IEC TS 61340-5-6:2025
(Main)Electrostatics - Part 5-6: Protection of electronic devices from electrostatic phenomena - Process assessment techniques
Electrostatics - Part 5-6: Protection of electronic devices from electrostatic phenomena - Process assessment techniques
IEC TS 61340-5-6:2025 establishes a set of methodologies, techniques, and instruments to characterize a process where electrostatic discharge (ESD) sensitive items (ESDS) are handled. ESD risk assessment covers risks by charged personnel, ungrounded conductors, charged ESDS, charged insulators, and ESDS in an electrostatic field. This document applies to activities that manufacture, process, assemble, install, package, label, service, test, inspect, transport, or otherwise handle electrical or electronic parts, assemblies, and equipment susceptible to damage by electrostatic discharges. This document does not apply to electrically initiated explosive items, flammable gases and liquids or powders. The document does not address program management, compliance verification or program manager/coordinator certification. Risks due to electromagnetic sources that produce AC fields are not considered. This document cancels and replaces IEC PAS 61340-5-6 published in 2022. This first edition constitutes a technical revision.
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Standards Content (Sample)
IEC TS 61340-5-6 ®
Edition 1.0 2025-07
TECHNICAL
SPECIFICATION
Electrostatics -
Part 5-6: Protection of electronic devices from electrostatic phenomena -
Process assessment techniques
ICS 17.220.99; 29.020 ISBN 978-2-8327-0565-0
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CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, symbols and abbreviated terms . 7
3.1 Terms and definitions. 8
3.2 Symbols and abbreviated terms . 8
3.2.1 Symbols . 8
3.2.2 Abbreviated terms . 10
4 Personnel safety . 10
5 Experience level required . 10
6 Measurement techniques for ESD risk assessment . 11
7 ESD robustness of ESDS used in processes . 13
7.1 General considerations . 13
7.2 ESD withstand currents of single devices (components). 13
7.2.1 Human body model . 13
7.2.2 Discharge of charged conductors . 14
7.2.3 Charged device model . 14
7.3 ESD withstand currents of electronic assemblies . 16
7.3.1 Discharge of charged personnel . 16
7.3.2 Discharge of charged conductors . 16
7.3.3 Discharge of boards/systems . 16
7.4 Voltage sensitive devices . 17
8 ESD risk assessment flows . 17
8.1 General considerations . 17
8.2 Manual handling steps . 18
8.2.1 General considerations . 18
8.2.2 Parameter limits for ESD risk assessment in manual handling steps . 18
8.2.3 Detailed ESD risk assessment flow . 19
8.3 Conductors . 21
8.3.1 General considerations . 21
8.3.2 Parameter limits for ESD risk assessment of conductors . 22
8.3.3 Detailed ESD risk assessment flow . 22
8.4 Charged ESDS . 24
8.4.1 General considerations . 24
8.4.2 Parameter limits for ESD risk assessment of charged ESDS . 24
8.4.3 Detailed ESD risk assessment flow . 25
8.5 Risks due to process essential insulators . 27
8.5.1 General considerations . 27
8.5.2 Parameter limits for ESD risk assessment of process essential
insulators . 27
8.5.3 Detailed ESD risk assessment flow . 28
8.6 ESD risk assessment by ESD event detection . 30
8.6.1 General considerations . 30
8.6.2 General procedure . 31
8.6.3 Detailed ESD risk assessment flow . 31
Annex A (informative) Measurement techniques and equipment. 33
A.1 General considerations . 33
A.2 Measurements of grounding . 33
A.2.1 Resistance measurement apparatus . 33
A.2.2 Low resistance meter (DC ohmmeter, multimeter). 35
A.2.3 AC voltage check . 36
A.3 Measurements of contact resistance . 37
A.3.1 Background information and application to ESD risk assessment . 37
A.3.2 Surface, point to point or volume resistance measurements at 10 V and
100 V . 37
A.3.3 Surface, point to point or volume resistance measurements at voltages
greater than 100 V . 38
A.3.4 Determination of contact resistance under ESD conditions . 39
A.4 Measurements of electrostatic fields . 41
A.4.1 General considerations . 41
A.4.2 Electrostatic field meter . 41
A.5 Measurements of charges . 42
A.5.1 General considerations . 42
A.5.2 Faraday pail . 43
A.5.3 Electrometer . 43
A.5.4 Current probe or CDM discharge head or Pellegrini target . 44
A.6 Measurements of electrostatic voltages . 44
A.6.1 Charged plate monitor . 44
A.6.2 Walking test kit . 45
A.6.3 Non-contacting electrostatic voltmeter (ESVM) . 46
A.6.4 Contact voltmeter . 47
A.7 Measurements of discharge events . 48
A.7.1 Antenna with oscilloscope . 48
A.7.2 ESD event detectors . 50
A.8 Measurements of discharge currents . 50
A.8.1 General considerations . 50
A.8.2 Current probe . 51
A.8.3 Pellegrini target . 53
A.8.4 CDM test head . 54
Annex B (informative) Grounding of automated handling equipment (AHE) . 56
B.1 Background information . 56
B.2 Test equipment . 56
B.3 Test procedure. 57
B.4 Suggested equipment grounding guidelines . 57
Annex C (informative) Preparation: What is necessary to prepare an effective ESD
risk assessment? . 59
C.1 Best practices . 59
C.2 Measurement of temperature, humidity and basic electrostatic conditions . 59
C.3 Further hints for preparation . 59
Annex D (informative) ESD risk assessment and mitigation . 60
Annex E (informative) Examples for defining limits in ESD risk assessment for risks
due to charged personnel . 61
Annex F (informative) Example for ESD risk assessment in a "pick and place" process . 63
F.1 Process description . 63
F.2 Parameter limits and equipment . 64
F.3 ESD risk assessment of "Pick operation" . 64
Bibliography . 66
Figure 1 – Direct (best correlation) and indirect (least correlation) measurements to
assess an ESD risk . 12
Figure 2 – Flow to assess ESD risk induced by personnel . 21
Figure 3 – Flow to assess the ESD risk induced by conductors . 24
Figure 4 – Flow to assess the ESD risk induced by charged ESDS . 26
Figure 5 – Flow to assess the ESD risk induced by process essential insulators . 30
Figure 6 – Flow to assess the ESD risk by detecting the electromagnetic radiation
using E
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