EN IEC 60286-3:2019
(Main)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value with regard to tilt.
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues
IEC 60286-3:2019 est disponible sous forme de IEC 60286-3:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 60286-3:2019 est applicable à la mise en bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise en bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l'emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout d'un tableau de classification des symboles concernant les bandes, les bobines et les symboles courants; - ajout d'une figure représentant un exemple de polarité et d'orientation et d'une figure représentant un exemple de collage ponctuel; - révision des exigences de cambrage; - ajout d'une définition de la valeur de conception concernant l'inclinaison.
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2019)
Ta del standarda IEC 60286 se uporablja za tračno pakiranje elektronskih komponent brez vodov ali ostankov vodov, namenjenih za povezavo z elektronskimi vezji. Vključuje samo dimenzije, bistvene za tračno pakiranje komponent, ki so namenjene za zgoraj navedene namene.
Ta dokument vključuje tudi zahteve glede pakiranja proizvodov s singularnimi polprevodniškimi integriranimi vezji, vključno s tistimi brez ohišja in tistimi z izboklinami (»flip chip«).
General Information
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Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2019)Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019)Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)55.060Tulci. VretenaSpools. Bobbins31.020Elektronske komponente na splošnoElectronic components in generalICS:Ta slovenski standard je istoveten z:EN IEC 60286-3:2019SIST EN IEC 60286-3:2019en01-maj-2019SIST EN IEC 60286-3:2019SLOVENSKI
STANDARDSIST EN 60286-3:2013/AC:2014SIST EN 60286-3:20131DGRPHãþD
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN IEC 60286-3
March 2019 ICS 31.020; 31.240
Supersedes
EN 60286-3:2013
English Version
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019) This European Standard was approved by CENELEC on 2019-02-20. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23,
B-1040 Brussels © 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60286-3:2019 E SIST EN IEC 60286-3:2019
This document supersedes EN 60286-3:2013. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 60286-3:2019 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1 IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2 IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3 ISO 11469 NOTE Harmonized as EN ISO 11469
Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1
Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2
Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year IEC 60191-2 -
Mechanical standardization of semiconductor devices -- Part 2: Dimensions - -
IEC 60286-3 Edition 6.0 2019-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes continues
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 31.020; 31.240
ISBN 978-2-8322-6387-7
– 2 – IEC 60286-3:2019 © IEC 2019 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope . 8 2 Normative references . 8 3 Terms, definitions and symbols. 8 3.1 Terms and definitions . 8 3.2 Symbols . 10 4 Structure of the specification . 11 5 Dimensional requirements for taping . 12 5.1 Component cavity positioning requirements . 12 5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12 5.1.2 Requirements for types 4 . 12 5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12 5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) . 12 5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15 5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 17 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) . 20 5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21 5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24 6 Polarity and orientation requirements of components in the tape . 26 6.1 Requirements for all tape types . 26 6.2 Specific requirements for type 1a . 27 6.3 Specific requirements for type 4 . 27 7 Carrier tape requirements . 27 7.1 Taping materials . 27 7.2 Minimum bending radius (for all types) . 27 7.3 Camber . 28 8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29 9 Component taping and additional tape requirements. 30 9.1 All types . 30 9.2 Specific requirements for type 1b . 31 9.3 Specific tape requirements for type 2b . 31 9.4 Specific requirement for type 4 . 31 9.4.1 General . 31 9.4.2 Coordinate system . 31 9.4.3 Component positioning and lateral displacement . 33 9.5 Specific requirements for tapes containing die products . 33 9.5.1 General . 33 9.5.2 Tape design for tapes containing die products . 33 9.5.3 Cleanliness . 34 9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34 10 Reel requirements . 34 SIST EN IEC 60286-3:2019
IEC 60286-3:2019 © IEC 2019 – 3 –
10.1 Dimensions . 34 10.1.1 General . 34 10.1.2 Reel dimensions . 34 10.1.3 Reel hole dimensions . 36 10.2 Marking . 36 11 Tape reeling requirements . 37 11.1 All types . 37 11.2 Specific requirements for type 1a . 37 11.3 Specific requirements for type 4 . 37 11.4 Leader and trailer tape . 37 11.4.1 General . 37 11.4.2 Leader . 38 11.4.3 Trailer . 38 11.5 Recycling . 38 11.6 Missing components . 38 Annex A (normative)
Recommended measuring methods for type 1b . 39 A.1 Measurement method for carrier tape thickness (T and T3) . 39 A.2 Measurement method for cavity (A0 and B0) . 39 A.3 Measurement method for cavity depth (dimension K0) . 40 Bibliography . 41
Figure 1 – Sectional view of component cavity (type 1b) . 9 Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13 Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13 Figure 4 – Maximum component tilt, rotation and lateral movement . 13 Figure 5 – Dimensions (P0 = 4 mm/P1 = 2 mm) and (P0 = 4 mm/P1 = 1 mm) . 15 Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16 Figure 7 – Maximum component tilt, rotation and lateral movement . 16 Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18 Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 18 Figure 10 – Maximum component tilt, rotation and lateral movement . 18 Figure 11 – Type 2b carrier tape .
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