prEN ISO 9455-17
(Main)Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO/DIS 9455-17:2022)
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO/DIS 9455-17:2022)
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Flussmittel zum Weichlöten - Prüfverfahren - Teil 17: Bestimmung des Widerstandes der Oberflächenisolierung, Kammprüfung und elektrochemische Migrationsprüfung von Flussmittelrückständen (ISO/DIS 9455-17:2022)
Flux de brasage tendre - Méthodes d'essai - Partie 17: Essai au peigne et essai de migration électrochimique de résistance d'isolement de surface des résidus de flux (ISO/DIS 9455-17:2022)
L'ISO 9455-17:2002 spécifie une méthode d'essai relative aux effets néfastes pouvant être provoqués par des résidus de flux après brasage tendre ou étamage de coupons d'essai. L'essai est applicable aux flux de type 1 et de type 2, tels que spécifiés dans l'ISO 9454-1, sous forme solide ou liquide, ou sous forme de fil d'apport à flux incorporé, de préformes ou de crème à braser constitués de métal d'apport étain/plomb (Sn/Pb) eutectique ou quasi-eutectique.
Cette méthode d'essai est également applicable aux flux à utiliser avec des métaux d'apport de brasage tendre sans plomb. Toutefois, les températures de brasage peuvent être convenues entre le responsable de l'essai et le client.
Talila za mehko spajkanje - Preskusne metode - 17. del: Preskus odpornosti površine izolacije z glavnikom in preskus elektrokemičnega prenosa talila (ISO/DIS 9455-17:2022)
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN ISO 9455-17:2022
01-oktober-2022
Talila za mehko spajkanje - Preskusne metode - 17. del: Preskus odpornosti
površine izolacije z glavnikom in preskus elektrokemičnega prenosa talila (ISO/DIS
9455-17:2022)
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test
and electrochemical migration test of flux residues (ISO/DIS 9455-17:2022)
Flussmittel zum Weichlöten - Prüfverfahren - Teil 17: Bestimmung des Widerstandes der
Oberflächenisolierung, Kammprüfung und elektrochemische Migrationsprüfung von
Flussmittelrückständen (ISO/DIS 9455-17:2022)
Flux de brasage tendre - Méthodes d'essai - Partie 17: Essai au peigne et essai de
migration électrochimique de résistance d'isolement de surface des résidus de flux
(ISO/DIS 9455-17:2022)
Ta slovenski standard je istoveten z: prEN ISO 9455-17
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
oSIST prEN ISO 9455-17:2022 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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oSIST prEN ISO 9455-17:2022
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oSIST prEN ISO 9455-17:2022
DRAFT INTERNATIONAL STANDARD
ISO/DIS 9455-17
ISO/TC 44/SC 12 Secretariat: DIN
Voting begins on: Voting terminates on:
2022-08-01 2022-10-24
Soft soldering fluxes — Test methods —
Part 17:
Surface insulation resistance comb test and
electrochemical migration test of flux residues
Flux de brasage tendre — Méthodes d'essai —
Partie 17: Essai au peigne et essai de migration électrochimique de résistance d'isolement de surface des
résidus de flux
ICS: 25.160.50
This document is circulated as received from the committee secretariat.
THIS DOCUMENT IS A DRAFT CIRCULATED
FOR COMMENT AND APPROVAL. IT IS
ISO/CEN PARALLEL PROCESSING
THEREFORE SUBJECT TO CHANGE AND MAY
NOT BE REFERRED TO AS AN INTERNATIONAL
STANDARD UNTIL PUBLISHED AS SUCH.
IN ADDITION TO THEIR EVALUATION AS
BEING ACCEPTABLE FOR INDUSTRIAL,
TECHNOLOGICAL, COMMERCIAL AND
USER PURPOSES, DRAFT INTERNATIONAL
STANDARDS MAY ON OCCASION HAVE TO
BE CONSIDERED IN THE LIGHT OF THEIR
POTENTIAL TO BECOME STANDARDS TO
WHICH REFERENCE MAY BE MADE IN
Reference number
NATIONAL REGULATIONS.
