IEC 60068-2-69:2007

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows:
- Inclusion of lead-free alloy test conditions;
- Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years;
- Inclusion of new component types, and updating test parameters for the whole component list.

Essais d'environnement - Partie 2-69: Essais - Essai Te: Essai de brasabilité des composants électroniques pour les composants de montage en surface (CMS) par la méthode de la balance de mouillage

La CEI 60068-2-69:2007 spécifie l'essai Te, la méthode de la balance de mouillage en bain d'alliage et méthode de la balance de mouillage à la goutte d'alliage, applicables aux composants de montage en surface. Ces méthodes permettent de déterminer quantitativement la brasabilité des sorties sur les composants de montage en surface. La CEI 60068-2-54, qu'il convient de consulter le cas échéant, est également disponible pour les composants de montage en surface. Les modes opératoires décrivent la méthode de la balance de mouillage en bain d'alliage ainsi que la méthode de la balance de mouillage à la goutte d'alliage, ces deux méthodes étant par ailleurs applicables aux composants munis de sorties métalliques et plots de soudage métallisés. La présente norme fournit les modes opératoires normalisés pour les alliages de brasage tendre contenant du plomb (Pb) et pour les alliages de brasage sans plomb. Cette deuxième édition annule et remplace la première édition parue en 1995, dont elle constitue une révision technique. Les principales modifications apportées par rapport à l'édition précédente sont les suivantes:
- Intégration des conditions d'essai des alliages sans plomb;
- Intégration de nouveaux flux à des fins d'essai, avec description de l'évolution des flux développés dans l'industrie au cours des 20 dernières années;
- Intégration de nouveaux types de composants, et actualisation des paramètres d'essai pour la liste complète des composants.

General Information

• Status: Published
• Publication Date: 08-May-2007
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 07-Mar-2017

Relations

• Revised: IEC 60068-2-69:2017 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 60068-2-69
Second edition
2007-05
Environmental testing –
Part 2-69:
Tests – Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
Reference number
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
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CH-1211 Geneva 20
Switzerland
Email: [e-mail]
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
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INTERNATIONAL IEC
STANDARD 60068-2-69
Second edition
2007-05
Environmental testing –
Part 2-69:
Tests – Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
PRICE CODE
Commission Electrotechnique Internationale T
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60068-2-69 © IEC:2007(E)

CONTENTS
FOREWORD.3

1 Scope.5

2 Normative references .5

3 Terms and definitions .6

4 General description of the method .6

5 Description of the test apparatus .6

6 Preconditioning .7
6.1 Preparation of specimens .7
6.2 Ageing.7
7 Materials .7
7.1 Solder .7
7.2 Flux.8
8 Procedures.8
8.1 Test temperature.8
8.2 Solder bath wetting balance procedure.8
8.3 Solder globule wetting balance procedure .11
9 Presentation of results.14
9.1 Form of force versus time trace .14
9.2 Test requirements .15
10 Information to be given in the relevant specification .15

Annex A (normative) Equipment specification .16
Annex B (informative) Use of the wetting balance for SMD solderability testing .18

Bibliography.25

Figure 1 – Test apparatus.6
Figure 2 – Typical wetting balance trace .14

Table 1 – Recommended solder bath wetting balance test conditions .10

Table 2 – Time sequence of the test (solder bath) .11
Table 3 – Recommended solder globule wetting balance test conditions.12
Table 4 – Time sequence of the test (Solder globule) .13

60068-2-69 © IEC:2007(E) – 3 –

INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic

components for surface mounting devices (SMD)

by the wetting balance method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-69 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1995 and constitutes a
technical revision. The main changes from the previous edition are as follows:
– Inclusion of lead-free alloy test conditions;
– Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in
the industry in the past 20 years;
– Inclusion of new component types, and updating test parameters for the whole component
list.
– 4 – 60068-2-69 © IEC:2007(E)

The text of this standard is based on the following documents:

FDIS Report on voting
91/648/FDIS 91/680/RVD
Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

A list of all the parts in the IEC 60068 series, under the general title Environmental testing,

can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

60068-2-69 © IEC:2007(E) – 5 –

ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic

components for surface mounting devices (SMD)

by the wetting balance method
1 Scope
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder
globule wetting balance method, applicable for surface mounting devices. These methods
determine quantitatively the solderability of terminations on surface mounting devices.
IEC 60068-2-54 is also available for surface mounting devices and should be consulted if
applicable.
The procedures describe the solder bath wetting balance method and the solder globule
wetting balance method and are both applicable to components with metallic terminations and
metallized solder pads.
This standard provides the standard procedures for solder alloys containing lead (Pb) and for
lead-free solder alloys.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:1979, Basic environmental testing procedures – Part 2: Tests – Test T:
Soldering
Amendment 2 (1987 )
IEC 60068-2-54:2006, Environmental testing – Part 2-54: Tests – Test Ta: Solderability
testing of electronic components by the wetting balance method

