SIST EN 50310:2016
(Main)Telecommunications bonding networks for buildings and other structures
Telecommunications bonding networks for buildings and other structures
To revise EN 50310:2010 in the light of the recent developments at ISO/IEC JTC 1 level. (EN 50310 was offered to JTC 1 and triggered the first internationally harmonized ISO/IEC deliverable).
Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit Einrichtungen der Informationstechnik
Application de liaison équipotentielle et de la mise à la terre dans les locaux avec équipement de technologie de l'information
Izenačitev potencialov in ozemljevanje v stavbah z opremo informacijske tehnologije
Ta evropski standard določa zahteve in podaja priporočila za načrtovanje in
namestitev priključkov (spojev) med različnimi električno prevodnimi elementi v stavbah in drugih konstrukcijah med njihovo izgradnjo ali obnovo z namenom namestitve informacijske tehnologije (IT) in na splošno telekomunikacijske opreme, da bi:
a) zmanjšali tveganje električnih nevarnosti za pravilno delovanje tovrstne opreme in kabelske povezave na najnižjo raven;
b) zagotovili namestitev telekomunikacijske opreme z zanesljivo signalno referenco, ki lahko izboljša odpornost proti elektromagnetnim motnjam (EMI).
Zahteve tega evropskega standarda se uporabljajo za stavbe in druge konstrukcije v območjih, ki so obravnavana v standardu EN 50174-2 (npr. stanovanjski, poslovni, industrijski in podatkovni centri), vendar
so lahko informacije iz tega evropskega standarda v pomoč pri drugih vrstah stavb in
konstrukcij.
OPOMBA: Telekomunikacijski centri (upravljalne stavbe) so obravnavani v standardu ETSI/EN 300 253. Ta evropski standard se ne uporablja za distribucijo napajanja z napetostjo prek 1000 V pri izmeničnem toku. Zahteve za elektromagnetno združljivost (EMC) in varnostne zahteve za napajalno inštalacijo niso zajete v tem evropskem standardu, temveč so obravnavane v drugih standardih in predpisih. Vendar informacije v tem evropskem standardu lahko pripomorejo k izpolnjevanju zahtev teh standardov in predpisov.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-julij-2016
1DGRPHãþD
SIST EN 50310:2011
,]HQDþLWHYSRWHQFLDORYLQR]HPOMHYDQMHYVWDYEDK]RSUHPRLQIRUPDFLMVNH
WHKQRORJLMH
Telecommunications bonding networks for buildings and other structures
Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit
Einrichtungen der Informationstechnik
Application de liaison équipotentielle et de la mise à la terre dans les locaux avec
équipement de technologie de l'information
Ta slovenski standard je istoveten z: EN 50310:2016
ICS:
35.020 Informacijska tehnika in Information technology (IT) in
tehnologija na splošno general
91.140.50 Sistemi za oskrbo z elektriko Electricity supply systems
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 50310
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2016
ICS 29.120.50; 91.140.50 Supersedes EN 50310:2010
English Version
Telecommunications bonding networks for buildings and other
structures
Application de liaison équipotentielle et de la mise à la terre Anwendung von Maßnahmen für Erdung und
dans les locaux avec équipement de technologie de Potentialausgleich in Gebäuden mit Einrichtungen der
l'information Informationstechnik
This European Standard was approved by CENELEC on 2016-04-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 50310:2016 E
Contents
European foreword . 4
Introduction . 6
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviations .10
3.1 Terms and definitions .10
3.2 Abbreviations .12
4 Conformance .13
5 Overview of bonding networks .13
6 Selection of the telecommunications bonding network approach .15
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment .15
6.2 Telecommunications bonding networks .16
6.3 Telecommunications bonding network performance .17
7 Common features .19
7.1 General .19
7.2 Protective bonding networks .19
7.3 Telecommunications entrance facility (TEF) .19
7.4 Telecommunications bonding network components .20
7.5 Cabinets, frames and racks .21
7.6 Miscellaneous bonding connections .24
7.7 Documentation .25
8 Dedicated telecommunications bonding network .25
8.1 General .25
8.2 Components .26
8.3 Implementation .30
9 Local telecommunications bonding networks in conjunction with protective bonding
networks .33
9.1 Bonding for local distribution .33
9.2 Telecommunications bonding conductors .35
9.3 Bonding for areas of telecommunications equipment concentration .36
