EN ISO 9453:2020

Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.

Weichlote - Chemische Zusammensetzung und Lieferformen (ISO 9453:2020)

Dieses Dokument legt die Anforderungen für die chemische Zusammensetzung für Weichlote fest, die zwei oder mehr der Elemente Zinn, Blei, Antimon, Kupfer, Silber, Bismut, Zink, Indium und/oder Cadmium enthalten.
Eine Angabe für allgemein erhältliche Lieferformen ist ebenfalls enthalten.

Alliages de brasage tendre - Compositions chimiques et formes (ISO 9453:2020)

Le présent document spécifie les exigences relatives à la composition chimique d'alliages de brasage tendre contenant au moins deux éléments: étain, plomb, antimoine, cuivre, argent, bismuth, zinc, indium et/ou cadmium.
Une indication relative aux formes généralement disponibles est également incluse.

Mehke spajke - Kemijska sestava in oblike (ISO 9453:2020)

General Information

• Status: Published
• Publication Date: 06-Oct-2020
• Withdrawal Date: 29-Apr-2021
• ICS: 25.160.50 - Brazing and soldering
• Technical Committee: CEN/TC 121 - Welding
• Drafting Committee: CEN/TC 121 - Welding
• Current Stage: 6060 - Definitive text made available (DAV) - Publishing
• Start Date: 07-Oct-2020
• Completion Date: 07-Oct-2020
• Ref Project: SIST EN ISO 9453:2020 - Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)

Relations

• Replaces: EN ISO 9453:2014 - Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
• Effective Date: 14-Oct-2020

Overview

EN ISO 9453:2020 - Soft solder alloys: Chemical compositions and forms specifies the chemical composition requirements and common product forms for soft solder alloys. The standard covers alloys that contain two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and cadmium. Published as an ISO document and adopted by CEN (EN ISO 9453:2020), this fourth edition (2020) supersedes the 2014 version and includes updates such as new alloy entries and alignment with IEC alloy naming.

Key topics and technical requirements

• Scope and definitions: Clear definition of “soft solder” (liquidus normally below 450 °C) and batch/unit concepts.
• Chemical composition: Compositions for specified alloys are provided in tabular form (see Table 2 and Table 3). Limits for major and trace elements are given; remainder (“Rem”) is calculated to 100 %.
• Forms of delivery: Typical solder product forms are listed - ingot, slab, stick, bar, rod, wire, pellets, preforms, spheres, ribbons, powder, pastes and creams. Not all alloys are available in every form.
• Unit of product and marking: The standard defines units of product by form (e.g., a single ingot, a reel of wire) and requires batch marking, labelling and packaging details; includes health-and-safety and lead-free / lead-containing markings as applicable.
• Sampling and analysis: Inductively coupled plasma (ICP) is the recommended method for chemical analysis. Spark-OES and AAS are acceptable alternatives if agreed between supplier and purchaser.
• Information notes: Melting/solidus temperatures in the tables are informational only and not prescriptive requirements. Patent and licensing notices are highlighted where applicable.

Applications and practical value

• Ensures consistent solder alloy chemistry for reliable wetting, melting behavior and joint performance in industries such as electronics assembly, electrical connections, plumbing and general metal joining.
• Helps manufacturers and suppliers standardize product specification, labelling and quality control.
• Supports procurement, quality assurance and test laboratories in verifying alloy identity and compliance using ICP or agreed test methods.
• Guides decisions about product form (wire, paste, preform) and traceability requirements for production batches.

Who should use this standard

• Solder manufacturers and alloy producers
• Electronic assemblers, repair shops and OEMs
• Quality managers, metallurgists and testing laboratories
• Procurement specialists and standards/technical committees

Related standards

• IEC 61190-1-3 (alloy short names and chemical composition) - EN ISO 9453:2020 includes an Annex comparing alloy numbers with IEC nomenclature.

Keywords: EN ISO 9453:2020, soft solder alloys, chemical composition, solder forms, ICP analysis, solder marking, solder standards.

Standards Content (Sample)

SLOVENSKI STANDARD
01-december-2020
Nadomešča:
SIST EN ISO 9453:2014
Mehke spajke - Kemijska sestava in oblike (ISO 9453:2020)
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
Weichlote - Chemische Zusammensetzung und Lieferformen (ISO 9453:2020)
Alliages de brasage tendre - Compositions chimiques et formes (ISO 9453:2020)
Ta slovenski standard je istoveten z: EN ISO 9453:2020
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EN ISO 9453
EUROPEAN STANDARD
NORME EUROPÉENNE
October 2020
EUROPÄISCHE NORM
ICS 25.160.50 Supersedes EN ISO 9453:2014
English Version
Soft solder alloys - Chemical compositions and forms (ISO
9453:2020)
Alliages de brasage tendre - Compositions chimiques et Weichlote - Chemische Zusammensetzung und
formes (ISO 9453:2020) Lieferformen (ISO 9453:2020)
This European Standard was approved by CEN on 20 September 2020.

CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this
European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references
concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management
Centre has the same status as the official versions.

CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia,
Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway,
Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and
United Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION

EUROPÄISCHES KOMITEE FÜR NORMUNG

CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN ISO 9453:2020 E
worldwide for CEN national Members.

Contents Page
European foreword . 3

European foreword
This document (EN ISO 9453:2020) has been prepared by Technical Committee ISO/TC 44 "Welding
and allied processes" in collaboration with Technical Committee CEN/TC 121 “Welding and allied
processes” the secretariat of which is held by DIN.
This European Standard shall be given the status of a national standard, either by publication of an
identical text or by endorsement, at the latest by April 2021, and conflicting national standards shall be
withdrawn at the latest by April 2021.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN shall not be held responsible for identifying any or all such patent rights.
This document supersedes EN ISO 9453:2014.
According to the CEN-CENELEC Internal Regulations, the national standards organizations of the
following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland,
Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of
North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the
United Kingdom.
Endorsement notice
The text of ISO 9453:2020 has been approved by CEN as EN ISO 9453:2020 without any modification.