IEC 61190-1-3:2002, Attachment materials for electronic assemblies – Part 1-3: Requirements
for electronic grade solder alloys and fluxed/non-fluxed solid solder for electronic soldering
applications
ISO 683 (all parts), Heat-treatable steels, alloy steels and free-cutting steels
ISO 6362 (all parts), Wrought aluminium and aluminium alloy extruded rods/bars, tubes and
profiles
– 6 – 60068-2-69 © IEC:2007(E)

3 Terms and definitions
For the purpose of this document, the terms and definitions as defined in IEC 60068-1 and

IEC 60068-2-20 apply.
4 General description of the method

After applying the liquid flux to the component termination and mounting the component in a

suitable holder, the specimen is suspended from a sensitive balance. The component
termination is brought into contact with the cleaned surface of a solder bath or the apex of a
solder globule, and immersed to the prescribed depth.
The resultant forces of buoyancy and surface tension acting upon the immersed termination
are detected by a transducer and converted to a signal which is continuously monitored as a
function of time, and recorded on a high speed chart recorder or displayed on a computer
screen.
The wetting speed and the extent of wetting are derived from the force against time curve.
5 Description of the test apparatus
A diagram showing a suitable arrangement for the test apparatus is shown in Figure 1. The
specimen is suspended from a sensitive balance and a mechanism used to either raise the
solder to meet the specimen or lower the specimen into the solder.
After conditioning, the transducer signal is passed to either a chart recorder or a computer,
where the force against time curve may be displayed and analysed.

Balance or
Signal
Computer or chart recorder
transducer
conditioner
Specimen
Globule bloc
...

IEC 60068-2-69
Edition 2.0 2007-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-69: Tests – Test Te: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method

Essais d’environnement –
Partie 2-69: Essais – Essai Te: Essai de brasabilité des composants
électroniques pour les composants de montage en surface (CMS) par la
méthode de la balance de mouillage

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

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publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

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Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
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IEC 60068-2-69
Edition 2.0 2007-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-69: Tests – Test Te: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method

Essais d’environnement –
Partie 2-69: Essais – Essai Te: Essai de brasabilité des composants
électroniques pour les composants de montage en surface (CMS) par la méthode
de la balance de mouillage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
T
CODE PRIX
ICS 19.040; 31.190 ISBN 2 2-8318-9717-3

– 2 – 60068-2-69 © IEC:2007
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 General description of the method .6
5 Description of the test apparatus .6
6 Preconditioning .6
6.1 Preparation of specimens .6
6.2 Ageing.7
7 Materials .7
7.1 Solder .7
7.2 Flux.8
8 Procedures.8
8.1 Test temperature.8
8.2 Solder bath wetting balance procedure.8
8.3 Solder globule wetting balance procedure .11
9 Presentation of results.14
9.1 Form of force versus time trace .14
9.2 Test requirements .15
10 Information to be given in the relevant specification .15
Annex A (normative) Equipment specification .16
Annex B (informative) Use of the wetting balance for SMD solderability testing .18
Bibliography.25

Figure 1 – Test apparatus.6
Figure 2 – Typical wetting balance trace .14

Table 1 – Recommended solder bath wetting balance test conditions .10
Table 2 – Time sequence of the test (solder bath) .11
Table 3 – Recommended solder globule wetting balance test conditions.12
Table 4 – Time sequence of the test (Solder globule) .13

60068-2-69 © IEC:2007 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-69 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1995 and constitutes a
technical revision. The main changes from the previous edition are as follows:
– Inclusion of lead-free alloy test conditions;
– Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in
the industry in the past 20 years;
– Inclusion of new component types, and updating test parameters for the whole component
list.
– 4 – 60068-2-69 © IEC:2007
This bilingual version, published in 2008-04, corresponds to the English version.
The text of this standard is based on the following documents:
FDIS Report on voting
91/648/FDIS 91/680/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60068 series, under the general title Environmental testing,
can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60068-2-69 © IEC:2007 – 5 –
ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
1 Scope
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder
globule wetting balance method, applicable for surface mounting devices. These methods
determine quantitatively the solderability of terminations on surface mounting devices.
IEC 60068-2-54 is also available for surface mounting devic
...