IEC TR 62258-4:2007

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards.

General Information

• Status: Published
• Publication Date: 19-Aug-2007
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: PT 62258 - TC 47/PT 62258
• Current Stage: DELPUB - Deleted Publication
• Start Date: 08-Aug-2012
• Completion Date: 26-Oct-2025

Standards Content (Sample)

IEC/TR 62258-4
Edition 1.0 2007-08
TECHNICAL
REPORT
Semiconductor die products –
Part 4: Questionnaire for die users and suppliers

IEC/TR 62258-4:2007(E)
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IEC/TR 62258-4
Edition 1.0 2007-08
TECHNICAL
REPORT
Semiconductor die products –
Part 4: Questionnaire for die users and suppliers

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 31.080.99 ISBN 2-8318-9281-3

– 2 – TR 62258-4 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references.6
3 Terms and definitions .6
4 General .6
5 Data exchange .7

Annex A Customer questionnaire on die devices.8

Table A.1 – Basic data .9
Table A.2 – Bare die and wafers.10
Table A.3 – Die and wafers with connection structures .11
Table A.4 – Minimally-packaged die devices.12
Table A.5 – Quality, reliability and storage .12
Table A.6 – Terminal data .14
Table A.7 – Terminal geometries.15
Table A.8 – Polygon vertices .15
Table A.9 – Fiducial definitions.16
Table A.10 – Fiducial positions.17
Table A.11 – Simulator data .17
Table A.12 – Group defintions .18
Table A.13 – Permutations .19

TR 62258-4 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
SEMICONDUCTOR DIE PRODUCTS –
Part 4: Questionnaire for die users and suppliers

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
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6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-4, which is a technical report, has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1884/DTR 47/1909/RVC
Full information on the voting for the approval of this technical report can be found in the report
on voting indicated in the above table.

– 4 – TR 62258-4 © IEC:2007(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The list of all the parts of IEC 62258, under the general title Semiconductor die products, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

TR 62258-4 © IEC:2007(E) – 5 –
INTRODUCTION
This technical report is based on the work carried out in the ESPRIT 4th Framework Project
GOODDIE which resulted in the publication of the ES 59008 series of European specifications.
Organizations that helped prepare this document included the ESPRIT ENCAST and ENCASIT
projects, the Die Products Consortium, JEITA, JEDEC and ZVEI.

– 6 – TR 62258-4 © IEC:2007(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 4: Questionnaire for die users and suppliers

1 Scope
This part of IEC 62258 has been developed to facilitate the production, supply and use of
semiconductor die products, including
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC
62258, which may be used in negotiations and contracts between suppliers and purchasers of
die devices. It is intended to assist all those involved in the supply chain for die devices to
comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards.
It should be recognized that the tables contained in this technical report form a checklist of
information that can potentially be supplied and that it may not be relevant or possible to
complete all fields. Different markets may require different subsets of the information
requested herein.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60050, International Electrotechnical Vocabulary
IEC 62258-1:2005, Semiconductor die products – Part 1: Requirements for procurement and
use
IEC 62258-2:2005, Semiconductor die products – Part 2: Exchange data formats
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050 and IEC
62258-2 apply.
4 General
To comply with IEC 62258-1, that standard requires that suppliers of die devices furnish
information which is necessary and sufficient for users of the devices at all stages of design,
procurement, manufacture and test of the products containing them. The questionnaire in
Annex A provides a pro forma that can form a standard basis for supplying such information
and is intended as an aid to compliance with the standard.
Where references are made in this technical report to clauses in IEC 62258-1 and IEC
62258-2, these references are only to the clauses in the 2005 editions. The tables in the

TR 62258-4 © IEC:2007(E) – 7 –
annexes contain requirements for information that is not yet covered by those parts of the
standard but which will be included in future issues. Furthermore, some of the terminology may
not be exactly in accordance with those standards: for example, the term “pad” is replaced by
“terminal” in this technical report.
Whilst it is expected that much of the information supplied will be in the public domain and
available from such sources as manufacturers’ data sheets, neither the standard nor the
questionnaire places an obligation on a supplier to make information public. Any information
that a supplier considers to be proprietary or commercially sensitive may be supplied under the
terms of a non-disclosure agreement.
5 Data exchange
In conjunction with the questionnaire tables in Annex A, a spreadsheet is available which
allows the information to be supplied electronically. Use of the spreadsheet (47-62258-4-TR-E-
worksheet.xls) will also enable computer-sensible descriptions of die devices to be generated
that can then be converted to the DDX format as defined in IEC 62258-2, the XML format
compliant with the schema in IEC 62258-7, the EXPRESS model schema as defined in
IEC 62258-8 or other appropriate formats. Software is available to allow conversion from the
spreadsheet tables into DDX, XML and SPF formats and may be available for other formats
(see the attached Excel spreadsheet).
Compared to the printed form of the questionnaire as given in Annex A, use of the spreadsheet
has the following advantages.
• Notes to the cells in the spreadsheet give the full text of the corresponding clauses in
IEC 62258-1.
• Linked worksheets deal with the requirements for terminal and other information, including
pad shape, size and position, terminal connections, fiducials, simulators, terminal grouping
and permutability. Notes to the cells here give the requirements for the detailed terminal
information as required for data exchange in IEC 62258-2.
• The format of the information is consistent with that required in IEC 62258-2 so that
converting the spreadsheet data into a form suitable for data exchange is a fairly straight-
forward task.
The copyright conditions applying to the use of the spreadsheet are the same as those that
apply to IEC database standards, which permit the use of such information in electronic form
for bona fide e-comme
...