EN IEC 62769-1:2023

Field Device Integration (FDI®) - Part 1: Overview

Feldgeräteintegration (FDI®) - Teil 1: Überblick

Intégration des appareils de terrain (FDI®) - Partie 1: Vue d'ensemble

Integracija procesne naprave (FDI) - 1. del: Pregled

General Information

• Status: Published
• Publication Date: 11-May-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: CLC/TC 65X - Industrial-process measurement, control and automation
• Drafting Committee: IEC/SC 65E - IEC_SC_65E
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 12-May-2023
• Due Date: 26-Aug-2022
• Completion Date: 12-May-2023
• Ref Project: oSIST prEN IEC 62769-1:2022 - Field Device Integration (FDI) - Part 1: Overview

Relations

• Replaces: EN IEC 62769-1:2021 - Field Device Integration (FDI) - Part 1: Overview
• Effective Date: 26-Oct-2021

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 62769-1:2022
01-maj-2022
Integracija procesne naprave (FDI) - 1. del: Pregled
Field Device Integration (FDI) - Part 1: Overview
Feldgeräteintegration (FDI) - Teil 1: Überblick
Intégration des appareils de terrain (FDI) - Partie 1: Vue d'ensemble
Ta slovenski standard je istoveten z: prEN IEC 62769-1:2022
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
oSIST prEN IEC 62769-1:2022 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 62769-1:2022
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oSIST prEN IEC 62769-1:2022
65E/854/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62769-1 ED3
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-03-04 2022-05-27
SUPERSEDES DOCUMENTS:
65E/821/RR
IEC SC 65E : DEVICES AND INTEGRATION IN ENTERPRISE SYSTEMS
SECRETARIAT: SECRETARY:
United States of America Mr Donald (Bob) Lattimer
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
SC 65B,SC 65C
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY

SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING

Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.

Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they

are aware and to provide supporting documentation.
TITLE:
Field Device Integration (FDI) - Part 1: Overview
PROPOSED STABILITY DATE: 2025

Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this

electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.

You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without

permission in writing from IEC.
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NOTE FROM TC/SC OFFICERS:
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oSIST prEN IEC 62769-1:2022
65E/854/CDV – 3 – IEC CDV 62769-1 © IEC:2022
1 CONTENTS

3 INTRODUCTION .................................................................................................................... 5

4 FOREWORD .......................................................................................................................... 6

5 1 Scope ............................................................................................................................. 8

6 2 Normative references ...................................................................................................... 8

7 3 Terms, definitions, abbreviated terms and acronyms ....................................................... 9

8 3.1 Terms and definitions ............................................................................................. 9

9 3.2 IEC TR 62541-1 terms (OPC UA) ......................................................................... 11

10 3.3 IEC 62541-3 (OPC UA) terms ............................................................................... 11

11 3.4 IEC 62541-4 (OPC UA) terms ............................................................................... 12

12 3.5 IEC 62541-5 (OPC UA) terms ............................................................................... 12

13 3.6 IEC 62541-100 (OPC UA for Devices) terms ........................................................ 12

14 3.7 Abbreviated terms and acronyms ......................................................................... 13

15 3.8 Conventions ......................................................................................................... 13

16 4 Background ................................................................................................................... 14

17 4.1 Motivation ............................................................................................................ 14

18 4.2 Electronic Device Description Language (EDDL) .................................................. 14

19 4.3 Field Device Tool (FDT®) ..................................................................................... 14

20 4.4 OPC Unified Architecture (OPC UA) ..................................................................... 15

21 5 Architecture .................................................................................................................. 15

22 5.1 Overview .............................................................................................................. 15

23 5.2 FDI Packages ....................................................................................................... 16

24 5.3 FDI Client ............................................................................................................. 17

25 5.4 FDI Server............................................................................................................ 17

26 5.5 FDI Communication Server ................................................................................... 18

27 5.6 User Interface tiering ............................................................................................ 18

28 5.7 FDI security considerations .................................................................................. 18

29 5.8 Redundancy ......................................................................................................... 19

30 6 Deployment ................................................................................................................... 19

31 6.1 Overview .............................................................................................................. 19

32 6.2 Engineering, operator and maintenance stations .................................................. 19

