IEC TR 62343-6-5:2011

Dynamic modules - Part 6-5: Investigation of operating mechanical shock and vibration tests for dynamic modules

IEC/TR 62343-6-5:2011(E) explains an investigation of operating mechanical shock and a vibration test for dynamic modules. It also describes the results of a survey, evaluation and mechanical simulation of mechanical shock and vibration testing. This report covers a study of standardization for operating mechanical shock and vibration test methods.

General Information

• Status: Published
• Publication Date: 25-Jan-2011
• ICS: 33.180.20 - Fibre optic interconnecting devices
• Technical Committee: SC 86C - Fibre optic systems and active devices
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 19-Jun-2014

Relations

• Revised: IEC TR 62343-6-5:2014 - Dynamic modules - Part 6-5: Design guide - Investigation of operating mechanical shock and vibration tests for dynamic modules
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/TR 62343-6-5


®


Edition 1.0 2011-01



TECHNICAL



REPORT





colour
inside
Dynamic modules –
Part 6-5: Investigation of operating mechanical shock and vibration tests for
dynamic modules



IEC/TR 62343-6-5:2011(E)

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IEC/TR 62343-6-5


®


Edition 1.0 2011-01



TECHNICAL



REPORT




colour
inside
Dynamic modules –
Part 6-5: Investigation of operating mechanical shock and vibration tests for
dynamic modules



INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 33.180.20 ISBN 978-2-88912-326-1

® Registered trademark of the International Electrotechnical Commission

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– 2 – TR 62343-6-5 © IEC:2011(E)



CONTENTS

FOREWORD . 4


1 Scope . 6

2 Background . 6

3 Questionnaire results in Japan . 6


4 Evaluation plan . 7

5 Evaluation results . 7

5.1 Step 1 . 7

5.1.1 Evaluation of hammer impact . 7
5.1.2 Evaluation of adjacent board insertion and rack handle impact . 9
5.2 Step 2 . 9
5.3 Step 3 . 11
5.3.1 MEMS-VOA . 11
5.3.2 WSS and tunable laser . 14
6 Simulation . 16
6.1 Simulation model . 16
6.2 Frequency characteristics . 17
6.3 Dependence on board design . 17
6.4 Consistency of evaluation and simulation results . 18
7 Summary . 19
8 Conclusions . 19

Figure 1 – Photos of evaluating hammer impact, rack and boards . 7
Figure 2 – Evaluation results of hammer impact H . 8
Figure 3 – Photos of evaluating adjacent board insertion and rack handle impact . 9

Figure 4 – DUT (VOA and WSS) installed on boards and rack for second step of the
evaluation . 10
Figure 5 – Oscilloscope display of waveform changes in vibration and optical output . 10
Figure 6 – Evaluation results when employing MEMS-VOA for Z axis. 11
Figure 7 – Photos of the MEMS-VOA shock/vibration test equipment . 12
Figure 8 – Operational shock characteristics of MEMS-VOA . 13
Figure 9 – Vibration evaluation results for MEMS-VOA (Z axis; 2 G) . 13

Figure 10 – Shock and vibration evaluation system for WSS and tunable laser . 14
Figure 11 – Shock evaluation results for WSS (directional dependence) . 15
Figure 12 – Shock evaluation results for WSS (z-axis direction and shock dependence) . 15
Figure 13 – Simulation model. 16
Figure 14 – Vibration simulation results (Conditions: 1,6 mm × 240 mm × 220 mm,
t × H × D) . 17
Figure 15 – Vibration simulation results (Dependence on board conditions) . 18

Table 1 – Rack and board specifications, conditions of evaluating hammer impact and
acquiring data . 8
Table 2 – Dynamic modules used in evaluation and evaluation conditions . 10
Table 3 – Conditions for MEMS-VOA vibration/shock evaluation . 12
Table 4 – Results of MEMS-VOA vibration evaluation . 14

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TR 62343-6-5 © IEC:2011(E) – 3 –


Table 5 – Conditions for simulating board shock and vibration . 16

Table 6 – Comparison of hammer impact shock evaluation results and vibration

simulation (Conditions: 1,6 mm × 240 mm × 220 mm, t × H × D) . 19

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INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



DYNAMIC MODULES –



Part 6-5: Investigation of operating mechanical shock

and vibration tests for dynamic modules





FOREWORD

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The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62343-6-5, which is a technical report, has been prepared by subcommittee 86C: Fibre
optic systems and active devices, of IEC technical committee 86: Fibre optics.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
86C/943/DTR 86C/958/RVC

Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.

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TR 62343-6-5 © IEC:2011(E) – 5 –


This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.


A list of all parts of IEC 62343 series, published under the general title Dynamic modules, can

be found on the IEC website.


The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be


• reconfirmed,

• withdrawn,

• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
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colour printer.