10 Local telecommunications bonding networks in conjunction with dedicated
telecommunications bonding networks .36
10.1 Bonding for areas of telecommunications equipment concentration .36
10.2 Telecommunications equipment bonding conductors (TEBC) .37
11 Mesh bonded networks .38
11.1 General .38
11.2 Mesh bonding alternatives.38
11.3 Bonding conductors of a mesh bonding network .41
11.4 Bonding conductors to the mesh bonding network .41
11.5 Supplementary bonding grid (SBG) .42
11.6 System reference potential plane (SRPP) .42
Annex A (normative) Maintenance of telecommunications bonding network performance .45
A.1 General .45
A.2 Periodic activity .45
A.2.1 Schedule .45
A.2.2 Implementation .45
A.3 Causes of performance deterioration .46
A.3.1 Galvanic corrosion .46
A.3.2 Requirements .46
Bibliography .47
European foreword
This document (EN 50310:2016) was prepared by the CLC/TC 215, “Electrotechnical aspects of
telecommunication equipment”.
The following dates are fixed:
• latest date by which this document has to be (dop) 2017–04–11
implemented at national level by publication of
an identical national standard or by
endorsement
• latest date by which the national standards (dow) 2019–04–11
conflicting with this document have to
be withdrawn
This document supersedes EN 50310:2010.
In 2012, EN 50310:2010 had been offered to ISO/IEC JTC 1/SC 25 “Interconnection of information
technology equipment” as input to the agreed project to seek global harmonization of the technical
requirements for telecommunications bonding networks. This project, ISO/IEC 30129, has been
finished successfully. Thus, TC 215 decided to transpose ISO/IEC 30129 into the fourth edition of
EN 50310 with minimal editorial changes to fit European needs. In this context, also the title of
EN 50310 has been changed to adopt the title of ISO/IEC 30129.
EN 50310 has been produced within the framework of the following considerations.
a) With the ongoing growth of the liberalised telecommunication market, the increasing advent of
private telecommunication network operators, and the flourishing use of networking computers,
the amount of Information Technology equipment installed in buildings and the complexity of
these Information Technology installations are permanently growing.
b) Information Technology equipment is generally installed either as stand-alone equipment (e.g.
personal or network computers, small PBXs), or held in racks, cabinets or other mechanical
structures (e.g. switching systems, transmission systems, mobile base stations).
c) CENELEC/SC 64B „Electrical installations and protection against electric shock – Protection
against thermal effects“ had decided during their meeting in November 1997 not to harmonize
IEC 60364-5-548:1996 “Electrical installations of buildings – Part 5: Selection and erection of
electrical equipment – Section 548: Earthing arrangements and equipotential bonding for
information technology installations”.
d) This European Standard shall give guidance to network operators, equipment providers and
building owners to agree on a standardized bonding configuration that facilitates:
– compliance of the Information Technology Equipment installation with functional requirements
including Electromagnetic Compatibility (EMC) aspects of emission and immunity,
– compatible building installation and equipment provisions,
– installation of new equipment in buildings as well as expansion or replacement of installations
in existing buildings with equipment coming from different suppliers,
– a structured installation practice,
– simple maintenance rules,
– contracting on a common basis,
– harmonization in development, manufacturing, installation and operation.
Introduction
This European Standard
1) specifies assessment criteria to determine the relevant bonding configurations that are
appropriate,
2) enables the implementation of any bonding configurations that may be necessary by means of
either
– the provision of a bonding network that utilizes the existing protective bonding network for
electrical safety, or
– the provision of a dedicated bonding network for the telecommunications infrastructure.
This standard is intended for
• building architects, owners and managers,
• designers and installers of electrical and telecommunications cabling installations.
Users of this standard should be familiar with all applicable cabling design and installation standards.