INTERNATIONAL ISO
STANDARD 9453
Fourth edition
2020-09
Soft solder alloys — Chemical
compositions and forms
Alliages de brasage tendre — Compositions chimiques et formes
Reference number
ISO 9453:2020(E)
©
ISO 2020
ISO 9453:2020(E)
© ISO 2020
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting
on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address
below or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: [phone]
Email: [e-mail]
Website: www.iso.org
Published in Switzerland
ii © ISO 2020 – All rights reserved

ISO 9453:2020(E)
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Chemical composition . 1
5 Forms of delivery . 1
5.1 General . 1
5.2 Unit of product . 2
6 Sampling and analysis. 2
7 Marking, labelling and packaging . 2
Annex A (informative) Comparison between alloy numbers in this document and short
names and chemical compositions according to IEC 61190-1-3 .10
Bibliography .13
ISO 9453:2020(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www .iso .org/ patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www .iso .org/
iso/ foreword .html.
This document was prepared by Technical Committee ISO/TC 44, Welding and allied processes,
Subcommittee SC 12, Soldering materials, in collaboration with the European Committee for
Standardization (CEN) Technical Committee CEN/TC 121, Welding, in accordance with the Agreement
on technical cooperation between ISO and CEN (Vienna Agreement).
This fourth edition cancels and replaces the third edition (ISO 9453:2014), which has been technically
revised.
The main changes compared to the previous edition are as follows:
— alloys 303 and 304 have been added to Table 3 and Table A.1;
— Table A.1 has been updated according to IEC 61190-1-3;
— patent information was updated on the relevant ISO web page and Annex B was removed.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html.
Official interpretations of ISO/TC 44 documents, where they exist, are available from this page: https://
committee .iso .org/ sites/ tc44/ home/ interpretation .html.
iv © ISO 2020 – All rights reserved

ISO 9453:2020(E)
Introduction
The International Organization for Standardization (ISO) draws attention to the fact that it is claimed
that compliance with this document may involve the use of a patent.
ISO takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured ISO that he/she is willing to negotiate licences under
reasonable and non-discriminatory terms and conditions with applicants throughout the world. In
this respect, the statement of the holder of this patent right is registered with ISO. Information may be
obtained from the patent database available at www .iso .org/ patents.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights other than those in the patent database. ISO shall not be held responsible for identifying
any or all such patent rights.
INTERNATIONAL STANDARD ISO 9453:2020(E)
Soft solder alloys — Chemical compositions and forms
1 Scope
This document specifies the requirements for chemical composition for soft solder alloys containing
two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at http:// www .electropedia .org/
3.1
soft solder
metallic filler material which is used to join metallic parts and which has a melting temperature
(liquidus) lower than that of the parts to be joined and, usually, lower than 450 °C and which wets the
parent metals
3.2
batch
collection of one or more units of product, made in a single production operation
4 Chemical composition
The chemical composition of the soft solder, sampled and analysed in accordance with Clause 6, shall be
as given for the appropriate material in Table 2 or Table 3.
5 Forms of delivery
5.1 General
Soft solders conforming to this document shall be supplied in one of the following forms: ingot, slab,
stick, bar, rod, wire, pellets, preforms, spheres, ribbons, powder or pastes and creams containing
powder. Solder shall be uniform in quality and free from detrimental conditions such as contamination
or surface oxide that prevent melting and flow in a manner suitable for the intended application.
NOTE 1 Solders supplied in the form of rod, wire, or preforms can be supplied with or without an integral flux,
subject to agreement between the supplier and the purchaser.
NOTE 2 Not all the solder compositions given in the tables are necessarily available in all the product
forms listed.
ISO 9453:2020(E)
5.2 Unit of product
The unit of product used for defining the requirements for the marking of soft solders varies with the
form of the solder (see Table 1).
Table 1 — Variations of unit of product with form of solder
Form of solder Unit of product
Ingot, bar, slab, stick or rod A single ingot, bar, slab, stick or rod
Wire or ribbon A single coil or reel
Preforms and rings, spheres, pellets or powder The individual packaged quantity
Powder in solder pastes The individual packaged quantity
6 Sampling and analysis
The recommended method of analysis for soft solder alloys is induced coupled plasma (ICP). The
methods used shall be agreed between the supplier and the purchaser.
NOTE Other acceptable analysis methods are Spark optical emission spectrometry (Spark-OES) and atomic
absorption spectroscopy (AAS).
7 Marking, labelling and packaging
Each batch of solder supplied in accordance with this document shall be marked with the information
indicated by a cross in Table 4.
The information in Table 4 shall be applied to the product forms as follows:
a) for ingots and slabs: by stamping, or inkjet marking on the surface of each unit of product;
b) for sticks, bars, rods and wire in coil: either on a label securely attached to each unit of product, or
on a label on the package in which the units of product are contained;
c) for wire or ribbon on reels: on a label on each reel;
d) for pellets, performs, spheres, powder, paste or cream: on a label on each individually packaged
quantity;
e) all applicable health and safety markings including lead free marking or lead containing marking;
f) any other information which may be pertinent to the particular solder form.
2 © ISO 2020 – All rights reserved

ISO 9453:2020(E)
Table 2 — Chemical compositions of lead co
...