ISO/DIS 9455-17:2022(E)
RECIPIENTS OF THIS DRAFT ARE INVITED
TO SUBMIT, WITH THEIR COMMENTS,
NOTIFICATION OF ANY RELEVANT PATENT
RIGHTS OF WHICH THEY ARE AWARE AND TO
PROVIDE SUPPORTING DOCUMENTATION. © ISO 2022
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
DRAFT INTERNATIONAL STANDARD
ISO/DIS 9455-17
ISO/TC 44/SC 12 Secretariat: DIN
Voting begins on: Voting terminates on:
Soft soldering fluxes — Test methods —
Part 17:
Surface insulation resistance comb test and
electrochemical migration test of flux residues
Flux de brasage tendre — Méthodes d'essai —
Partie 17: Essai au peigne et essai de migration électrochimique de résistance d'isolement de surface des
résidus de flux
ICS: 25.160.50
This document is circulated as received from the committee secretariat.
COPYRIGHT PROTECTED DOCUMENT
THIS DOCUMENT IS A DRAFT CIRCULATED
FOR COMMENT AND APPROVAL. IT IS
© ISO 2022
ISO/CEN PARALLEL PROCESSING
THEREFORE SUBJECT TO CHANGE AND MAY
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
NOT BE REFERRED TO AS AN INTERNATIONAL
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on STANDARD UNTIL PUBLISHED AS SUCH.
the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below
IN ADDITION TO THEIR EVALUATION AS
or ISO’s member body in the country of the requester. BEING ACCEPTABLE FOR INDUSTRIAL,
TECHNOLOGICAL, COMMERCIAL AND
ISO copyright office
USER PURPOSES, DRAFT INTERNATIONAL
CP 401 • Ch. de Blandonnet 8
STANDARDS MAY ON OCCASION HAVE TO
BE CONSIDERED IN THE LIGHT OF THEIR
CH-1214 Vernier, Geneva
POTENTIAL TO BECOME STANDARDS TO
Phone: +41 22 749 01 11
WHICH REFERENCE MAY BE MADE IN
Reference number
Email: copyright@iso.org
NATIONAL REGULATIONS.
Website: www.iso.org ISO/DIS 9455-17:2022(E)
RECIPIENTS OF THIS DRAFT ARE INVITED
Published in Switzerland
TO SUBMIT, WITH THEIR COMMENTS,
NOTIFICATION OF ANY RELEVANT PATENT
RIGHTS OF WHICH THEY ARE AWARE AND TO
ii
© ISO 2022 – All rights reserved
PROVIDE SUPPORTING DOCUMENTATION. © ISO 2022
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
Contents Page
Foreword .iv
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 1
5 Reagents . 2
6 Apparatus . 2
7 Inspection of test coupons . 6
7.1 Surface plating . 6
7.1.1 Slivering (thin metal overhang on etch runs) . 6
7.1.2 Plating nodules . . 7
7.1.3 Plating pits . 7
7.2 Surface laminate . 7
8 Sample preparation .7
8.1 Preparation of the flux test solution . 7
8.1.1 Liquid flux samples . 7
8.1.2 Solid flux samples . 7
8.1.3 Flux cored solder wire or preform samples . 7
8.1.4 Solder paste samples . 8
8.1.5 Paste flux samples. 8
8.2 Preparation of the test coupons . 8
8.2.1 Sample identification . 8
8.2.2 Test coupons . 8
8.2.3 Test coupon pre-cleaning . 9
9 Procedure .9
9.1 Methods for connecting test coupons . 9
9.1.1 Board circuitry layout . 9
9.1.2 Preconditioning of SIR test coupons prior to processing (optional) . 10
9.2 Fluxing and soldering test patterns . 11
9.2.1 Liquid and solid flux samples and flux-cored solder wire samples . 11
9.2.2 Soldering using wave solder system . 11
9.2.3 Soldering using static solder pot . 11
9.2.4 Solder paste samples .12
9.2.5 Paste flux samples.12
9.3 Cleaning .12
9.4 SIR measurement .13
9.4.1 High resistance measurement system verification .13
9.4.2 Test coupon measurements . 13
9.5 Electrochemical migration test .13
10 Assessment . .13
11 Precision .14
12 Test report .14
Annex A (informative) SIR testing guidance .15
Annex B (informative) Surface insulation resistance comb test and electrochemical
migration test of flux residues — Qualification test report .17
Bibliography .19
iii
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www.iso.org/patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to
the World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT), see
www.iso.org/iso/foreword.html.