Figure 1 and Table 1 show the schematic and contextual relationships between the standards
produced by TC 215 for information technology cabling, namely:
• installation specification, quality assurance, planning and installation practices (EN 50174 series);
• generic cabling design (EN 50173 series);
• application dependent cabling design (e.g. EN 50098 series);
• testing of installed cabling (EN 50346);
• this European Standard (EN 50310).
EENN 50098 50098--1:1: C Cususttoommerer pr preemmiisseses EENN 50173 50173--2:2: I Innfforormmatatiion ton teecchnolhnologogyy --
ccablabliing fng foror i infnforormmatatiion ton tecechhnolnologogyy -- GGenereneriicc c cablabliing ng -- OOffffiicce pre preemmiisseses
IISSDDNN b baasisic ac acceccessss
EENN 50173 50173--3:3: I Innfforormmatatiion ton teecchnolhnologogyy --
EENN 50098 50098--2:2: C Cususttoommerer pr preemmiisseses GGenereneriicc c cablabliing ng -- IIndusndusttrriialal pr prememiisseess
EENN 50173 50173--1:1: I Innfforormmatatiion ton teecchnolhnologogyy --
ccablabliing fng foror i infnforormmatatiion ton tecechhnolnologogyy --
EENN 50173 50173--4:4: I Innfforormmatatiion ton teecchnolhnologogyy --
GGenereneriicc c cablabliing ng -- GGenereneralal r requiequirrememententss
2048 2048 kkbbiit/st/s IISSDDNN pr priimmararyy a accccesesss and and
GGenereneriicc c cablabliing ng -- HHomomeses
lleaseased led liine netne netwwororkk i intntererffacacee
EENN 50173 50173--5:5: I Innfforormmatatiion ton teecchnolhnologogyy --
GGenereneriicc c cablabliing ng -- DDatata ca cententrreses
EENN 50173 50173--6:6: I Innfforormmatatiion ton teecchnolhnologogyy --
GGenereneriicc c cablabliing ng –– DDiissttrriibutbuteed Bd Buiuillddiing ng
SSerervviicceses
EENN 50174 50174--1:1: I Innfforormmatatiion ton teecchnolhnologogyy --
EENN 50310: 50310: T Telelececoommmmuniuniccatatiionsons
CCablabliing ing insnsttalalllatatiion on -- SSpecpeciiffiiccatatiion and on and
bondibonding ng netnetwwororkkss f foror bui builldidingsngs and and
qualqualiittyy as asssururancancee
ototherher s sttrrucuctturureses
EENN 50174 50174--2:2: I Innfforormmatatiion ton teecchnolhnologogyy --
CCablabliing ing insnsttalalllatatiion on -- IInsnsttalalllatatiion on
plplannianning and prng and pracacttiicceses i insnsiide buide builldidingsngs --
GGenereneralal r requiequirrememeentntss
EENN 50174 50174--3:3: I Innfforormmatatiion ton teecchnolhnologogyy --
CCablabliing ing insnsttalalllatatiion on -- IInsnsttalalllatatiion on
plplannianning and prng and pracacttiicceses out outssiide buide buillddiingsngs
EENN 50346: 50346: I Innfforormmatatiion ton teecchhnolnologogyy --
CCablabliing ing insnsttalalllatatiion on --
TTesesttiing ofng of i insnsttalallled ced cablabliingng
Figure 1 – Schematic relationship between EN 50310 and other relevant standards
Table 1 – Contextual relationship between EN 50310 and other relevant standards
Building design Generic cabling Specification Installation Operation
phase design phase phase phase phase
EN 50310 EN 50173 series EN 50174–1 EN 50174–1
except
EN 50173–4
6 Selection of 4 Structure 4 Requirements 4 Requirements
bonding 5 Channel for specifying for specifying
network performance installations of installations of
7 Cable information information
requirements technology technology
8 Connecting cabling cabling
hardware 5 Requirements
requirements for installers of
9 Requirements information
for cords and technology
jumpers cabling
A Link
performance
limits
Planning
phase
and EN 50174–2 EN 50174–2
EN 50173–4
4 and 5 4 Requirements 5 Requirements
Structure for planning for the
6 Channel installations of installation of
performance information information
8 Cable technology technology
requirements cabling cabling
9 Connecting 6 Segregation of 6 Segregation of
hardware metallic metallic
requirements information information
10 Requirements technology technology
for cords and cabling and cabling and
jumpers mains power mains power
A Link cabling cabling
performance 7 Electricity
limits distribution
systems and
lightning
protection
and and
EN 50174–3 EN 50174–3
and and
(for bonding) (for bonding)
EN 50310 EN 50310
and
EN 50346
4 General
requirements
5 Test
parameters for
balanced
cabling
6 Test
parameters for
optical fibre
cabling
1 Scope
This European Standard specifies requirements and provides recommendations for the design and
installation of connections (bonds) between various electrically conductive elements in buildings and
other structures, during their construction or refurbishment, in which information technology (IT) and,
more generally, telecommunications equipment is intended to be installed in order to:
a) minimize the risk to the correct function of that equipment and interconnecting cabling from
electrical hazards;
b) provide the telecommunications installation with a reliable signal reference – which may improve
immunity from electromagnetic interference (EMI).