33 6.3 FDI Server............................................................................................................ 20

34 6.4 FDI Communication Servers ................................................................................. 20

35 6.5 Device Tools ........................................................................................................ 20

36 6.6 Third-party Tools .................................................................................................. 20

37 6.7 Handheld Tools .................................................................................................... 20

38 6.8 Generic OPC UA Clients ...................................................................................... 20

39 7 FDI Host ....................................................................................................................... 20

40 7.1 Overview .............................................................................................................. 20

41 7.2 FDI Host Variants and Entities.............................................................................. 20

42 7.3 FDI Host Facets ................................................................................................... 21

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43 8 Life-cycle Model ............................................................................................................ 22

44 8.1 Overview .............................................................................................................. 22

45 8.2 Identification mechanism ...................................................................................... 22

46 8.3 Versioning mechanism ......................................................................................... 22

47 8.3.1 Version levels ............................................................................................... 22

48 8.3.2 FDI Technology Version ................................................................................ 23

49 8.3.3 Forward compatibility .................................................................................... 26

50 Annex A (informative) FDI life-cycle concept summary ........................................................ 28

51 A.1 General ................................................................................................................ 28

52 A.2 Life-cycle relevant topics (references) .................................................................. 28

53 Annex B (informative) ISSUE REPORTING ......................................................................... 30

54 Bibliography ......................................................................................................................... 31

56 Figure 1 – FDI architecture diagram ..................................................................................... 16

57 Figure 2 – Typical deployment scenario ............................................................................... 19

58 Figure 3 – FDI Technology Version dependencies ................................................................ 24

60 Table 1 – FDI Host Variants and possible Facets ................................................................. 21

61 Table 2 – FDI Host Facets and required FDI Entities ............................................................ 22

62 Table 3 – Summary of influences on the FDI Technology Version ........................................ 25

63 Table 4 – Combinations of Minor Versions that require special handling ............................... 26

64 Table A.5 – Life-cycle aspects as part of the FDI technology ................................................ 28

65 Table A.6 – Life-cycle aspects as part of products and services provided with the FDI technology

66 29
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68 INTRODUCTION

69 The IEC 62769 series has the general title "Field Device Integration (FDI)" and the following parts:

70 – Part 1: Overview
71 – Part 2: FDI Client
72 – Part 3: FDI Server
73 – Part 4: FDI Packages
74 – Part 5: FDI Information Model
75 – Part 6: FDI Technology Mapping
76 – Part 6-100: FDI Technology Mapping for .NET
77 – Part 6-200: FDI Technology Mapping for HTML5
78 – Part 7: FDI Communication Devices
79 – Part 8: EDDL to OPC UA Mapping
80 – Part 100: Profiles – Generic Protocol Extensions
81 – Part 101-1: Profiles – Foundation Fieldbus H1
82 – Part 101-2: Profiles – Foundation Fieldbus HSE
83 – Part 102-2: Profiles – Protocol-specific Definitions for EtherNet IP
84 – Part 103-1: Profiles – PROFIBUS
85 – Part 103-4: Profiles – PROFINET
86 – Part 109-1: Profiles – HART and WirelessHART
87 – Part 115-1: Profiles – Protocol-specific Definitions for OPC UA
88 – Part 115-2: Profiles – Protocol-specific Definitions for Modbus RTU
89 – Part 150-1: Profiles – ISA 100
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91 INTERNATIONAL ELECTROTECHNICAL COMMISSION
92 ____________
94 FIELD DEVICE INTEGRATION (FDI) –
96 Part 1: Overview
98 FOREWORD

99 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national

100 electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all

101 questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities , IEC

102 publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and

103 Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC Natio nal

104 Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-

105 governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the

106 International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two

107 organizations.

108 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus

109 of opinion on the relevant subjects since each technical committee has repres entation from all interested IEC National

110 Committees.

111 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in

112 that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC

113 cannot be held responsible for the way in which they are used or for any misinterpretation by any end user.

114 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publica tions transparently to

115 the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the

116 corresponding national or regional publication shall be clearly indicated in the latter.

117 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment

118 services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by

119 independent certification bodies.

