table 2 for the given type of
the producer to supply the thick-film paste specified.
thick-film paste. The specification should include any other
2.3.1 Processing Characteristics:
pertinent tests and inspections to cover special or specific
2.3.1.1 Screen Selection—The particular paste specifica-
applications.
tions should identify the required screen by the mesh count, the
2.6.1.1 The test and inspection equipment specified should
wire size, and the emulsion thickness. Where metal masks are
be of sufficient accuracy and quality to permit the required tests
to be used, the cavity thickness and the cavity-aperture
and inspections to be carried out.
tolerances should be specified. The specification should also
2.6.1.2 The types of visual inspection equipment to be used
state the recommended nominal deposit thickness.
should be specified, including magnification (to be given
2.3.1.2 Drying and Leveling Characteristics—The specifi-
separately for the objective and eyepiece if both are used), the
cation should state the range of drying time, the range of drying
type of light, the intensity, and the direction of the light source.
temperature, and the dried film (leveling) characteristics. The
2.6.1.3 For fired materials, the inspection criteria should
dried film characteristics may be specified by visual examina-
specify the general surface appearance. The number, location,
tion, for such defects as lifting or pinholes, and by a thickness
and maximum size of permissible significant defects such as
pinholes, projections, scratches, and surface contamination
This practice is under the jurisdiction of ASTM Committee F-1 on Electronics,
should be specified for the entire fired area. Whenever possible,
and is the direct responsibility of Subcommittee F01.03 on Metallic Materials.
the inspection criteria should be specific for the intended
Current edition approved May 24, 1977. Published August 1977.
Available from ASTM, 100 Barr Harbor Driv
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