The requirements of this European Standard are applicable to the buildings and other structures within
premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but
information given in this European Standard may be of assistance for other types of buildings and
structures.
NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253.
This European Standard does not apply to power supply distribution of voltages over AC 1 000 V.
Electromagnetic compatibility (EMC) requirements and safety requirements for power supply
installation are outside the scope of this European Standard and are covered by other standards and
regulations. However, information given in this European Standard may be of assistance in meeting
the requirements of these standards and regulations.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
1)
EN 50083 series , Cable networks for television signals, sound signals and interactive services
EN 50174-2:2009, Information technology – Cabling installation – Part 2: Installation planning and
practices inside buildings
EN 50174-2:2009/A1:2011, Information technology – Cabling installation – Part 2: Installation planning
and practices inside buildings
EN 60728 series, Cable networks for television signals, sound signals and interactive services
(IEC 60728 series)
EN 61140, Protection against electric shock - Common aspects for installation and equipment
(IEC 61140)
EN 62305-4, Protection against lightning - Part 4: Electrical and electronic systems within structures
(IEC 62305-4)
HD 60364-4-41, Low-voltage electrical installations – Part 4-41: Protection for safety – Protection
against electric shock (IEC 60364-4-41)
HD 60364-4-444, Low-voltage electrical installations – Part 4-444: Protection for safety – Protection
against voltage disturbances and electromagnetic disturbances (IEC 60364-4-44)
———————
1)
Being partly replaced by EN 60728 series.
HD 60364-5-54, Low-voltage electrical installations – Part 5-54: Selection and erection of electrical
equipment – Earthing arrangements, protective conductors and protective bonding conductors
(IEC 60364-5-54)
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in EN 50174-2 and the following
apply.
3.1.1
access provider
operator or another entity providing the means to enable external telecommunications services
provision to a subscriber
[SOURCE: EN 50700:2014, 3.1.3]
3.1.2
asymmetric cabling
cabling within which the cable elements are asymmetric (unbalanced)
3.1.3
application
system, with its associated transmission method that is supported by telecommunications cabling
[SOURCE: EN 50173-1:2011, 3.1.5]
3.1.4
backbone bonding conductor
telecommunications bonding connection which interconnects telecommunications bonding backbones
3.1.5
balanced application
application designed and optimized to operate over symmetric cabling
3.1.6
common bonding network
set of interconnected conductive structures that combine the functions of a protective bonding network
and a telecommunications bonding network
3.1.7
equipment bonding conductor
conductor that connects a protective bonding network to an item of telecommunications equipment
3.1.8
main earthing terminal
terminal or busbar which is part of the earthing arrangement of an installation and enabling the electric
connection of a number of conductors for earthing purposes
[SOURCE: IEC 60050-826:2004, 826-13-15, modified – The terms “main earthing busbar main”,
“grounding terminal (US)” and “main grounding busbar (US)” have been deleted.]
