FprEN IEC 60286-3:2022
(Main)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih
General Information
RELATIONS
Standards Content (sample)
SLOVENSKI STANDARD
oSIST prEN IEC 60286-3:2022
01-februar-2022
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih
Packaging of components for automatic handling - Part 3: Packaging of surface mount
components on continuous tapesGurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3:
Gurtung von oberflächenmontierbaren Bauelementen auf EndlosgurtenEmballage de composants pour opérations automatisées - Partie 3: Emballage des
composants pour montage en surface en bandes continues
Ta slovenski standard je istoveten z: prEN IEC 60286-3:2021
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
oSIST prEN IEC 60286-3:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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oSIST prEN IEC 60286-3:2022
40/2899/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60286-3 ED7
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-12-10 2022-03-04
SUPERSEDES DOCUMENTS:
40/2845/CD, 40/2885/CC
IEC TC 40 : CAPACITORS AND RESISTORS FOR ELECTRONIC EQUIPMENT
SECRETARIAT: SECRETARY:
Netherlands Mr Ronald Drenthen
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel votingThe attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which
they are aware and to provide supporting documentation.TITLE:
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on
continuous tapesPROPOSED STABILITY DATE: 2032
NOTE FROM TC/SC OFFICERS:
Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
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oSIST prEN IEC 60286-3:2022
CDV IEC 60286-3/Ed7 IEC (E) – 2 – 40/2899/CDV
1 CONTENTS
3 FOREWORD ........................................................................................................................... 6
4 INTRODUCTION ..................................................................................................................... 8
5 1 Scope .............................................................................................................................. 9
6 2 Normative references ...................................................................................................... 9
7 3 Terms and definitions and symbols .................................................................................. 9
8 3.1 Terms and definitions.............................................................................................. 9
9 3.2 Symbols ................................................................................................................ 11
10 4 Structure of the specification ......................................................................................... 12
11 5 Dimensional requirements for taping .............................................................................. 13
12 5.1 Component cavity positioning requirements .......................................................... 13
13 5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 ..................... 13
14 5.1.2 Requirements for type 4 ................................................................................ 13
15 5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type16 2b and type 3) ....................................................................................................... 14
17 5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape18 widths: 8 mm and 12 mm) ..................................................................................... 14
19 5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) ................ 16
20 5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape21 pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) ................ 18
22 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with23 1mm tape pitch (tape widths: 4 mm) ...................................................................... 21
24 5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) ....... 22
25 5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die
26 and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) ............ 25
27 6 Polarity and orientation requirements of components in the tape ................................... 27
28 6.1 Requirements for all types .................................................................................... 27
29 6.2 Specific requirements for type 1a .......................................................................... 28
30 6.3 Specific requirements for type 4 ............................................................................ 28
31 7 Carrier tape requirements .............................................................................................. 28
32 7.1 Taping materials ................................................................................................... 28
33 7.2 Minimum bending radius (for all types) .................................................................. 28
34 7.3 Camber ................................................................................................................. 29
35 8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) .................. 30
36 9 Component taping and additional tape requirements ..................................................... 32
37 9.1 All types ................................................................................................................ 32
38 9.2 Specific requirements for type 1b .......................................................................... 32
39 9.3 Specific tape requirements for type 2b .................................................................. 32
40 9.4 Specific requirement for type 4 ............................................................................. 33
41 9.4.1 General ......................................................................................................... 33
42 9.4.2 Coordinate system ......................................................................................... 33
43 9.4.3 Component positioning and lateral displacement ........................................... 34
44 9.5 Specific requirements for tapes containing die products ........................................ 35
45 9.5.1 General ......................................................................................................... 35
46 9.5.2 Tape design for tapes containing die products ............................................... 35
47 9.5.3 Cleanliness .................................................................................................... 35
48 9.5.4 Die lateral movement (type 1a, type 2a and type 2b) ..................................... 35
49 10 Reel requirements ......................................................................................................... 36
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50 10.1 Dimensions ........................................................................................................... 36