This document was prepared by Technical Committee ISO/TC 44, Welding and allied processes,
Subcommittee SC 12, Soldering and brazing materials.
ISO 9455 consists of the following parts, under the general title Soft soldering fluxes — Test methods:
— Part 1: Determination of non-volatile matter, gravimetric method
— Part 2: Determination of non-volatile matter, ebulliometric method
— Part 3: Determination of acid value, potentiometric and visual titration methods
— Part 5: Copper mirror test
— Part 6: Determination and detection of halide (excluding fluoride) content
— Part 8: Determination of zinc content
— Part 9: Determination of ammonia content
— Part 10: Flux efficacy tests, solder spread method
— Part 11: Solubility of flux residues
— Part 13: Determination of flux spattering
— Part 14: Assessment of tackiness of flux residues
— Part 15: Copper corrosion test
— Part 16: Flux efficacy tests, wetting balance method
— Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
iv
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.html.
v
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oSIST prEN ISO 9455-17:2022
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oSIST prEN ISO 9455-17:2022
DRAFT INTERNATIONAL STANDARD ISO/DIS 9455-17:2022(E)
Soft soldering fluxes — Test methods —
Part 17:
Surface insulation resistance comb test and
electrochemical migration test of flux residues
1 Scope
This document specifies a method of testing for deleterious effects that may arise from flux residues
after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified
in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder
paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead free
solders as agreed between user and supplier (ISO 9453).
NOTE This test method is also applicable to fluxes for use with lead containing and lead-free solders.
However, the soldering temperatures may be adjusted with agreement between tester and customer.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments) applies.
ISO 5725-2, Accuracy (trueness and precision) of measurement methods and results — Part 2: Basic method
for the determination of repeatability and reproducibility of a standard measurement method
ISO 9454-1, Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and
packaging
IEC 61189-5-501, Test methods for electrical materials, printed boards and other interconnection
structures and assemblies — Part 5-501: General test methods for materials and assemblies — Surface
insulation resistance (SIR) testing of solder fluxes
1)
IPC-TM-650 , Test Methods Manual (TM 2.6.3.3 Surface Insulation Resistance, Fluxes) (Test pattern
IPC B 24)
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
4 Principle
The objective of this test method is to characterize fluxes by determining the degradation of electrical
resistance and the electrochemical migration of rigid printed wiring coupon specimens after exposure
to the specified flux. This test is carried out at high humidity and heat conditions under bias voltage.
1) Obtainable from: IPC, 2215 Sanders Road, Northbrook, IL, 60062-6135.
1
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
For fluxes which may leave undesirable residues and hence require cleaning, the results obtained from
the test will depend on the characteristics of the flux residue, substrate, metallization, and also on the
effectiveness of the cleaning operation.
The measurement of surface insulation resistance (SIR) makes use of a printed wiring coupon substrate
having one or more conductive interleaved test patterns. Prior to being subjected to conditioning, the
interleaved test patterns are fluxed, soldered or tinned, and cleaned (when required). The patterns are
then exposed to a controlled environment for a specified time, with an applied voltage. The surface
insulation resistance is measured using insulation test apparatus, at a suitable test voltage while the
test coupons are in the controlled environment.
5 Reagents
In the test use only reagents of recognized analytical grade or higher and only distilled, or deionized
water, with a conductivity of less than 05 µS/cm (resistivity ≥ 20 MΩ).
5.1 Propan‑2‑ol, (CH3)2CHOH or other suitable solvent.
5.2 Cleaning solvent (if required), recommended by the flux manufacturer as suitable for the
removal of post soldering flux residues, or propan-2-ol.
6 Apparatus
Equipment shall be capable of demonstrating repeatability in accordance with the gauge r and R
methodology specified in ISO 5725-2.
