Telecommunications bonding networks for buildings and other structures

To revise EN 50310:2010 in the light of the recent developments at ISO/IEC JTC 1 level. (EN 50310 was offered to JTC 1 and triggered the first internationally harmonized ISO/IEC deliverable).

Telekommunikationstechnische Potentialausgleichsanlagen für Gebäude und andere Strukturen

Application de liaison équipotentielle et de la mise à la terre dans les locaux avec équipement de technologie de l'information

Izenačitev potencialov in ozemljevanje v stavbah z opremo informacijske tehnologije

Ta evropski standard določa zahteve in podaja priporočila za načrtovanje in
namestitev priključkov (spojev) med različnimi električno prevodnimi elementi v stavbah in drugih konstrukcijah med njihovo izgradnjo ali obnovo z namenom namestitve informacijske tehnologije (IT) in na splošno telekomunikacijske opreme, da bi:
a) zmanjšali tveganje električnih nevarnosti za pravilno delovanje tovrstne opreme in kabelske povezave na najnižjo raven;
b) zagotovili namestitev telekomunikacijske opreme z zanesljivo signalno referenco, ki lahko izboljša odpornost proti elektromagnetnim motnjam (EMI).
Zahteve tega evropskega standarda se uporabljajo za stavbe in druge konstrukcije v območjih, ki so obravnavana v standardu EN 50174-2 (npr. stanovanjski, poslovni, industrijski in podatkovni centri), vendar
so lahko informacije iz tega evropskega standarda v pomoč pri drugih vrstah stavb in
konstrukcij.
OPOMBA: Telekomunikacijski centri (upravljalne stavbe) so obravnavani v standardu ETSI/EN 300 253. Ta evropski standard se ne uporablja za distribucijo napajanja z napetostjo prek 1000 V pri izmeničnem toku. Zahteve za elektromagnetno združljivost (EMC) in varnostne zahteve za napajalno inštalacijo niso zajete v tem evropskem standardu, temveč so obravnavane v drugih standardih in predpisih. Vendar informacije v tem evropskem standardu lahko pripomorejo k izpolnjevanju zahtev teh standardov in predpisov.

General Information

Status
Published
Publication Date
26-May-2016
Current Stage
6060 - Document made available
Due Date
27-May-2016
Completion Date
27-May-2016

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SLOVENSKI STANDARD
SIST EN 50310:2016
01-julij-2016
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SIST EN 50310:2011
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Telecommunications bonding networks for buildings and other structures
Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit
Einrichtungen der Informationstechnik

Application de liaison équipotentielle et de la mise à la terre dans les locaux avec

équipement de technologie de l'information
Ta slovenski standard je istoveten z: EN 50310:2016
ICS:
35.020 Informacijska tehnika in Information technology (IT) in
tehnologija na splošno general
91.140.50 Sistemi za oskrbo z elektriko Electricity supply systems
SIST EN 50310:2016 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 50310:2016
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SIST EN 50310:2016
EUROPEAN STANDARD EN 50310
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2016
ICS 29.120.50; 91.140.50 Supersedes EN 50310:2010
English Version
Telecommunications bonding networks for buildings and other
structures

Application de liaison équipotentielle et de la mise à la terre Anwendung von Maßnahmen für Erdung und

dans les locaux avec équipement de technologie de Potentialausgleich in Gebäuden mit Einrichtungen der

l'information Informationstechnik

This European Standard was approved by CENELEC on 2016-04-11. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 50310:2016 E
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SIST EN 50310:2016
EN 50310:2016 (E)
Contents

European foreword ................................................................................................................................. 4

Introduction ............................................................................................................................................. 6

1 Scope ............................................................................................................................................... 9

2 Normative references ..................................................................................................................... 9

3 Terms, definitions and abbreviations .........................................................................................10

3.1 Terms and definitions ...........................................................................................................10

3.2 Abbreviations ........................................................................................................................12

4 Conformance .................................................................................................................................13

5 Overview of bonding networks ...................................................................................................13

