IEC 62769-6:2015
(Main)Field Device Integration (FDI) - Part 6: FDI Technology Mapping
Field Device Integration (FDI) - Part 6: FDI Technology Mapping
IEC 62769-6:2015 specifies the technology mapping for the concepts described in the Field Device Integration (FDI) standard. The technology mapping focuses on implementation regarding the components FDI Client and User Interface Plug-in (UIP) that are specific only to the workstation platform as defined in IEC 62769-4:2015, Annex E.
Intégration des dispositifs de terrain (FDI) - Partie 6: Mapping de technologies FDI
L'IEC 62769-6:2015 spécifie le mapping de technologies pour les concepts décrits dans la norme d'intégration des appareils de terrain (FDI). Le mapping de technologies se concentre sur la mise en oeuvre relative aux composants: Client FDI et Plugiciel d'Interface Utilisateur (UIP) qui ne sont spécifiques qu'à la plate-forme de station de travail telle que définie dans l'IEC 62769-4:2015, Annexe E.
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IEC 62769-6 ®
Edition 1.0 2015-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field Device Integration (FDI) –
Part 6: FDI Technology Mapping
Intégration des appareils de terrain (FDI) –
Partie 6: Mapping de technologies FDI
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IEC 62769-6 ®
Edition 1.0 2015-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field Device Integration (FDI) –
Part 6: FDI Technology Mapping
Intégration des appareils de terrain (FDI) –
Partie 6: Mapping de technologies FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100 ISBN 978-2-8322-2635-3
– 2 – IEC 62769-6:2015 IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms, acronyms and conventions . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms and acronyms . 8
3.3 Symbols . 8
4 Technical concepts . 8
4.1 General . 8
4.1.1 Overview . 8
4.1.2 Platforms . 9
4.1.3 FDI Type Library . 9
4.2 UIP representation . 10
4.3 UIP executable representation . 10
4.4 UIP executable compatibility rules . 11
4.5 Allowed .NET Common Language Run-time versions . 11
4.5.1 General . 11
4.5.2 CLR compatibility strategy . 11
4.5.3 How to identify the .NET target platform of a UIP . 12
4.6 Installing UIP . 12
4.7 UIP Lifecycle. 13
4.7.1 General . 13
4.7.2 UIP Assembly activation steps . 13
4.7.3 UIP Assembly deactivation steps . 15
4.8 Interaction between an FDI Client and a UIP . 16
4.8.1 Handling of standard UI elements . 16
4.8.2 Non-blocking service execution . 16
4.8.3 Blocking service execution. 17
4.8.4 Cancel service execution . 18
4.8.5 Threading . 19
4.8.6 Timeout . 19
4.8.7 Exception handling . 20
4.8.8 Type safe interfaces . 21
4.8.9 Globalization and localization . 21
4.8.10 WPF Control handling . 21
4.8.11 Win Form handling . 21
4.9 Security . 21
4.9.1 General . 21
4.9.2 Access permissions . 22
4.9.3 Code identity concept . 23
5 Interface definition . 23
Bibliography . 27
Figure 1 – FDI Type Library structure . 10
Figure 2 – .NET surrogate process . 12
Figure 3 – Identification of Run-time Version. 12
Figure 4 – IAsyncPattern based asynchronous service execution example . 17
Figure 5 – Blocking service execution example using IAsyncResult based pattern . 18
Figure 6 – Cancel service processing sequence example . 18
Figure 7 – Exception source . 20
Table 1 – Technology edition reference . 9
Table 2 – Base Property Services . 24
Table 3 – Device Model Services . 24
Table 4 – Access Control Services . 24
Table 5 – Direct Access Services . 24
Table 6 – Hosting Services . 25
Table 7 – UIP Services . 25
Table 8 – Base Data Types . 26
Table 9 – Special Types . 26
– 4 – IEC 62769-6:2015 IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 6: FDI Technology Mapping
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this prepar
...
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