6.1 Low profile container, e.g. a Petri dish or a watch glass.
6.2 Drying oven, suitable for use at up to 120 °C ± 3 °C.
6.3 Insulated wire or cable, 1 000 V general purpose wire, temperature rated to 150 °C; primary
insulation of radiation-crosslinked; configuration suitable for equipment in use.
Electromagnetic shielding: For consistent and repeatable results, it is important that all cabling
carrying test signals be encased in an electromagnetic shield. Most often, this is a metallic foil or braid
material. Since SIR measurement often deals with picoamperes of current or less, electromagnetic
coupling (EMC) and other stray electrical fields can unduly affect the test signals. Encasing the signal
lines with a grounded metal dramatically reduces currents due to EMC and other electrical noise. It is
not necessary to individually shield each line, such as in coaxial cabling, but separating voltage supply
lines and current-return lines is recommended. A single EMC shield can be used to encase all current-
return lines.
6.4 Connector, 64-position, glass filled polyester body with the following properties:
The IR (Insulation Resistance) of pin to pin at the connector must have a resistance under climate and
temperature conditions with a minimum of 1012 Ω under test condition. The connector must be able for
use under different test conditions.
— 1,27 mm × 10,67 mm (0,05 in × 0,42 in) on 2,54 mm (0,10 in) centres;
— 32 tabs, gold plated over nickel plate over copper;
— 0,762 µm (0,000 03 in) gold plated post/pin mating end;
— bifurcated beam contacts;
— for coupon thickness of 1,40 mm to 1,78 mm (0,055 in to 0,070 in);
2
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
— capable of resisting temperatures up to 105 °C.
6.5 Test coupon, The test pattern, IPC B53 according to IEC 61189-5-501 ED1 and IPC-TM-650 shown
in Figure 1, shall be used for the test specimen. The 6 comb patterns comprise A and F Patterns = 0,4 mm
line width and 0,2 mm spacing, comprising 5 207 squares (IEC 61189-5-501 ED1); B and E Patterns have
0,4 mm line width and 0,5 mm spacing, comprising 1 038 squares (IPC B24 according to IPC-TM-650); C
and D Patterns have 0,318 mm line width and 0,318 mm spacing, comprising 1 981 squares (Bellcore).
The specimen is approximately 150 mm × 95 mm in size. The conductive patterns shall be either
unpreserved bare copper or finished with electroless nickel gold (ENIG).
— 32 tabs, gold plated over nickel plate over copper;
— 1,27 mm × 10,67 mm (0,05 in × 0,42 in) on 2,54 mm (0,10 in) centres.
The test pattern shall be Table 1 and the test coupon shall be Fig 1:
Table 1 — Test pattern
Type of SIR Test Patterns A and F B and E C and D
Width of conductor 0,4 mm 0,4 mm 0,318 mm
Spacing of conductor 0,2 mm 0,5 mm 0,318 mm
Overlap length 25,4 mm 15,25 mm 15,75 mm
Overlapping spaces 41 34 40
Squares(nominal) 5 207 1 038 1 981
NOTE Spaces are determined by counting the number of overlapping areas per pattern. Squares are
determined by the following formula:
length of overlapn× umber of spaces
= squares
spacing width
Figure 1 — Resistor verification coupon (Reproduced with permission)
3
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
6.6 Soldering equipment.
6.6.1 Flux‑cored solder wire, If cabling is connected by soldering, non-activated flux of ISO 9454-1,
classification 1111, shall be used, tin – lead or lead free solder shall be agreed between user and
supplier conforming to eutectic or near-eutectic tin/lead (S Sn60Pb40E or S Sn63Pb37) or lead free
solder (Sn95,5Ag3Cu0,5 or other lead free solders as agreed between user and supplier (ISO 9453)).
NOTE This wire consists of 60/40 or 63/37 tin/lead solder wire or Sn96,5Ag3Cu0,5 or other lead free solder
wire agreed between user and supplier with a core of non-activated rosin (colophony) flux (classification 1111,
non-activated of ISO 9454-1).
6.6.2 Wave solder system, comprising a wave soldering machine where the solder in the bath shall
be used, tin – lead or lead free solder must be agreed between user and supplier conforming to eutectic
tin/lead (Sn63Pb37) or lead free solder (Sn95,5Ag3Cu0,5 or other lead free solders as agreed between
user and supplier (ISO 9453). The set point temperature shall be maintained to ±5 °C.