51 10.1.1 General ......................................................................................................... 36
52 10.1.2 Reel dimensions ............................................................................................ 36
53 10.1.3 Reel hole dimensions .................................................................................... 37
54 10.1.4 Drive hole dimensions (optional) .................................................................... 37
55 10.2 Marking ................................................................................................................. 38
56 11 Tape reeling requirements ............................................................................................. 39
57 11.1 All types ................................................................................................................ 39
58 11.2 Specific requirements for type 1a .......................................................................... 39
59 11.3 Specific requirements for type 4 ............................................................................ 39
60 11.4 Leader and trailer tape .......................................................................................... 39
61 11.4.1 General ......................................................................................................... 39
62 11.4.2 Leader ........................................................................................................... 40
63 11.4.3 Trailer ............................................................................................................ 40
64 11.5 Recycling .............................................................................................................. 40
65 11.6 Missing components ............................................................................................. 40
66 Annex A (normative) Recommended measuring methods for type 1b ................................... 41
67 A.1 Measurement method for carrier tape thickness (T and T ) ................................... 41
68 A.2 Measurement method for cavity (A and B ) ......................................................... 41
0 069 A.3 Measurement method for cavity depth (dimension K ) .......................................... 42
70 Annex B (informative) Measuring methods of electrostatic potential and charge decay
71 performance while cover tape is peeled off from carrier tape containing surface
72 mount devices ............................................................................................................... 43
73 B.1 General ................................................................................................................. 43
74 B.2 Method for measuring electrostatic potential and charge decay performance ........ 43
75 B.2.1 General ......................................................................................................... 43
76 B.2.2 Measurement instrument and device.............................................................. 45
77 B.2.3 Sample(test specimen) .................................................................................. 47
78 B.2.4 Pre-treatment conditions and measurement environment conditions .............. 48
79 B.2.5 Measurement conditions ................................................................................ 48
80 B.2.6 Measuring method of electrostatic potential ................................................... 49
81 B.2.7 Measuring method of electrostatic charge decay performance ....................... 49
82 B.3 Items to be described in the test report and items to be specified in the83 related standards .................................................................................................. 50
84 B.3.1 Items to be described in the test report .......................................................... 50
85 B.3.2 Items specified in related standards ............................................................... 52
86 Bibliography .......................................................................................................................... 53
88 Figure 1 – Sectional view of component cavity (type 1b) ....................................................... 10
89 Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) ............... 14
90 Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset ................ 15
91 Figure 4 – Maximum component tilt, rotation and lateral movement ...................................... 15
92 Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) ........................ 17
0 1 0 193 Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset ................ 17
94 Figure 7 – Maximum component tilt, rotation and lateral movement ...................................... 17
95 Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) ...................... 19
96 Figure 9 – Illustration of 2 mm cavity pitch and pocket offset ................................................ 19
97 Figure 10 – Maximum component tilt, rotation and lateral movement .................................... 19
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CDV IEC 60286-3/Ed7 IEC (E) – 4 – 40/2899/CDV
98 Figure 11 – Type 2b carrier tape ........................................................................................... 21
99 Figure 12 – Maximum pocket offset....................................................................................... 21
100 Figure 13 – Maximum component tilt, rotation and lateral movement .................................... 21
101 Figure 14 – Blister carrier tape .............................................................................................. 23
102 Figure 15 – Elongated sprocket hole skew ............................................................................ 23
103 Figure 16 – Maximum component tilt, rotation and lateral movement .................................... 23
104 Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
105 pitch) .................................................................................................................................... 25
106 Figure 18 – Illustration of 2 mm compartment pitch ............................................................... 25
107 Figure 19 – Maximum component planar rotation and lateral displacement ........................... 26
108 Figure 20 – Example of polarity and orientation .................................................................... 28
109 Figure 21 – Bending radius ................................................................................................... 29
110 Figure 22 – Measuring method and camber .......................................................................... 30
111 Figure 23 – Dot seals for thin components (as exceptions) ................................................... 31