3.1.9
mesh isolated bonding network
mesh bonding network with a single point of connection to either the protective bonding network or
another isolated bonding network
3.1.10
mesh size
maximum length of conducting material between two adjacent connection points that create the grid of
the telecommunications bonding network
3.1.11
primary bonding busbar
telecommunications bonding connection element, connected to the main earthing terminal, that is
used to attach telecommunications bonding backbone conductors and equipment bonding conductors
3.1.12
protective bonding network
set of interconnected conductive elements to ensure electrical safety
Note 1 to entry: The protective bonding network meets the protective equipotential bonding system as defined in
IEC 60050–195:1998, 195.
3.1.13
rack bonding conductor
conductor that connects a rack bonding busbar or items of equipment within a cabinet, frame or rack
to the telecommunications bonding network within a local area
3.1.14
rack bonding busbar
attachment element within a cabinet, frame or rack or for multiple unit bonding conductors
3.1.15
secondary bonding busbar
telecommunications bonding connection element for telecommunications systems and equipment in
the area, served by a distributor
3.1.16
system block
functional group of equipment depending in its operation and performance on its connection to the
same system reference potential plane, inherent to a mesh bonding network
[SOURCE: ETSI/EN 300 253:2015, 3.1.2]
3.1.17
system reference potential plane
conductive solid plane, as an ideal goal in potential equalizing, that is approached in practice by
horizontal or vertical meshes
Note 1 to entry: The mesh width thereof is adapted to the frequency range to be considered. Horizontal and
vertical meshes may be interconnected to form a grid structure approximating a Faraday cage.
Note 2 to entry: The SRPP facilitates signalling with reference to a common potential.
[SOURCE: ETSI/EN 300 253:2015, 3.1.2]
3.1.18
symmetric cabling
screened or unscreened cabling within which the cable elements comprise balanced pairs or quads
EXAMPLE Twisted pairs or quads.
3.1.19
telecommunications bonding backbone
conductor installed within telecommunications pathways that interconnects a primary bonding busbar
to its secondary bonding busbars within the building, and that is intended to minimise potential
differences but not intended to serve as a conductor providing a fault current return path
3.1.20
telecommunications bonding conductor
conductor between the primary bonding busbar and the main earthing terminal
3.1.21
telecommunications bonding network
set of interconnected conductive elements that provide functional equipotential bonding for
telecommunications equipment
3.1.22
telecommunications equipment bonding conductor
conductor that connects a primary or secondary bonding busbar to a supplementary bonding network,
a rack bonding conductor or to an item of telecommunications equipment
3.1.23
telecommunications entrance facility
entrance point where the telecommunications facilities enter the building
Note 1 to entry: The telecommunications entrance facility may also include antenna cable entrances and
electronic equipment serving telecommunications functions.
3.1.24
unbalanced application
application not optimised for transmission over symmetric cabling
3.1.25
unit bonding conductor
conductor that connects the telecommunications equipment within a cabinet, frame or rack to the rack
bonding busbar or to a rack bonding conductor
3.2 Abbreviations
For the purposes of this document, the following abbreviations apply.
a.c. alternating current
BBC Backbone Bonding Conductor
CBN Common Bonding Network
d.c. direct current
EMI ElectroMagnetic Interference
IACS International Annealed Copper Standard
MESH-BN MESH Bonding Network
MESH-IBN MESH Isolated Bonding Network
MET Main Earthing Terminal
PBB Primary Bonding Busbar
PBNC Protective Bonding Network Conductor
RBB Rack Bonding Busbar
RBC Rack Bonding Conductor
SBB Secondary Bonding Busbar
SBG Supplementary Bonding Grid
SRPP System Reference Potential Plane
SPC Single Point Of Connection
TBB Telecommunications Bonding Backbone
TBC Telecommunications Bonding Conductor
TEBC Telecommunications Equipment Bonding Conductor
TEF Telecommunications Entrance Facility
TSP Transient Suppression Plate
UBC Unit Bonding Conductor
4 Conformance
For bonding infrastructures to conform to this European Standard
a) an assessment in accordance with Clause 6 shall be undertaken,
b) based on the results of the assessment any necessary bonding shall be implemented as follows
1) the backbone and building entrance bonding shall either
– use the protective bonding network provided that it delivers the performance required by
the assessment of Clause 6, or
– conform to the requirements of Clause 8 for a dedicated bonding system,
2) the local bonding shall either
– conform to Clause 9 in line with the requirements of the assessment of Clause 6, or
– conform to the requirements of Clause 10 for a dedicated telecommunications bonding
system in line with the requirements of the assessment of Clause 6,
or
3) a mesh bonding network in accordance with Clause 11,
c) the requirements of Clause 7 shall be applied to all telecommunications bonding networks
implemented,
d) the cross-sectional areas of bonding conductors shall conform to the requirements of Clauses 7 to
11,
e) local regulations, including safety, shall be met.