6.6.3 Static bath, containing solder to a depth of not less than 40 mm, shall be used, tin – lead or
lead free solder must be agreed between user and supplier, conforming to grade Sn63Pb37E or
Sn96,5Ag3Cu0,5 or other lead free solder agreed between user and supplier. The set point temperature
shall be maintained to ±5 °C.
6.6.4 Reflow oven, with controllable temperature profiling.
6.6.5 Soldering iron.
6.7 Humidity chamber, capable of maintaining environments up to 90 °C with temperature control
of ±2 °C and relative humidity (RH) up to 95 % with control of ±3 % at a specific RH set point when
loaded with test coupons. The chamber shall be constructed with stainless steel inner surfaces and
be well insulated. Some solid state sensors cannot tolerate high temperature and humidity. The
temperature and humidity levels of the test chamber shall be recorded throughout the test, preferably
with independent control sensors.
NOTE If used, independent temperature and humidity sensors should be located in close proximity to the
test coupons. Conformance with these conditions will ensure that uniform test conditions can be maintained
while the chamber is under test load.
6.8 High resistance measurement system, capable of measuring surface insulation resistance
6 12
(SIR) in the range of at least 10 Ω to 10 Ω and with a test and bias voltage supply capable of providing
a variable voltage from 5 V to 100 V dc (±2 %) with a 1 MΩ load. The sample selection system shall be
capable of individually selecting each test pattern under measurement. The system shall incorporate a
1 MΩ current limiting resistor in each current pathway. The tolerance of the total measurement system
10 10 11 11
shall be ±5 % up to 10 Ω ± 10 % between 10 Ω to 10 Ω, and ±20 % above 10 Ω.
6.9 Resistor verification coupon, with the same dimensions as the test coupon with 4 resistors
6 8 10 12
with the values 10 Ω, 10 Ω, 10 Ω and 10 Ω in specific current pathways as shown on Figure 2. It
shall have a protective metal (stainless steel) cover attached with stainless hardware to the grounded
mounting holes on the coupon to protect the resistors from contamination or damage during handling
(see Figure 3).
4
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
a
Test coupon tab connectors.
Figure 2 — Resistor verification coupon
Figure 3 — Resistor verification board with protective cover
5
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
6.10 Soft bristle brush.
6.11 Scapel, doctor blade or equivalent, Cutting tool for solder wire.
6.12 Analytical balance, capable of measuring to an accuracy of 0,000 1 g, for solvent extract method.
6.13 Test coupon fixing device, capable of uniformly spacing coupons (minimum of 15 mm), parallel
to air flow with the connector (if present), in accordance with Figure 4.
a
Air flow.
Figure 4 — IEC TB144 test coupon location with respect to chamber air flow
6.14 Soxhlet extraction apparatus.
7 Inspection of test coupons
7.1 Surface plating
7.1.1 Slivering (thin metal overhang on etch runs)
Copper tracks on test coupons shall be free of slivering since the slivers are prone to breaking off with
the associated possibility of creating electrical short circuits during SIR testing.
NOTE Slivering is sometimes associated with surface plating or etching.
6
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oSIST prEN ISO 9455-17:2022
ISO/DIS 9455-17:2022(E)
7.1.2 Plating nodules
Plating nodules on the edges of etch runs shall be kept to a minimum and in no case shall nodules violate
minimum conductor design electrical spacing requirements. Nodules, if present, shall not be loose and
flake on to the laminate substrate.
7.1.3 Plating pits
All conductors and plated-through lands shall be free of plating pits.
Gold plated card edge connector pads shall be free of plating pits that expose copper or nickel.
7.2 Surface laminate
Measles or crazing of the bare printed coupon, if present, shall not exceed 1 % of the coupon area. There
shall be no more than 25 % reduction in space between electrically uncommon conductors due to
measling or crazing. A separate determination shall be made for each side of the coupon.
NOTE 1 The area of measling or crazing is determined by combining the area of each measle or craze and
dividing by the total area of the printed coupon.
NO
...
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