120 6) All users should ensure that they have the latest edition of this publication.

121 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its

122 technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature

123 whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,

124 or reliance upon, this IEC Publication or any other IEC Publications.

125 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable

126 for the correct application of this publication.

127 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC

128 shall not be held responsible for identifying any or all such patent rights.

129 IEC 62769-1 has been prepared by subcommittee 65E: Devices and integration in enterprise systems, of

130 IEC technical committee 65: Industrial-process measurement, control and automation. It is an International

131 Standard.

132 This third edition cancels and replaces the second edition published in 2021. This edition constitutes a

133 technical revision.

134 This edition includes the following significant technical changes with respect to the previous edition:

135 a) added references to part 6-100 and part 6-200 (technology mapping for .NET and HTML5);

136 b) updated sect. 8.3.1: major version, minor version and revision shall be written as two-digit numbers;

137 c) added reference to new part 8 and FDI OPC UA Server Facet.
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138 The text of this International Standard is based on the following documents:
Draft Report on voting
85E/XX/FDIS 65E/XX/RVD
139

140 Full information on the voting for its approval can be found in the report on voting indicated in the above

141 table.

142 The language used for the development of this International Standard is English.

143 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in accordance

144 with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available at

145 www.iec.ch/members_experts/refdocs. The main document types developed by IEC are described in

146 greater detail at www.iec.ch/standardsdev/publications.

147 The committee has decided that the contents of this document will remain unchanged until the stability

148 date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific

149 document. At this date, the document will be
150 • reconfirmed,
151 • withdrawn,
152 • replaced by a revised edition, or
153 • amended.
154
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155 FIELD DEVICE INTEGRATION (FDI) –
156
157 Part 1: Overview
158
159
160 1 Scope

161 This part of IEC 62769 describes the concepts and overview of the Field Device Integration (FDI)

162 specifications. The detailed motivation for the creation of this technology is also described (see 4.1).

163 Reading this document is helpful to understand the other parts of this multi -part standard.

164 2 Normative references

165 The following documents, in whole or in part, are normatively referenced in this document and are

166 indispensable for its application. For dated references, only the edition cited applies. For undated

167 references, the latest edition of the referenced document (including any amendments) applies.

168 IEC 61804-3, Function Blocks (FB) for process control and Electronic Device Description Language

169 (EDDL) - Part 3: EDDL syntax and semantics

170 IEC 61804-4, Function blocks (FB) for process control and electronic device description language (EDDL)

171 - Part 4: EDD interpretation
172 IEC 62453 (all parts), Field device tool (FDT ) interface specification
173 IEC 62541 (all parts), OPC Unified Architecture
174 IEC TR 62541-1, OPC Unified Architecture – Part 1: Overview and concepts
175 IEC 62541-3, OPC Unified Architecture – Part 3: Address Space Model
176 IEC 62541-4, OPC Unified Architecture – Part 4: Services
177 IEC 62541-5, OPC Unified Architecture – Part 5: Information Model
178 IEC 62541-100, OPC Unified Architecture – Part 100: Device Interface
179 IEC 62769-2, Field Device Integration (FDI) – Part 2: FDI Client
180 IEC 62769-3, Field Device Integration (FDI) – Part 3: FDI Server
181 IEC 62769-4, Field Device Integration (FDI) – Part 4: FDI Packages
182 IEC 62769-5, Field Device Integration (FDI – Part 5: FDI Information Model

183 IEC 62769-6, Field Device Integration (FDI) – Part 6: FDI Technology Mappings

184 IEC 62769-7, Field Device Integration (FDI) – Part 7: Communication Devices
185 IEC 62769-8, Field Device Integration (FDI) – Part 8: EDDL to OPC UA Mapping

186 ISO/IEC 11578, Information technology – Open Systems Interconnection – Remote Procedure Call (RPC)

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187 3 Terms, definitions, abbreviated terms and acronyms
188 3.1 Terms and definitions

189 For the purposes of this document, the terms and definitions given in IEC TR 62541-1, IEC 62541-3,

190 IEC 62541-4, IEC 62541-5, IEC 62541-100, as well as the following apply.
191 3.1.1
192 Field Device Integration
193 FDI