6 Selection of the telecommunications bonding network approach ..........................................15

6.1 Assessment of the impact of the telecommunications bonding network on the

interconnection of telecommunications equipment ..............................................................15

6.2 Telecommunications bonding networks ...............................................................................16

6.3 Telecommunications bonding network performance ............................................................17

7 Common features .........................................................................................................................19

7.1 General .................................................................................................................................19

7.2 Protective bonding networks ................................................................................................19

7.3 Telecommunications entrance facility (TEF) ........................................................................19

7.4 Telecommunications bonding network components ............................................................20

7.5 Cabinets, frames and racks ..................................................................................................21

7.6 Miscellaneous bonding connections .....................................................................................24

7.7 Documentation .....................................................................................................................25

8 Dedicated telecommunications bonding network .....................................................................25

8.1 General .................................................................................................................................25

8.2 Components .........................................................................................................................26

8.3 Implementation .....................................................................................................................30

9 Local telecommunications bonding networks in conjunction with protective bonding

networks ........................................................................................................................................33

9.1 Bonding for local distribution ................................................................................................33

9.2 Telecommunications bonding conductors ............................................................................35

9.3 Bonding for areas of telecommunications equipment concentration ...................................36

10 Local telecommunications bonding networks in conjunction with dedicated

telecommunications bonding networks .....................................................................................36

10.1 Bonding for areas of telecommunications equipment concentration ...................................36

10.2 Telecommunications equipment bonding conductors (TEBC) .............................................37

11 Mesh bonded networks ................................................................................................................38

11.1 General .................................................................................................................................38

11.2 Mesh bonding alternatives....................................................................................................38

11.3 Bonding conductors of a mesh bonding network .................................................................41

11.4 Bonding conductors to the mesh bonding network ..............................................................41

11.5 Supplementary bonding grid (SBG) .....................................................................................42

11.6 System reference potential plane (SRPP) ............................................................................42

Annex A (normative) Maintenance of telecommunications bonding network performance .......45

A.1 General ...........................................................................................................................................45

A.2 Periodic activity ............................................................................................................................45

A.2.1 Schedule ..............................................................................................................................45

A.2.2 Implementation ...................................................................................................................45

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SIST EN 50310:2016
EN 50310:2016 (E)

A.3 Causes of performance deterioration .........................................................................................46

A.3.1 Galvanic corrosion .............................................................................................................46

A.3.2 Requirements ......................................................................................................................46

Bibliography ..........................................................................................................................................47

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SIST EN 50310:2016
EN 50310:2016 (E)
European foreword

This document (EN 50310:2016) was prepared by the CLC/TC 215, “Electrotechnical aspects of

telecommunication equipment”.
The following dates are fixed:
• latest date by which this document has to be (dop) 2017–04–11
implemented at national level by publication of
an identical national standard or by
endorsement
• latest date by which the national standards (dow) 2019–04–11
conflicting with this document have to
be withdrawn
This document supersedes EN 50310:2010.

In 2012, EN 50310:2010 had been offered to ISO/IEC JTC 1/SC 25 “Interconnection of information

technology equipment” as input to the agreed project to seek global harmonization of the technical

requirements for telecommunications bonding networks. This project, ISO/IEC 30129, has been

finished successfully. Thus, TC 215 decided to transpose ISO/IEC 30129 into the fourth edition of

EN 50310 with minimal editorial changes to fit European needs. In this context, also the title of

EN 50310 has been changed to adopt the title of ISO/IEC 30129.
EN 50310 has been produced within the framework of the following considerations.

a) With the ongoing growth of the liberalised telecommunication market, the increasing advent of

private telecommunication network operators, and the flourishing use of networking computers,

the amount of Information Technology equipment installed in buildings and the complexity of

these Information Technology installations are permanently growing.

b) Information Technology equipment is generally installed either as stand-alone equipment (e.g.

personal or network computers, small PBXs), or held in racks, cabinets or other mechanical

structures (e.g. switching systems, transmission systems, mobile base stations).