NOTE The proper implementation of the requirements of this European Standard assumes that electrical
installations, protective bonding networks and protective measures against overvoltages are undertaken in
accordance with the local regulations, as appropriate.
5 Overview of bonding networks
This European Standard assumes that buildings, or other structures, containing or intended to contain
telecommunications equipment are of vertical extent (where a backbone connects zones of different
floors) and/or horizontal extent (where a backbone connects multiple zones on a floor) and feature, as
follows:
a) one or more entrance facilities,
b) one or more identifiable areas within each zone containing concentrations of telecommunications
equipment (e.g. spaces associated with the generic cabling distributors of standards supported by
EN 50174-2),
c) areas in each zone within which telecommunications equipment is distributed (e.g. locations
associated with the generic cabling outlets of standards supported by EN 50174-2).
For the purposes of this European Standard
1) the term “backbone” refers to connections between the areas of concentrations of
telecommunications equipment and between any given area of concentration and a main earthing
terminal (MET),
2) the term “local” refers to connections between a given area of concentration of
telecommunications equipment and the area of distributed telecommunications equipment which
it serves or other connections within that area.
This is shown schematically in Figure 2 for telecommunications equipment distribution and
telecommunications bonding network terminology.
Figure 2 – Schematic of telecommunications equipment distribution
and associated bonding connections
The objective of this European Standard is, following the completion of the assessment of Clause 6, to
ensure that backbone and local bonding networks
– minimize d.c. and a.c. potential differences in order to reduce the risk to the correct function of
telecommunications equipment interconnected by metallic cabling,
– have adequate a.c. and radio frequency performance to provide the telecommunications
installation with a reliable signal reference and improved resistance to EMI.
It should be noted that failure to implement correct telecommunications bonding networks can act
against this objective.
6 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment
The requirements applied to a telecommunications bonding network depend upon the intended type of
connectivity between the telecommunications equipment within and between the zones of Figure 2.
The mesh bonded network of Clause 11 is intended to support the most demanding requirements of
both cabling media and the applications supported over those media. The mesh bonded network
provides complete flexibility in relation to the types and locations of telecommunications equipment
that may be installed (subject to the transmission performance limits of the applications when using
the selected telecommunications cabling). This is further enhanced by the installation of power
distribution systems conforming to TN-S as described in the HD 60364 series of standards.
The installation of such a telecommunications bonding network is most easily implemented during
construction or refurbishment of a building or structure. However, within an existing building
a) the cost and complexity of installing a telecommunications bonding network that will support the
requirements of applications operating over asymmetric cabling between any two points in a
building may be prohibitive,
b) the implementation of an all-optical network has no implications for the telecommunications
bonding network but would substantially impact on the cost of transmission and terminal
equipment and may not be viable for all intended applications.
Therefore an assessment has to be made based on a balance between complexity of the
telecommunications bonding network and the type of cabling media and the application supported
over those media between and within the zones described in Figure 2. This assessment has also to
take into consideration the transmission performance requirements of the applications when using the
selected telecommunications cabling.
The comparative sensitivity of the various types of cabling media and the applications supported using
them to a lack of bonding network performance (d.c. resistance and impedance) is shown in Table 2.
Table 2 – Sensitivity of cabling media to bonding network performance
Sensitivity to
bonding
Cabling medium
networking
performance
Asymmetric cabling or High
symmetric cabling
(unbalanced
applications)
Symmetric cabling
(screened or unscreened
with balanced
applications)
Optical fibre cabling
Low
Based upon the outcome of this assessment, the appropriate requirements of this standard shall be
applied to the relevant infrastructures to be used to provide an adequate telecommunications bonding
network as detailed in Table 3.
