IEC 60749-5:2023

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5: Essai continu de durée de vie sous température et humidité avec polarisation

L’IEC 60749-5:2023 décrit un essai continu de durée de vie utilisant la température et l’humidité avec polarisation pour évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides. Cette méthode d’essai est considérée comme destructive. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) la spécification de l’équipement d’essai est modifiée pour exiger la nécessité de réduire le plus possible les gradients d’humidité relative et d’augmenter le plus possible la circulation d’air entre les dispositifs à semiconducteurs en essai;
b) la spécification des fixations de l’équipement d’essai est modifiée pour exiger la prévention de la condensation sur les dispositifs en essai et sur les fixations électriques reliant les dispositifs à l’équipement d’essai;
c) le remplacement des références au terme "jonction virtuelle" par "pastille".

General Information

• Status: Published
• Publication Date: 18-Dec-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 19-Jan-2024
• Completion Date: 19-Dec-2023

Relations

• Revises: IEC 60749-5:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-5 ®
Edition 3.0 2023-12
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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IEC 60749-5 ®
Edition 3.0 2023-12
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-8093-5

– 2 – IEC 60749-5:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 5
5 Equipment . 6
5.1 Equipment summary . 6
5.2 Temperature and relative humidity . 6
5.3 Devices under stress . 6
5.4 Minimizing release of contamination . 6
5.5 Ionic contamination . 6
5.6 Deionized water . 6
6 Test conditions . 6
6.1 Test conditions summary . 6
6.2 Temperature, relative humidity and duration . 6
6.3 Biasing guidelines . 7
6.4 Biasing choice and reporting . 8
7 Procedures . 8
7.1 Mounting . 8
7.2 Ramp-up . 8
7.3 Ramp-down . 8
7.4 Test clock . 9
7.5 Bias . 9
7.6 Read-out . 9
7.7 Handling . 9
8 Failure criteria . 9
9 Safety . 9
10 Summary . 9

Table 1 – Temperature, relative humidity and duration . 7
Table 2 – Criteria for choosing continuous or cyclical bias . 8

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 5: Steady-state temperature humidity bias life test

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 60749-5:2017. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
– 4 – IEC 60749-5:2023 RLV © IEC 2023
IEC 60749-5 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This third edition, based on JEDEC document JESD22-A101D.01, cancels and replaces the
second edition published in 2017. lt is used with permission of the copyright holder, JEDEC
Solid State Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the specification of the test equipment is changed to require the need to minimize relative
humidity gradients and maximize air flow between semiconductor devices under test;
b) the specification of the test equipment fixtures is changed to require the avoidance of
condensation on devices under test and on electrical fixtures connecting the devices to the
test equipment;
c) replacement of references to “virtual junction” with “die”.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2820/FDIS 47/2827/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found in the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 5: Steady-state temperature humidity bias life test

1 Scope
This part of IEC 60749 provides a steady-state temperature and humidity bias life test to
evaluate the reliability of non-hermetic packaged solid-state semiconductor devices in humid
environments.
This test method is considered destructive.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60749-4, Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp
heat, steady-state, highly accelerated stress test (HAST)
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platf
...

IEC 60749-5 ®
Edition 3.0 2023-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –
Partie 5: Essai continu de durée de vie sous température et humidité avec
polarisation
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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and withdrawn publications.
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containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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IEC 60749-5 ®
Edition 3.0 2023-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 5: Steady-state temperature humidity bias life test

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –

Partie 5: Essai continu de durée de vie sous température et humidité avec

polarisation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01  ISBN 978-2-8322-8033-1

– 2 – IEC 60749-5:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 5
5 Equipment . 5
5.1 Equipment summary . 5
5.2 Temperature and relative humidity . 6
5.3 Devices under stress . 6
5.4 Minimizing release of contamination . 6
5.5 Ionic contamination . 6
5.6 Deionized water . 6
6 Test conditions . 6
6.1 Test conditions summary . 6
6.2 Temperature, relative humidity and duration . 6
6.3 Biasing guidelines . 7
6.4 Biasing choice and reporting . 7
7 Procedures . 8
7.1 Mounting . 8
7.2 Ramp-up . 8
7.3 Ramp-down . 8
7.4 Test clock . 8
7.5 Bias . 8
7.6 Read-out . 8
7.7 Handling . 8
8 Failure criteria . 9
9 Safety . 9
10 Summary . 9

Table 1 – Temperature, relative humidity and duration . 6
Table 2 – Criteria for choosing continuous or cyclical bias . 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 5: Steady-state temperature humidity bias life test

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 60749-5 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This third edition, based on JEDEC document JESD22-A101D.01, cancels and replaces the
second edition published in 2017. lt is used with permission of the copyright holder, JEDEC
Solid State Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the specification of the test equipment is changed to require the need to minimize relative
humidity gradients and maximize air flow between semiconductor devices under test;

– 4 – IEC 60749-5:2023 © IEC 2023
b) the specification of the test equipment fixtures is changed to require the avoidance of
condensation on devices under test and on electrical fixtures connecting the devices to the
...