IEC 60749-39:2021

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:
- updated procedure for "dry weight" determination.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39: Mesure de la diffusivité d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs

L’IEC 60749-39:2021 détaille les modes opératoires pour la mesure des propriétés caractéristiques de la diffusivité d’humidité et de l’hydrosolubilité dans les matériaux organiques utilisés dans l’encapsulation des composants à semiconducteurs. Ces deux propriétés des matériaux sont des paramètres importants pour la performance de fiabilité réelle des semiconducteurs sous boîtier en plastique après exposition à l’humidité et qui sont soumis à une refusion à température élevée au moment du brasage. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
- mise à jour du mode opératoire relatif à la détermination du "poids sec".

General Information

• Status: Published
• Publication Date: 28-Nov-2021
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 03-Dec-2021
• Completion Date: 29-Nov-2021

Relations

• Revises: IEC 60749-39:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-39 ®
Edition 2.0 2021-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 39: Measurement of moisture diffusivity and water solubility in organic
materials used for semiconductor components

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
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Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
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IEC 60749-39 ®
Edition 2.0 2021-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 39: Measurement of moisture diffusivity and water solubility in organic
materials used for semiconductor components
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4497-5

– 2 – IEC 60749-39:2021 RLV © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Apparatus . 5
5 Samples . 6
6 Procedure . 6
6.1 Sample preparation . 6
6.2 Absorption measurements below 100 °C . 7
6.3 Solubility and diffusivity calculation . 7
6.4 Desorption measurements above 100 °C . 10
7 Calculation of activation energy for moisture diffusion . 11
8 Calculation of functional fit for solubility . 12
9 Summary . 12
Bibliography . 13

Figure 1 – Example of linearly increasing mass gain . 9
Figure 2 – Alternative intercept method to estimate the reversible Fickian moisture
mass . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes made to
the previous edition IEC 60749-39:2006. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.

– 4 – IEC 60749-39:2021 RLV © IEC 2021
IEC 60749-39 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This second edition, based on JEDEC document JESD22-A120B, cancels and replaces the
first edition published in 2006. lt is used with permission of the copyright holder, JEDEC Solid
State Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) updated procedure for "dry weight" determination.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2652/CDV 47/2725/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor components

1 Scope
This part of IEC 60749 details the procedures for the measurement of the characteristic
properties of moisture diffusivity and water solubility in organic materials used in the
packaging of semiconductor components.
These two material properties are important parameters for the effective reliability
performance of plastic packaged semiconductors after exposure to moisture and being
subjected to high-temperature solder reflow.
NOTE It is recommended that the moisture absorption parameters used in this standard be obtained from the
material suppliers (such as the resin supplier).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering
heat
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Apparatus
4.1 Analytical balance capable of a resolution of either 0,000 01 g or 0,001 % of sample
mass.
4.2 High-temperature oven capable of maintaining uniform temperatures from 100 °C to
250 °C ± 2 °C.
4.3 Temperature/humidity chamber(s) capable of maintaining temperatures in a range from
30 °C to 85 °C and relative humidities (H ) in a range from 60 % H to 85 % H . Within the
R R R
chamber working area, temperature tolerance shall be ±2 °C and the H tolerance shall be
R
±3 % H .
R
– 6 – IEC 60749-39:2021 RLV © IEC 2021
4.4 Perforated stainless steel trays or stainless steel wire mesh baskets used for holding
samples and for placement into ovens.
4.5 Large aluminium plate or disk used for heat sink capability.
4.6 Desiccator for holding dry samples.
5 Samples
Samples of mould compound must shall be flat parallel-sided discs or coupons. The linear
dimensions shall be accurately measured to within ±0,02 mm.
To approximate one-dimensional diffusion behaviour with edge effects limited to less than 5 %
of the total diffusional moisture mass uptake, the free surface area in the thickness dimension
must shall be less than 5 % of the flat-sided free surface area of the sample. For a disc of
radius, r, and thickness, h, the following relation shall be met:
h < 0,05r (1)
for a coupon of length, L, and width, W,
0,05(WL)
h =
(2)
()WL+
Recommended sample thickness should be in the range from 0,3 mm to 1,0 mm. It is
recommended that The maximum sample thickness should not exceed 1,0 mm, because the
time to achieve moisture saturation at temperatures be
...

IEC 60749-39 ®
Edition 2.0 2021-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 39: Measurement of moisture diffusivity and water solubility in organic
materials used for semiconductor components

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et
climatiques –
Partie 39: Mesure de la diffusivité d’humidité et de l’hydrosolubilité dans les
matériaux organiques utilisés dans les composants à semiconducteurs

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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IEC 60749-39 ®
Edition 2.0 2021-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 39: Measurement of moisture diffusivity and water solubility in organic

materials used for semiconductor components

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et

climatiques –
Partie 39: Mesure de la diffusivité d’humidité et de l’hydrosolubilité dans les

matériaux organiques utilisés dans les composants à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1046-7

– 2 – IEC 60749-39:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Apparatus . 5
5 Samples . 6
6 Procedure . 6
6.1 Sample preparation . 6
6.2 Absorption measurements below 100 °C . 6
6.3 Solubility and diffusivity calculation . 9
6.4 Desorption measurements above 100 °C . 10
7 Calculation of activation energy for moisture diffusion . 11
8 Calculation of functional fit for solubility . 11
9 Summary . 11
Bibliography . 12

Figure 1 – Example of linearly increasing mass gain . 8
Figure 2 – Alternative intercept method to estimate the reversible Fickian moisture
mass . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60749-39 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This second edition, based on JEDEC document JESD22-A120B, cancels and replaces the
first edition published in 2006. lt is used with permission of the copyright holder, JEDEC Solid
State Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) updated procedure for "dry weight" determination.

– 4 – IEC 60749-39:2021 © IEC 2021
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2652/CDV 47/2725/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor components

1 Scope
This part of IEC 60749 details the procedures for the measurement of the characteristic
properties of moisture diffusivity and water solubility in organic materials used in the
packaging of semiconductor components.
These two material properties are important parameters for the effective reliability
performance of plastic packaged semiconductors after exposure to moisture and being
subjected to high-temperature solder reflow.
2 Normative references
The following documents are referred to in the text in such a way that some or all of thei
...