112 Figure 24 – Type 4 coordinate system .................................................................................. 34
113 Figure 25 – Component clearance and positioning method ................................................... 34
114 Figure 26 – Reel ................................................................................................................... 36
115 Figure 27 – Reel hole presentation ....................................................................................... 37
116 Figure 28 – Drive hole layout ................................................................................................ 38
117 Figure 29 – Tape reeling and label area on the reel .............................................................. 39
118 Figure 30 – Leader and trailer ............................................................................................... 40
119 Figure A.1 – Carrier tape thickness measurement points ...................................................... 41
120 Figure A.2 – Cavity cross-section .......................................................................................... 42
121 Figure A.3 – Cavity depth dimension ..................................................................................... 42
122 Figure B.1 – Configuration of measurement method using electrostatic potential
123 measuring system ................................................................................................................. 44
124 Figure B.2 – Diagram of measure electrostatic potential when peeling cover tape ................. 44
125 Figure B.3 – Configuration of electrostatic charge decay measurement method .................... 45
126 Figure B.4 – Diagram of the measure electrostatic charge decay performance ...................... 45
127 Figure B.5 – Dimensions of the sample ................................................................................. 48
128129 Table 1 – Component size codes .......................................................................................... 10
130 Table 2 – Classification to symbols concerning tape, reel and common symbols ................... 11
131 Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape ............................ 15
132 Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape ............................. 16
133 Table 5 – Component tilt, planar rotation and lateral movement ............................................ 16
134 Table 6 – Constant dimensions of 8 mm pressed carrier tape ............................................... 18
135 Table 7 – Variable dimensions of 8 mm pressed carrier tape ................................................ 18
136 Table 8 – Component tilt, planar rotation and lateral movement ............................................ 18
137 Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape ................................... 20
138 Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape .................................. 20
139 Table 11 – Component tilt, rotation and lateral movement ..................................................... 20
140 Table 12 – Constant dimensions of 4 mm carrier tape ........................................................... 22
141 Table 13 – Variable dimensions of 4 mm carrier tape ............................................................ 22
142 Table 14 – Component tilt, planar rotation and lateral movements ........................................ 22
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CDV IEC 60286-3/Ed7 IEC (E) – 5 – 40/2899/CDV
143 Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape ............................. 24
144 Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape .............................. 24
145 Table 17 – Component tilt, planar rotation and lateral movements ........................................ 25
146 Table 18 – Dimensions of adhesive backed punched carrier tape ......................................... 26
147 Table 19 – Variable dimensions of adhesive-backed punched carrier tape ............................ 27
148 Table 20 – Component planar rotation and lateral displacement ........................................... 27
149 Table 21 – Minimum bending radius ...................................................................................... 29
150 Table 22 – Peel force ............................................................................................................ 31
151 Table 23 – Absolute referencing data for component target position ..................................... 33
152 Table 24 – Reel dimensions .................................................................................................. 36
153 Table 25 – Reel hole dimensions .......................................................................................... 37
154 Table 26 – Drive hole dimensions ......................................................................................... 38
155 Table B.1 – Conditions of the environment in which the samples are kept and the
156 conditions of the measurement test environment before measurement .................................. 48
157158
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oSIST prEN IEC 60286-3:2022
CDV IEC 60286-3/Ed7 IEC (E) – 6 – 40/2899/CDV
159 INTERNATIONAL ELECTROTECHNICAL COMMISSION
160 ____________
161
162 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
163
164 Part 3: Packaging of surface mount components
165 on continuous tapes
166
167 FOREWORD
168 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
169 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
170 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
171 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
172 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
173 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
174 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
175 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
176 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
177 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
178 consensus of opinion on the relevant subjects since each technical committee has representation from all
179 interested IEC National Committees.180 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
181 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
182 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
183 misinterpretation by any end user.184 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
185 transparently to the maximum extent possible in their national and regional publications. Any divergence between
186 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
187 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
188 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
189 services carried out by independent certification bodies.190 6) All users should ensure that they have the latest edition of this publication.