194 Device Integration and Device Management Technology, combining base concepts and technology

195 aspects of the Electronic Device Description Language (EDDL) according to IEC 61804 and Field Device

196 Tool (FDT ) according to IEC 62453, as well as in IEC 62541-1 (OPC UA)

197 Note 1 to entry: The combination of those different proven technologies ensures a secure life-cycle and the ability to address all

198 challenges of Device Integration and Device Management in a scalable manner.
199 3.1.2
200 Action

201 procedure that requires collaboration between an FDI Client and an FDI Server

202 3.1.3
203 Business Logic

204 descriptive element of an FDI Package that specifies the device specific behavior and/or mapping logic

205 for a Nested Communication
206 3.1.4
207 Business Logic Interface

208 interface through which Business Logic is integrated with the Information Model

209 3.1.5
210 Communication Device
211 physical device that provides access to networks and devices
212 Note 1 to entry: Gateways and routers are examples of Communication Devices.
213 3.1.6
214 Connection Point

215 logical representation of a connection of a communication end point to a communication network

216 3.1.7
217 Device Access Services

218 set of services through which a User Interface Plug-in accesses the Information Model of an FDI Server

219 3.1.8
220 Device Definition

221 required element of an FDI Package that provides the core definition of a device

222 3.1.9
223 Device Instance

224 representation of a specific device in the Information Model of an FDI Server

225 3.1.10
226 Device Tool
227 standalone application that contains both an FDI Client and an FDI Server
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228 3.1.11
229 Device Type
230 representation of a type of device in the Information Model of an FDI Server
231 3.1.12
232 FDI Client

233 software component that uses the Information Model, interprets User Interface Descriptions, and hosts

234 User Interface Plug-ins
235 3.1.13
236 FDI Communication Server
237 OPC UA server that is used by an FDI Server to access non-native networks
238 3.1.14
239 FDI Package

240 collection of components that provide all the information necessary to integrate a type of device into a

241 system
242 3.1.15
243 FDI Server

244 software component that implements the Information Model, executes Business Logic, and communicates

245 with device via Native Communication and/or Nested Communication
246 1.1.1
247 FDI Technology Version

248 version number that identifies to a specific revision of the overall FDI technology

249 3.1.16
250 Hosting Services

251 set of services through which a User Interface Plug-in interacts with an FDI Client

252 3.1.17
253 Information Model
254 set of objects, variables, and methods exposed by an FDI Server
255 3.1.18
256 Modular Device
257 device that is composed of one or more subdevices
258 3.1.19
259 Native Communication
260 communication with devices that are an integral part of the system
261 3.1.20
262 Nested Communication
263 communication with devices through a series of Communication Devices
264 3.1.21
265 User Interface Services
266 UI Services

267 set of services through which a User Interface Plug-in accesses the operating system

268 3.1.22
269 platform User Interface Services
270 platform UI Services
271 user interface services provided natively by the operating system
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272 3.1.23
273 User Interface Description
274 UID

275 descriptive element of an FDI Package that is used by an FDI Client to render user interface

276 3.1.24
277 User Interface Description interpreter
278 UID interpreter

279 software component in an FDI Client that renders User Interface Descriptions and invokes Actions

280 3.1.25
281 User Interface Plug-in
282 UIP
283 executable element of an FDI Package that is executed by an FDI Client
284 3.1.26
285 User Interface Plug-in Services
286 UIP Services

287 set of services through which an FDI Client interacts with a User Interface Plug-in

288 3.2 IEC TR 62541-1 terms (OPC UA)

289 For the purposes of this document, the terms and definitions given in IEC TR 62541-1 apply.

290 AddressSpace
291 Attribute
292 Client
293 Method
294 Node
295 NodeClass
296 Notification
297 Object
298 ObjectType
299 Reference
300 ReferenceType
301 Server
302 Service Set
303 Session
304 Subscription
305 Variable
306 3.3 IEC 62541-3 (OPC UA) terms