c) CENELEC/SC 64B „Electrical installations and protection against electric shock – Protection

against thermal effects“ had decided during their meeting in November 1997 not to harmonize

IEC 60364-5-548:1996 “Electrical installations of buildings – Part 5: Selection and erection of

electrical equipment – Section 548: Earthing arrangements and equipotential bonding for

information technology installations”.

d) This European Standard shall give guidance to network operators, equipment providers and

building owners to agree on a standardized bonding configuration that facilitates:

– compliance of the Information Technology Equipment installation with functional requirements

including Electromagnetic Compatibility (EMC) aspects of emission and immunity,
– compatible building installation and equipment provisions,

– installation of new equipment in buildings as well as expansion or replacement of installations

in existing buildings with equipment coming from different suppliers,
– a structured installation practice,
– simple maintenance rules,
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SIST EN 50310:2016
EN 50310:2016 (E)
– contracting on a common basis,
– harmonization in development, manufacturing, installation and operation.
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SIST EN 50310:2016
EN 50310:2016 (E)
Introduction
This European Standard

1) specifies assessment criteria to determine the relevant bonding configurations that are

appropriate,

2) enables the implementation of any bonding configurations that may be necessary by means of

either

– the provision of a bonding network that utilizes the existing protective bonding network for

electrical safety, or

– the provision of a dedicated bonding network for the telecommunications infrastructure.

This standard is intended for
• building architects, owners and managers,

• designers and installers of electrical and telecommunications cabling installations.

Users of this standard should be familiar with all applicable cabling design and installation standards.

Figure 1 and Table 1 show the schematic and contextual relationships between the standards

produced by TC 215 for information technology cabling, namely:

• installation specification, quality assurance, planning and installation practices (EN 50174 series);

• generic cabling design (EN 50173 series);
• application dependent cabling design (e.g. EN 50098 series);
• testing of installed cabling (EN 50346);
• this European Standard (EN 50310).
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SIST EN 50310:2016
EN 50310:2016 (E)

EENN 50098 50098--1:1: C Cususttoommerer pr preemmiisseses EENN 50173 50173--2:2: I Innfforormmatatiion ton teecchnolhnologogyy --

ccablabliing fng foror i infnforormmatatiion ton tecechhnolnologogyy -- GGenereneriicc c cablabliing ng -- OOffffiicce pre preemmiisseses

IISSDDNN b baasisic ac acceccessss
EENN 50173 50173--3:3: I Innfforormmatatiion ton teecchnolhnologogyy --

EENN 50098 50098--2:2: C Cususttoommerer pr preemmiisseses GGenereneriicc c cablabliing ng -- IIndusndusttrriialal pr prememiisseess

EENN 50173 50173--1:1: I Innfforormmatatiion ton teecchnolhnologogyy --
ccablabliing fng foror i infnforormmatatiion ton tecechhnolnologogyy --
EENN 50173 50173--4:4: I Innfforormmatatiion ton teecchnolhnologogyy --
GGenereneriicc c cablabliing ng -- GGenereneralal r requiequirrememententss
2048 2048 kkbbiit/st/s IISSDDNN pr priimmararyy a accccesesss and and
GGenereneriicc c cablabliing ng -- HHomomeses
lleaseased led liine netne netwwororkk i intntererffacacee
EENN 50173 50173--5:5: I Innfforormmatatiion ton teecchnolhnologogyy --
GGenereneriicc c cablabliing ng -- DDatata ca cententrreses
EENN 50173 50173--6:6: I Innfforormmatatiion ton teecchnolhnologogyy --
GGenereneriicc c cablabliing ng –– DDiissttrriibutbuteed Bd Buiuillddiing ng
SSerervviicceses
EENN 50174 50174--1:1: I Innfforormmatatiion ton teecchnolhnologogyy --
EENN 50310: 50310: T Telelececoommmmuniuniccatatiionsons
CCablabliing ing insnsttalalllatatiion on -- SSpecpeciiffiiccatatiion and on and
bondibonding ng netnetwwororkkss f foror bui builldidingsngs and and
qualqualiittyy as asssururancancee
ototherher s sttrrucuctturureses
EENN 50174 50174--2:2: I Innfforormmatatiion ton teecchnolhnologogyy --
CCablabliing ing insnsttalalllatatiion on -- IInsnsttalalllatatiion on

plplannianning and prng and pracacttiicceses i insnsiide buide builldidingsngs --