Table 3 – Telecommunications bonding network requirements
Transmission
(subject to maximum channel length limits)
Media Between zones Within a zone
Using the protective d.c. resistance and d.c. resistance and
bonding network impedance control impedance control
requirements of requirements of
Asymmetric cabling or
6.3.1.1 Clause 9
symmetric cabling
(unbalanced
Using a dedicated d.c. resistance and d.c. resistance and
applications)
telecommunications impedance control impedance control of
bonding network requirements of Clause 10
6.3.1.2
Using the protective d.c. resistance d.c. resistance control
bonding network requirements of requirements of
Symmetric cabling
6.3.1.1 Clause 9
(screened or
unscreened with
Using a dedicated d.c. resistance d.c. resistance control
balanced applications)
telecommunications requirements of of Clause 10
bonding network 6.3.1.2
Optical fibre cabling No requirements No requirements
6.2 Telecommunications bonding networks
Telecommunications equipment is generally connected to a protective bonding network that meets
basic safety requirements in accordance with the HD 60364 series. If the design or measured
performance of the protective bonding network fails to meet the requirements of 6.3 then either
a) supplementary telecommunications bonding solutions shall be employed as defined in Clauses 8,
9, 10 or 11, or
b) restrictions shall apply in relation to the interconnection of telecommunications equipment as
described in Clause 6.
For the construction of a new building, or structure, and when it is desired to employ the most flexible
approach for the accommodation of telecommunications equipment then the mesh bonded network of
Clause 11 shall be applied provided that the lightning protection is in accordance with EN 62305-4.
NOTE Where other lightning protection has been installed, including “isolated lightning protection”
according to EN 62305–3, specific restrictions can be applicable to the implementation of the telecommunications
cabling, the telecommunications bonding network and the lightning protection.
Where the requirements of Clause 11 are determined to be inappropriate but an effective
telecommunications bonding network is required then
1) Clause 8 provides requirements and recommendations for the construction of a dedicated
telecommunications backbone bonding network,
2) Clause 9 provides requirements and recommendations for the construction of a local
telecommunications bonding network for connection to protective bonding networks,
3) Clause 10 provides requirements and recommendations for the construction of a local
telecommunications bonding network for connection to a dedicated telecommunications backbone
bonding network.
6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks
Protective bonding networks may provide adequate performance for the telecommunications
infrastructure. Where a protective bonding network is found not to comply with the requirements of
6.3.2.1 and 6.3.2.2, options for its improvement should be considered before decisions are taken in
relation to the implementation of the telecommunications bonding network.
The backbone protective bonding network is considered to connect the primary electrical power
distribution units within each zone to the main earthing terminal (MET).
For a backbone protective bonding network to be considered adequate for a telecommunications
bonding network, it shall meet requirements for impedance of 6.3.2.1 and the d.c. conductor
resistance as detailed in 6.3.2.2.
With each zone, the local protective bonding network shall have one of the forms as described in
Clause 9. The requirements for the supplementary telecommunications bonding networks are
described in Clause 9.
For a local protective bonding network to be considered adequate for a telecommunications bonding
network, it shall meet requirements for impedance of 6.3.2.1 and the d.c. conductor resistance as
detailed in 6.3.2.2.
6.3.1.2 Dedicated telecommunications bonding networks
When the protective bonding network fails to provide adequate performance for the
telecommunications bonding infrastructure or other factors take precedence then a dedicated
telecommunications bonding network shall be installed in accordance with Clause 8 and Clause 10.
For a dedicated backbone bonding network to be considered adequate for a telecommunications
bonding network it shall meet requirements for impedance of 6.3.2.1 and the d.c. conductor resistance
as detailed in 6.3.2.3.
The dedicated bonding network extends from the backbone into each zone via a local
telecommunications bonding network. The requirements for the supplementary telecommunications
bonding networks are described in Clause 10.
