Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 4: Stangenmagazine für elektronische Bauelemente mit verschiedenen Gehäusen

Emballage des composants pour opérations automatisées – Partie 4: Magasins chargeurs pour composants électroniques encapsulés dans des boîtiers de différentes formes

La CEI 60286-4:2013 est applicable aux magasins chargeurs (y compris aux bouchons d'extrémités) destinés au stockage des composants électroniques pour le transport entre le fabricant et le client, et pour l'utilisation interne dans l'installation de fabrication. Ils sont aussi utilisés pour l'alimentation des machines de placement automatique pour le montage en surface ainsi que pour le montage par trous traversants des composants électroniques. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: L'Article 4 décrit les lignes directrices pour la conception de magasins chargeurs sur mesure. Il remplace les règles de conception des magasins pour les composants décrits par la CEI et les règles d'orientation des composants dans les magasins chargeurs qui ont été déplacées dans les Annexes A à D.

Pakiranje komponent za avtomatsko obdelavo - 4. del: Palične posode za elektronske komponente, inkapsulirane v ohišjih različnih oblik

Ta del standarda IEC 60286 se uporablja za palične posode (vključno s končnimi nastavki), ki so namenjene hranjenju elektronskih komponent, prevozu od proizvajalca do stranke in interni uporabi v proizvodnem obratu. Uporabljajo se tudi za strojno podajanje strojem za strojno polaganje in strojno vstavljanje elektronskih komponent.

General Information

Status
Withdrawn
Publication Date
29-Nov-2013
Withdrawal Date
29-Aug-2016
Current Stage
6060 - Document made available - Publishing
Start Date
08-Nov-2013
Completion Date
08-Nov-2013

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60286-4:2014
01-januar-2014
1DGRPHãþD
SIST EN 60286-4:2002
3DNLUDQMHNRPSRQHQW]DDYWRPDWVNRREGHODYRGHO3DOLþQHSRVRGH]D
HOHNWURQVNHNRPSRQHQWHLQNDSVXOLUDQHYRKLãMLKUD]OLþQLKREOLN

Packaging of components for automatic handling - Part 4: Stick magazines for electronic

components encapsulated in packages of different forms

Emballage de composants pour opérations automatisées - Partie 4 : Magasins chargeurs

pour composants électroniques encapsulés dans des boîtiers de différentes formes
Ta slovenski standard je istoveten z: EN 60286-4:2013
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.160 =DERMLâNDWOH3ODVWLþQL Cases. Boxes. Crates
]DERML
SIST EN 60286-4:2014 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60286-4:2014
---------------------- Page: 2 ----------------------
SIST EN 60286-4:2014
EUROPEAN STANDARD
EN 60286-4
NORME EUROPÉENNE
November 2013
EUROPÄISCHE NORM
ICS 31.020; 31.240 Supersedes EN 60286-4:1998
English version
Packaging of components for automatic handling -
Part 4: Stick magazines for electronic components encapsulated in
packages of different forms
(IEC 60286-4:2013)
Emballage des composants pour Gurtung und Magazinierung von Bauteilen
opérations automatisées – Partie 4: für automatische Verarbeitung -
Magasins chargeurs pour composants Teil 4: Stangenmagazine für elektronische
électroniques encapsulés dans des Bauelemente mit verschiedenen
boîtiers de différentes formes Gehäusen
(CEI 60286-4:2013) (IEC 60286-4:2013)

This European Standard was approved by CENELEC on 2013-08-30. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,

Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,

Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60286-4:2013 E
---------------------- Page: 3 ----------------------
SIST EN 60286-4:2014
EN 60286-4:2013 - 2 -
Foreword

The text of document 40/2230/FDIS, future edition 3 of IEC 60286-4, prepared by IEC TC 40, "Capacitors

and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote and approved

by CENELEC as EN 60286-4:2013.
The following dates are fixed:
(dop) 2014-05-30
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-08-30
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60286-4:1998.