GGenereneralal r requiequirrememeentntss
EENN 50174 50174--3:3: I Innfforormmatatiion ton teecchnolhnologogyy --
CCablabliing ing insnsttalalllatatiion on -- IInsnsttalalllatatiion on
plplannianning and prng and pracacttiicceses out outssiide buide buillddiingsngs
EENN 50346: 50346: I Innfforormmatatiion ton teecchhnolnologogyy --
CCablabliing ing insnsttalalllatatiion on --
TTesesttiing ofng of i insnsttalallled ced cablabliingng
Figure 1 – Schematic relationship between EN 50310 and other relevant standards
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SIST EN 50310:2016
EN 50310:2016 (E)
Table 1 – Contextual relationship between EN 50310 and other relevant standards
Building design Generic cabling Specification Installation Operation
phase design phase phase phase phase
EN 50310 EN 50173 series EN 50174–1 EN 50174–1
except
EN 50173–4
6 Selection of 4 Structure 4 Requirements 4 Requirements
bonding 5 Channel for specifying for specifying
network performance installations of installations of
7 Cable information information
requirements technology technology
8 Connecting cabling cabling
hardware 5 Requirements
requirements for installers of
9 Requirements information
for cords and technology
jumpers cabling
A Link
performance
limits
Planning
phase
and EN 50174–2 EN 50174–2
EN 50173–4
4 and 5 4 Requirements 5 Requirements
Structure for planning for the
6 Channel installations of installation of
performance information information
8 Cable technology technology
requirements cabling cabling
9 Connecting 6 Segregation of 6 Segregation of
hardware metallic metallic
requirements information information
10 Requirements technology technology
for cords and cabling and cabling and
jumpers mains power mains power
A Link cabling cabling
performance 7 Electricity
limits distribution
systems and
lightning
protection
and and
EN 50174–3 EN 50174–3
and and
(for bonding) (for bonding)
EN 50310 EN 50310
and
EN 50346
4 General
requirements
5 Test
parameters for
balanced
cabling
6 Test
parameters for
optical fibre
cabling
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SIST EN 50310:2016
EN 50310:2016 (E)
1 Scope

This European Standard specifies requirements and provides recommendations for the design and

installation of connections (bonds) between various electrically conductive elements in buildings and

other structures, during their construction or refurbishment, in which information technology (IT) and,

more generally, telecommunications equipment is intended to be installed in order to:

a) minimize the risk to the correct function of that equipment and interconnecting cabling from

electrical hazards;

b) provide the telecommunications installation with a reliable signal reference – which may improve

immunity from electromagnetic interference (EMI).

The requirements of this European Standard are applicable to the buildings and other structures within

premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but

information given in this European Standard may be of assistance for other types of buildings and

structures.

NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253.

This European Standard does not apply to power supply distribution of voltages over AC 1 000 V.

Electromagnetic compatibility (EMC) requirements and safety requirements for power supply

installation are outside the scope of this European Standard and are covered by other standards and

regulations. However, information given in this European Standard may be of assistance in meeting

the requirements of these standards and regulations.
2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

EN 50083 series , Cable networks for television signals, sound signals and interactive services

EN 50174-2:2009, Information technology – Cabling installation – Part 2: Installation planning and

practices inside buildings

EN 50174-2:2009/A1:2011, Information technology – Cabling installation – Part 2: Installation planning

and practices inside buildings

EN 60728 series, Cable networks for television signals, sound signals and interactive services