For a local bonding network to be considered adequate for a telecommunications bonding network it
shall meet requirements for impedance of 6.3.2.1 and the d.c. conductor resistance as detailed in
6.3.2.3.
6.3.2 Requirements
6.3.2.1 General requirements
The bonding network shall have busbars with sufficient capacity for the attachment of planned
telecommunications equipment and cabling.
If required by the approach taken to the bonding network (see 6.1), adequate impedance performance
of the bonding network requires that
a) the pathways in which the bonding network is installed are close to the pathways in which the
telecommunications network is installed to reduce loop area inductance to improve high
frequency performance,
b) there is sufficient and easy access to add supplemental bonding conductors for impedance
control as described in Clauses 7, 8, 9 and 10 to improve the high frequency performance of the
protective bonding network.
6.3.2.2 Protective bonding networks
The protective bonding network shall comply with local safety requirements and provide a safe
environment for the telecommunications installers and equipment.
The d.c. resistance between points of a protective bonding network shall meet the requirements of
Table 4.
Table 4 – DC resistance requirements for protective bonding networks
Requirement
Connections between
maximum
mΩ/m
All telecommunications
equipment and closest
1,67
protective bonding network
terminal
6.3.2.3 Dedicated bonding networks
The d.c. resistance between points of the telecommunications bonding network shall meet the
requirements of Table 5.
Table 5 – DC resistance requirements for dedicated telecommunications
bonding networks
Requirement
Connections between maximum
mΩ/m
Any point of the bonding network and the MET 1,67
Any primary bonding busbar (PBB) and a connected 1,67
secondary bonding busbar (SBB)
Any point of connection to the bonding network within 1,67
a zone and the connected secondary bonding busbar
(SBB)
Primary bonding busbar (PBB) or secondary bonding 1,67
busbar (SBB) to structural steel
6.3.3 DC resistance measurements
6.3.3.1 General
The test is performed using a resistance tester that is configured for a continuity test, otherwise known
as a two-point test or a “dead earth” test.
The earth ground resistance tester generates a specific alternating current (a.c.) test current; this
current is less susceptible to the influences of stray currents in the telecommunications bonding
network and is a more accurate testing device than a standard volt-ohm-milliampere meter.
Prior to testing
a) a visual inspection shall be performed to verify that the telecommunications bonding network is
installed in accordance with this standard,
b) due to the possibilities of faults travelling through the telecommunications bonding network
system, a voltage test should be performed prior to conducting the two-point continuity test and
verified with the test equipment manufacturer’s instructions,
c) it shall be ensured that any other electrical installation or maintenance activity will not affect the
test result.
The testing shall be undertaken before the telecommunications equipment is installed otherwise
parallel paths may invalidate test results.
6.3.3.2 Dedicated bonding networks
The test is typically performed by connecting one meter lead to the building’s nearest MET and a
specific point on the telecommunications bonding network such as the PBB. This same test can also
verify continuity between any two points of the telecommunications bonding network such as between
the PBB and a SBB.
7 Common features
7.1 General
The requirements and recommendations of this clause apply to the implementations of
telecommunications bonding networks of Clauses 8, 9, 10 and 11 in the absence of local regulations.
Such regulations may apply independent schemes of approval, certification or licensing schemes to
the components, how and where they are used and the performance requirements, which they shall
meet.
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
The installation of PBNCs shall be in accordance with HD 60364-4-41, HD 60364-4-444, HD 60364-5-
54 and EN 61140 (requirements for installations in buildings).
7.2.2 Main earthing terminal (MET)
Each building shall be provided with at least one designated MET.
7.3 Telecommunications entrance facility (TEF)
Each building shall be provided with at least one designated TEF. The TEF shall be placed as close
as possible to either the MET or designated points providing connections to the MET.
In order to minimize surge voltages and effects of surge currents entering the building, groups of
conducting components should enter the building in close proximity to each other. Such components
include pipes, pathway systems and cables containing either extraneous conductive parts (e.g.
armouring, strain relief members of optical fibre cables, cable screens) and/or signal (cable) elements.
Where these are bonded to the MET, the connection shall use the shortest practicable route.
The treatment of extraneous conductive parts that are part of the construction of
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.
Loading comments...