191 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
192 members of its technical committees and IEC National Committees for any personal injury, property damage or
193 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
194 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
195 Publications.196 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
197 indispensable for the correct application of this publication.198 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
199 rights. IEC shall not be held responsible for identifying any or all such patent rights.
200 IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for
201 electronic equipment.202 This seventh edition cancels and replaces the sixth edition published in 2019. This edition
203 constitutes a technical revision.204 This edition includes the following significant technical changes with respect to the previous
205 edition:206 a) addition terms and definitions.
207 b) addition of a table of the classification to symbols concerning drive hole diameter and
208 distance between the reel hole centre and the drive hole centre;209 c) addition of drive hole to the reel (optional);
210 d) revision of reel hole diameter tolerances;
211 e) revision of 72 mm tape size carrier tape width dimension tolerances;
212 f) addition of Annex B (informative).
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oSIST prEN IEC 60286-3:2022
CDV IEC 60286-3/Ed7 IEC (E) – 7 – 40/2899/CDV
213 g) addition of component sizes 0201M214 The text of this International Standard is based on the following documents:
Draft Report on voting
40/XX/FDIS 40/XX/RVD
215
216 Full information on the voting for its approval can be found in the report on voting indicated in
217 the above table.218 The language used for the development of this International Standard is English.
219 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
220 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
221 at https://www.iec.ch/members_experts/refdocs. The main document types developed by IEC
222 are described in greater detail at https://www.iec.ch/standardsdev/publications.
223 The committee has decided that the contents of this document will remain unchanged until the
224 stability date indicated on the IEC website under webstore.iec.ch in the data related to the
225 specific document. At this date, the document will be226 • reconfirmed,
227 • withdrawn,
228 • replaced by a revised edition, or
229 • amended.
230
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CDV IEC 60286-3/Ed7 IEC (E) – 8 – 40/2899/CDV
231 INTRODUCTION
232 Tape packaging meets the requirements of automatic component placement machines and also
233 covers the use of tape packaging for components and singulated dies for test purposes and
234 other operations.235
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CDV IEC 60286-3/Ed7 IEC (E) – 9 – 40/2899/CDV
236 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –237
238 Part 3: Packaging of surface mount components
239 on continuous tapes
240
241
242 1 Scope
243 This part of IEC 60286 is applicable to the tape packaging of electronic components without
244 leads or with lead stumps, intended to be connected to electronic circuits. It includes only those
245 dimensions that are essential for the taping of components intended for the above-mentioned
246 purposes.247 This document also includes requirements related to the packaging of singulated die products
248 including bare die and bumped die (flip chips).249 2 Normative references
250 The following documents are referred to in the text in such a way that some or all of their content
251 constitutes requirements of this document. For dated references, only the edition cited applies.
252 For undated references, the latest edition of the referenced document (including any
253 amendments) applies.254 IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
255 3 Terms and definitions and symbols256 3.1 Terms and definitions
257 For the purposes of this document, the following terms and definitions apply. Definitions apply
258 to all tape types, unless specifically mentioned.259 ISO and IEC maintain terminological databases for use in standardization at the following
260 addresses:261 • IEC Electropedia: available at https://www.electropedia.org/
262 • ISO Online browsing platform: available at https://www.iso.org/obp
263 3.1.1
264 components
265 electronic part of a product that cannot be physically divided into smaller parts without losing
266 its particular function267 Note 1 to entry: This includes singulated die product.
268 Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned otherwise.
269 3.1.2270 component sizes
271 size of component that are identified with their metric size code
272 Note 1 to entry: This size code is followed by a capital M.
273 Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1.
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CDV IEC 60286-3/Ed7
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