prEN IEC 61188-6-3:2023

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-3. del: Razmestitev priključkov - Opis razmestitve priključkov skozi luknje komponent

General Information

• Status: Not Published
• Publication Date: 16-Mar-2025
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 4060 - Enquiry results established and sent to TC, SR, BTTF - Enquiry
• Start Date: 17-Nov-2023
• Completion Date: 17-Nov-2023
• Ref Project: oSIST prEN IEC 61188-6-3:2023 - Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 61188-6-3:2023
01-oktober-2023
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-3. del:
Razmestitev priključkov - Opis razmestitve priključkov skozi luknje komponent
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern
design - Description of land pattern for through hole components (THT)
Ta slovenski standard je istoveten z: prEN IEC 61188-6-3:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
oSIST prEN IEC 61188-6-3:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 61188-6-3:2023

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oSIST prEN IEC 61188-6-3:2023
91/1878/CDV
COMMITTEE DRAFT FOR VOTE (CDV)

PROJECT NUMBER:
IEC 61188-6-3 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-08-25 2023-11-17
SUPERSEDES DOCUMENTS:
91/1700/CD, 91/1748/CC

IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In So me Countries”
clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for
submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design -
Description of land pattern for through hole components (THT)

PROPOSED STABILITY DATE: 2025

NOTE FROM TC/SC OFFICERS:
The revised CDV draft was approved.at the TC91 WG12 meeting in June 2023.
Copyright © 2023 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

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oSIST prEN IEC 61188-6-3:2023
IEC CDV 61188-6-3 © IEC 2023 2 91/1878/CDV

1
2 CONTENTS
3
4 FOREWORD . 4
5 INTRODUCTION . 6
6 1 Scope . 7
7 2 Normative references . 7
8 3 Terms and definitions . 7
9 4 Description of a through hole Component . 8
10 4.1 Component body . 8
11 4.2 Component leads . 8
12 5 Padstack . 9
13 5.1 Description . 9
14 5.2 Pad types . 9
15 5.2.1 Solder mask pads . 10
16 5.2.2 Outer layer pads . 10
17 5.2.3 Thermal pads .
...