(IEC 60728 series)

EN 61140, Protection against electric shock - Common aspects for installation and equipment

(IEC 61140)

EN 62305-4, Protection against lightning - Part 4: Electrical and electronic systems within structures

(IEC 62305-4)

HD 60364-4-41, Low-voltage electrical installations – Part 4-41: Protection for safety – Protection

against electric shock (IEC 60364-4-41)

HD 60364-4-444, Low-voltage electrical installations – Part 4-444: Protection for safety – Protection

against voltage disturbances and electromagnetic disturbances (IEC 60364-4-44)
———————
Being partly replaced by EN 60728 series.
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SIST EN 50310:2016
EN 50310:2016 (E)

HD 60364-5-54, Low-voltage electrical installations – Part 5-54: Selection and erection of electrical

equipment – Earthing arrangements, protective conductors and protective bonding conductors

(IEC 60364-5-54)
3 Terms, definitions and abbreviations
3.1 Terms and definitions

For the purposes of this document, the terms and definitions given in EN 50174-2 and the following

apply.
3.1.1
access provider

operator or another entity providing the means to enable external telecommunications services

provision to a subscriber
[SOURCE: EN 50700:2014, 3.1.3]
3.1.2
asymmetric cabling
cabling within which the cable elements are asymmetric (unbalanced)
3.1.3
application

system, with its associated transmission method that is supported by telecommunications cabling

[SOURCE: EN 50173-1:2011, 3.1.5]
3.1.4
backbone bonding conductor

telecommunications bonding connection which interconnects telecommunications bonding backbones

3.1.5
balanced application
application designed and optimized to operate over symmetric cabling
3.1.6
common bonding network

set of interconnected conductive structures that combine the functions of a protective bonding network

and a telecommunications bonding network
3.1.7
equipment bonding conductor

conductor that connects a protective bonding network to an item of telecommunications equipment

3.1.8
main earthing terminal

terminal or busbar which is part of the earthing arrangement of an installation and enabling the electric

connection of a number of conductors for earthing purposes

[SOURCE: IEC 60050-826:2004, 826-13-15, modified – The terms “main earthing busbar main”,

“grounding terminal (US)” and “main grounding busbar (US)” have been deleted.]
3.1.9
mesh isolated bonding network

mesh bonding network with a single point of connection to either the protective bonding network or

another isolated bonding network
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EN 50310:2016 (E)
3.1.10
mesh size

maximum length of conducting material between two adjacent connection points that create the grid of

the telecommunications bonding network
3.1.11
primary bonding busbar

telecommunications bonding connection element, connected to the main earthing terminal, that is

used to attach telecommunications bonding backbone conductors and equipment bonding conductors

3.1.12
protective bonding network
set of interconnected conductive elements to ensure electrical safety

Note 1 to entry: The protective bonding network meets the protective equipotential bonding system as defined in

IEC 60050–195:1998, 195.
3.1.13
rack bonding conductor

conductor that connects a rack bonding busbar or items of equipment within a cabinet, frame or rack

to the telecommunications bonding network within a local area
3.1.14
rack bonding busbar

attachment element within a cabinet, frame or rack or for multiple unit bonding conductors

3.1.15
secondary bonding busbar

telecommunications bonding connection element for telecommunications systems and equipment in

the area, served by a distributor
3.1.16
system block

functional group of equipment depending in its operation and performance on its connection to the

same system reference potential plane, inherent to a mesh bonding network
[SOURCE: ETSI/EN 300 253:2015, 3.1.2]
3.1.17
system reference potential plane

conductive solid plane, as an ideal goal in potential equalizing, that is approached in practice by

horizontal or vertical meshes

Note 1 to entry: The mesh width thereof is adapted to the frequency range to be considered. Horizontal and

vertical meshes may be interconnected to form a grid structure approximating a Faraday cage.

Note 2 to entry: The SRPP facilitates signalling with reference to a common potential.