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DYNAMIC MODULES –



Part 6-5: Investigation of operating mechanical shock

and vibration tests for dynamic modules








1 Scope


This part of IEC 62343, which is a technical report, explains an investigation of operating
mechanical shock and a vibration test for dynamic modules. It also describes the results of a
survey, evaluation and mechanical simulation of mechanical shock and vibration testing. This
report covers a study of standardization for operating mechanical shock and vibration test
methods.
2 Background
The recent deployment of advanced, highly flexible optical communication networks using
ROADM (reconfigurable optical add drop multiplexing) systems has been accompanied by
putting dynamic wavelength dispersion compensators, wavelength blockers and wavelength
selective switches to practical use as “dynamic modules.” Since these dynamic modules
incorporate such brand-new technology as MEMS (micro electromechanical systems), there
are concerns about the vulnerability of MEMS to operational shock and vibration conditions,
which urgently require establishing evaluation methods and conditions for operational shock
and vibration. Standards for shock and vibration test conditions as pertaining to storage and
transport are already established, but methods and conditions for evaluating operational
shock and vibration are not yet established.
The JIS (Japanese Industrial Standards) committee consequently conducted a questionnaire
survey on the shock and vibration testing of passive optical components and dynamic
modules in commercial use. The survey revealed that many respondents confirmed a need to
standardize evaluation conditions for operational shock and vibration, and some suggested
earthquakes, hammers impact testing and inserting an adjacent board as cases of shock and
vibration during dynamic module operation. Based on the survey results, the JIS committee
evaluated such operational shock and vibration by conducting hammer impact tests using
several dynamic modules, compared the results through simulation, and then recommended
specific evaluation conditions.
This technical report is based on OITDA (Optoelectronic Industry and Technology
Development Association) – TP (Technical Paper), TP05/SP_DM-2008, "Investigation on

operational vibration and mechanical impact test conditions for optical modules for telecom
use."
3 Questionnaire results in Japan
The JIS committee conducted a questionnaire on operational shock and vibration testing. The
questionnaire allowed the respondents to specify the optical components to be tested. This
questionnaire included optical switches, VOAs (variable optical attenuators) and tunable
filters among the mechanical components used in all possible situations. The survey covered
18 organizations: eight Japanese manufacturers of mechanical optical components, eight
device makers as users of such components, and two research institutes. Reponses were
received from 14 of these organizations (for a response rate of 78 %), among which 12
respondents specified optical switches, seven specified VOAs and three chose tunable filters.
In tabulating the data, the survey asked questions regarding these three types of components
and described occurrences not dependent on the type of component, the manufacturer and
the user, and evaluation conditions.

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TR 62343-6-5 © IEC:2011(E) – 7 –


The results revealed a strong need for the standardization of operational shock and vibration

evaluation methods and conditions for such dynamic modules as optical switches and VOAs.

A majority of respondents also requested that hammer impact testing and the insertion of an

adjacent board be included as cases of operational shock and vibration.


4 Evaluation plan


Based on the survey results described in Clause 3, the appropriate conditions for shock and
vibration testing were determined based on an evaluation. The evaluation method consisted

of the following three steps.


Step 1: Measure the shock and vibration characteristics of a board with a shock sensor
inserted into a standard rack by striking the front face of the board with a hammer or by
inserting an adjacent board.
Step 2: Test an optical module installed in a standard rack by repeating the procedure in Step
1. Measure any changes in the optical characteristics of the optical module.
Step 3: Use standard shock and vibration test equipment to reproduce the shock and vibration
characteristics obtained in Step 1 and the optical characteristics of the optical module
obtained in Step 2.
5 Evaluation results
5.1 Step 1
5.1.1 Evaluation of hammer impact
Board Shock sensor
Hammer
Dynamic module (470 g weight)


IEC  126/11
Figure 1 – Photos of evaluating hammer impact, rack and boards
A board with a shock sensor attached is inserted into the rack. The front of the board is then
struck repeatedly by a hammer, along with an adjacent board being forcibly inserted, in order
to measure the impact and frequency detected by the shock sensor. The handles attached to
the front edge of the rack are also forcibly struck by hand, with the impact being measured as
well. Figure 1 shows photos of evaluating hammer impact, as well as the rack and boards.
Table 1 summarizes the specifications of the rack and boards and the conditions of evaluating
hammer impact and acquiring data.

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Table 1 – Rack and board specifications, conditions of evaluating hammer impact

and acquiring data


Item Specifications / Conditions

Rack size
432 mm (W) × 240 mm (D) × 262 mm (H)

Back connectors 2 pins - 96 pins


Number of boards 20


2 2
Striking force (acceleration H (1 800 m/s to 2 400 m/s ) ~ 210 G
2 2

intensity) M (1 200 m/s to 1 600 m/s ) ~ 140 G

2 2
L (300 m/s to 400 m/s ) ~ 35 G


Places to strike Top, middle of front panel of board
Board thickness 1,6 mm, 1,5 mm, 1,2 mm
Location of board Centre, side
Number of board One, full size
Directions x, y, z
Data acquisition
40 µs × 5 000 points (200 ms)
Sensing frequency band 10 Hz - 10 kHz

Figure 2a) shows the measurement results. Here, H denotes a high level of hammer impa
...