307 For the purposes of this document, the terms and definitions given in IEC 62541-3 (OPC UA) and the

308 following apply.
309 Aggregates
310 ArrayDimensions
311 AuditEvent
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312 AuditUpdateMethodEvent
313 BrowseName
314 ByteString
315 DataType
316 DataVariable
317 Folder
318 HasComponent
319 HasProperty
320 HasSubType
321 HasTypeDefinition
322 ModellingRule
323 NodeId
324 Property
325 UserAccessLevel
326 UserExecutable
327 Value
328 ValueRank
329 3.4 IEC 62541-4 (OPC UA) terms

330 For the purposes of this document, the terms and definitions given in IEC 62541-4 (OPC UA) apply.

331 AddReferences
332 Browse
333 BrowseNext
334 Call
335 CreateSession
336 NodeManagement
337 Read
338 Request Header
339 Response Header
340 StatusCode
341 TranslateBrowsePathsToNodeIds
342 UserIdentityToken
343 Write
344 3.5 IEC 62541-5 (OPC UA) terms

345 For the purposes of this document, the terms and definitions given in IEC 62541-5 apply.

346 BaseObjectType
347 PropertyType
348 3.6 IEC 62541-100 (OPC UA for Devices) terms

349 For the purposes of this document, the terms and definitions given in IEC 62541-100 apply.

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350 Block
351 Device
352 DeviceType
353 Parameter
354 3.7 Abbreviated terms and acronyms
DTM Device Type Manager
EDD Electronic Device Description
EDDL Electronic Device Description Language
FB Function blocks
FDI Field Device Integration
FDT Field Device Tool (see IEC 62453)
GUI Graphical User Interface
n/a Not applicable
OPC Open packaging conventions
OPC UA OPC Unified Architecture (see IEC 62541)
PC Personal computer
PNO PROFIBUS Nutzerorganisation e. V. (is a regional organization of the
PROFIBUS and PROFINET International consortium)
RPC Remote Procedure Call
UI User Interface
UID User Interface Description
UIP User Interface Plug-in
UUID Universally unique identifier
XML Extensible markup language
ZVEI Zentralverband Elektrotechnik- und Elektronikindustrie e. V.
355
356 3.8 Conventions

357 Capitalization of the first letter of words beyond those defined in ISO/IEC Directives Part 2 is used in the

358 IEC 62769 series to emphasize an FDI specific meaning. It is used for the following cases:

359 • Defined terms,
360 • Names of Services defined in IEC 62769-2,
361 • Names of FDI Package elements defined in IEC 62769-4,
362 • Names of Information Model elements defined in IEC 62769-5,

FDT logo is a trade name of the non-profit organization FDT Group AISBL. This information is given for the convenience of

users of this part of IEC 62769 and does not constitute an endorsement by IEC of the trade names holder or any of its products.

Compliance does not require use of the registered trade name. Use of the trade names requires permission of the trade name

holder.
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363 EDD language elements are written with all letters in uppercase.
364 4 Background
365 4.1 Motivation

366 In today’s automation systems field devices from many different suppliers have to be integrated into the

367 system, which results in additional effort for installation, version management and operation of these

368 devices. This challenge is best met with an open and standardized device integration solution.

369 Two different device integration technologies exist: the Electronic Device Description Language (EDDL)

370 according to IEC 61804 and the Field Device Tool (FDT ) according to IEC 62453. While these

371 technologies take different approaches to solve the problem, there is a lot of overlap between them. This

372 has led to a situation where the technologies compete with each other instead of complementing each

373 other. As a result, system suppliers have taken their positions, device suppliers have had to double their

374 efforts in order to support EDDL and FDT , and the end users have become frustrated because they want

375 the best of both technologies.

376 For all parties involved the ideal solution looks different. System suppliers want to achieve robustness

377 while assuring a high level of technology and platform independence. Device suppliers want to support

378 only one technology instead of two in order to reduce cost and effort, and they w ant to provide the optimal

379 means for operating their devices. End users want to avoid false investments and therefore demand only

380 one future-proof solution that offers all the advantages of the competing technologies.

381 4.2 Electronic Device Description Language (EDDL)

382 The Electronic Device Description Language (EDDL) is a language for describing the behavior of field

383 devices. It enables systems to configure, calibrate, troubleshoot, and operate a field device without any

384 prior knowledge of the device.

385 Device descriptions written in EDDL describe the capabilities of the field device; it is up to the system

...