[SOURCE: ETSI/EN 300 253:2015, 3.1.2]
3.1.18
symmetric cabling

screened or unscreened cabling within which the cable elements comprise balanced pairs or quads

EXAMPLE Twisted pairs or quads.
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SIST EN 50310:2016
EN 50310:2016 (E)
3.1.19
telecommunications bonding backbone

conductor installed within telecommunications pathways that interconnects a primary bonding busbar

to its secondary bonding busbars within the building, and that is intended to minimise potential

differences but not intended to serve as a conductor providing a fault current return path

3.1.20
telecommunications bonding conductor
conductor between the primary bonding busbar and the main earthing terminal
3.1.21
telecommunications bonding network

set of interconnected conductive elements that provide functional equipotential bonding for

telecommunications equipment
3.1.22
telecommunications equipment bonding conductor

conductor that connects a primary or secondary bonding busbar to a supplementary bonding network,

a rack bonding conductor or to an item of telecommunications equipment
3.1.23
telecommunications entrance facility
entrance point where the telecommunications facilities enter the building

Note 1 to entry: The telecommunications entrance facility may also include antenna cable entrances and

electronic equipment serving telecommunications functions.
3.1.24
unbalanced application
application not optimised for transmission over symmetric cabling
3.1.25
unit bonding conductor

conductor that connects the telecommunications equipment within a cabinet, frame or rack to the rack

bonding busbar or to a rack bonding conductor
3.2 Abbreviations
For the purposes of this document, the following abbreviations apply.
a.c. alternating current
BBC Backbone Bonding Conductor
CBN Common Bonding Network
d.c. direct current
EMI ElectroMagnetic Interference
IACS International Annealed Copper Standard
MESH-BN MESH Bonding Network
MESH-IBN MESH Isolated Bonding Network
MET Main Earthing Terminal
PBB Primary Bonding Busbar
PBNC Protective Bonding Network Conductor
RBB Rack Bonding Busbar
RBC Rack Bonding Conductor
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SIST EN 50310:2016
EN 50310:2016 (E)
SBB Secondary Bonding Busbar
SBG Supplementary Bonding Grid
SRPP System Reference Potential Plane
SPC Single Point Of Connection
TBB Telecommunications Bonding Backbone
TBC Telecommunications Bonding Conductor
TEBC Telecommunications Equipment Bonding Conductor
TEF Telecommunications Entrance Facility
TSP Transient Suppression Plate
UBC Unit Bonding Conductor
4 Conformance
For bonding infrastructures to conform to this European Standard
a) an assessment in accordance with Clause 6 shall be undertaken,

b) based on the results of the assessment any necessary bonding shall be implemented as follows

1) the backbone and building entrance bonding shall either

– use the protective bonding network provided that it delivers the performance required by

the assessment of Clause 6, or
– conform to the requirements of Clause 8 for a dedicated bonding system,
2) the local bonding shall either

– conform to Clause 9 in line with the requirements of the assessment of Clause 6, or

– conform to the requirements of Clause 10 for a dedicated telecommunications bonding

system in line with the requirements of the assessment of Clause 6,
3) a mesh bonding network in accordance with Clause 11,

c) the requirements of Clause 7 shall be applied to all telecommunications bonding networks

implemented,

d) the cross-sectional areas of bonding conductors shall conform to the requirements of Clauses 7 to

11,
e) local regulations, including safety, shall be met.

NOTE The proper implementation of the requirements of this European Standard assumes that electrical

installations, protective bonding networks and protective measures against overvoltages are undertaken in

accordance with the local regulations, as appropriate.
5 Overview of bonding networks

This European Standard assumes that buildings, or other structures, containing or intended to contain

telecommunications equipment are of vertical extent (where a backbone connects zones of different

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SIST EN 50310:2016
EN 50310:2016 (E)

floors) and/or horizontal extent (where a backbone connects multiple zones on a floor) and feature, as

follows:
a) one or more entrance facilities,

b) one or more identifiable areas within each zone containing concentrations of telecommunications

equipm
...

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