EN 60286-4:2013 includes the following significant technical changes with respect to EN 60286-4:1998:

Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine

design rules for IEC outlined components and rules for orientation of components in stick magazines

which have been moved to Annexes Z to D.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent

rights.
Endorsement notice

The text of the International Standard IEC 60286-4:2013 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated:

ISO 11469 NOTE Harmonized as EN ISO 11469.
---------------------- Page: 4 ----------------------
SIST EN 60286-4:2014
- 3 - EN 60286-4:2013
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60191-3 1999 Mechanical standardization of semiconductor EN 60191-3 1999
devices -
Part 3: General rules for the preparation of
outline drawings of integrated circuits
IEC 60747-1 2006 Semiconductor devices - - -
+ corr. August 2008 Part 1: General
+ A1 2010
---------------------- Page: 5 ----------------------
SIST EN 60286-4:2014
---------------------- Page: 6 ----------------------
SIST EN 60286-4:2014
IEC 60286-4
Edition 3.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 4: Stick magazines for electronic components encapsulated in packages of
different forms
Emballage des composants pour opérations automatisées –
Partie 4: Magasins chargeurs pour composants électroniques encapsulés dans
des boîtiers de différentes formes
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX P
ICS 31.020; 31.240 ISBN 978-2-8322-0947-9

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN 60286-4:2014
– 2 – 60286-4  IEC:2013
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ....................................................................................................... 5

3 Terms, definitions and conventions .................................................................................. 5

3.1 Terms and definitions ......................................................................................... 5

3.2 Conventions ....................................................................................................... 5

4 Shape and cross-section of stick magazine ...................................................................... 6

5 Dimensions of stick magazines ........................................................................................ 7

5.1 General .............................................................................................................. 7

5.2 Materials ............................................................................................................ 8

5.3 Recycling ........................................................................................................... 8

6 Mechanical stability .......................................................................................................... 8

7 End stoppers and spacers ................................................................................................ 9

8 Orientation of the components in the stick magazine ........................................................ 9

9 Marking ........................................................................................................................... 9

Annex A (informative) DIL packages for through-hole mount ................................................. 10

Annex B (informative) SO packages for surface mounting ..................................................... 12

Annex C (informative) Leaded chip carrier packages (PLCC) for surface mounting ............... 13

Annex D (normative) Rule for the orientation of integrated circuit packages in handling and

shipping carriers such as stick magazines and rails (from IEC 60191-3:1999, Annex G) ......... 14

Bibliography .......................................................................................................................... 16

Figure 1 – Shape and cross-sections of stick magazines ......................................................... 6

Figure 2 – Schematic of stick magazine design and schematic of package profile .................... 7

Figure A.1 – DIL packages for through-hole mounting ............................................................ 10

Figure B.1 – SO packages for surface mounting .................................................................... 12

Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting ............................... 13

Figure D.1 – Five examples of the terminal No. 1 marking locations ....................................... 15

Table 1 – Tolerances to the package profile dimensions .......................................................... 7

Table 2 – Principle of stick magazine requirements ................................................................. 8

Table 3 – Material reference for magazines and stoppers ........................................................ 8

Table A.1 – e = 3 modules e ................................................................................................ 10

Table A.2 – e = 4 modules e ................................................................................................ 11

Table A.3 – e = 6 modules e ................................................................................................ 11

Table B.1 – Stick magazine dimensions for SO packages ...................................................... 12

Table C.1 – Stick magazine dimensions for PLCC packages .................................................. 13

---------------------- Page: 8 ----------------------
SIST EN 60286-4:2014
60286-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 4: Stick magazines for electronic components encapsulated
in packages of different forms
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60286-4 has been prepared by IEC technical committee 40:

Capacitors and resistors for electronic equipment.

This third edition cancels and replaces the second edition published in 1997 and constitutes a

technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

– Clause 4 describes the guidelines for customer specific stick magazine design. It replaces

the magazine design rules for IEC outlined components and rules for orientation of

components in stick magazines which have been moved to Annexes A to D.
---------------------- Page: 9 ----------------------
SIST EN 60286-4
...

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