IEC PAS 62293:2001

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.

General Information

• Status: Withdrawn
• Publication Date: 27-Nov-2001
• Withdrawal Date: 28-Oct-2004
• ICS: 33.200 - Telecontrol. Telemetering
• Technical Committee: TC 91 - Electronics assembly technology
• Current Stage: WPUB - Publication withdrawn
• Start Date: 31-Oct-2004
• Completion Date: 29-Oct-2004

Standards Content (Sample)

IEC/PAS 62293
Edition 1.0
2001-11
Qualification and performance specification
for high density interconnect (HDI)
layers or boards
PUBLICLY AVAILABLE SPECIFICATION
INTERNATIONAL Reference number
ELECTROTECHNICAL
IEC/PAS 62293
COMMISSION
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
IPC-6016
Qualification and Performance
Specification for High Density
Interconnect (HDI) Layers
or Boards
IPC-6016
May 1999 A standard developed by IPC
2215 Sanders Road, Northbrook, IL 60062-6135
Tel. [phone]  Fax [phone]
www.ipc.org
Copyright © 1999, IPC; 2001, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
QUALIFICATION AND PERFORMANCE SPECIFICATION

FOR HIGH DENSITY INTERCONNECT (HDI)

LAYERS OR BOARDS
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62293 was submitted by the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) and
has been processed by IEC technical committee 91: Electronics assembly technology.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
91/248/PAS 91/269/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and IPC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical
committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work.
International, governmental and non-governmental organizations liaising with the IEC also participate in this
preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance
with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of

standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any divergence
between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1999, IPC; 2001, IEC

HIERARCHY OF IPC QUALIFICATION AND

PERFORMANCE SPECIFICATIONS
(6010 SERIES)
IPC-6010
IPC-6011
GENERIC
IPC-6012 IPC-6013 IPC-6014 IPC-6015 IPC-6016 IPC-6018
RIGID FLEX PCMCIA MCM-L HDI HIGH FREQUENCY
FOREWORD
This specification is intended to provide information on the detailed performance criteria of High Density Interconnect lay-
ers only. The information contained herein supplements the generic requirements, identified in IPC-6011, as well as require-
ments relating to the core construction, identified in the sectionals: IPC-6012 (rigid), IPC-6013 (flex), IPC-6015 (MCM-L)
or IPC-6018 (microwave). This document would be specified for and apply only to the added HDI features. The HDI layer
should not modify most (if any) of the criteria set forth in the specification for the core construction. When used together,
these documents should lead both manufacturer and customer to consistent terms of acceptability. If the HDI board does not
employ a core construction, the customer should decide and specify which sectional performance specification should be
used for evaluating criteria that is not covered in this document.
Within this document there are a number of performance criteria that are application dependent. These criteria are listed
‘‘slash sheets’’ in the back of the document that detail performance requirements based upon application. A blank slash sheet
is also included to define needed requirements (agreed to by manufacturer and customer) for applications not currently cov-
ered.
NOTE: IPC-6016 was developed with consideration to HDI layers that use modified ‘‘conventional’’ plated-through hole
processes and chemistries. The industry does not yet have enough experience to develop performance standards for HDI
layers formed by novel processes that are drastically different from ‘‘conventional’’ plated-through hole constructions (i.e.,
non-plated copper processes). As experiences are gathered, criteria for these processes will be added. In the meantime, the
customer and manufacturer should work together to set the criteria for acceptance of product using the new technologies.
IPC’s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging issues.
In this regard, document sets are used to provide the total information related to a particular electronic packaging topic. A
document set is identified by a four digit number that ends in zero (0) (i.e., IPC-6010). The generic specification, the first
document of the set, is supplemented by one or multiple sectional documents, each of which provide specific focus on one
aspect of a topic or technology. IPC invites input on the effectiveness of the documentation and encourages user response
through the ‘‘Standard Improvement Form’’ located at the back of each document.
ii
Copyright © 1999, IPC; 2001, IEC

May 1999 IPC-6016
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members

of the HDI Performance Subcommittee (D-43) are shown below, it is not possible to include all of those who assisted in the

evolution of this standard. To each of them, the members of the IPC extend their gratitude.

HDI Committee HDI Performance Technical Liaisons of the

Subcommittee IPC Board of Directors

Chairman Chairman
Bob Neves Dave Vaughan Stan Plzak Peter J. Murphy

Microtek Laboratories Pensar Corp. Parlex Corp.
HDI Performance Subcommittee
Bernd K Appelt, IBM Corp. Kazuo Hirasaka, Eastern Co. Ltd. Douglas O. Powell, IBM Corp.
Kevin Arledge, Motorola, Inc. John Holley, Motorola, Inc. John M. Radman, Trace Laboratories
- East
Dave Backen, Johnson Mason Hu, Hadco Santa Clara, Inc.
Matthey-Advanced Circuits Kovil Ramachandran, Filtran
Stephen N. Keller, Trace Laboratories
Microcircuits
Jason Bogart, NORTEL - East
Jad Rasul, Motorola, Inc.
Mark Bosnjak, Tulon, Inc. Philip D. Knudsen, Shipley Co.
L.L.C. Randy R. Reed, Merix Corp.
Thomas N. Bresnan, Hadco Corp.
Ulrich Lacher, Ciba (AG) Mia S. Riley, Trace Laboratories -
Alan Cable, Electro Scientific
East
Industries Kuan-Shaur Lei, Compaq Computer
Corp. Lance P. Riley, Unicircuit, Inc.
Marcelo Chan, Harris Corp.
Dale J. Lubitz, Johnson Matthey Dr. Courtland N. Robinson, Sheldahl
Kevin Y. Chen, 3M Co.
Advanced Circuits, Inc. Inc.
Jay B. Conrod, Enthone-OMI, Inc.
Billy Lung, Lucent Technologies Nick Santhanam, Taconic
Willie E. Curtis, NORTEL
Inc/Bell Labs
Everett Simons, Motorola, Inc.
Wendy A. Daum, Dell Computer
Clifford R. Maddox, The Boeing Co.
Grant W. Smedley, III, Raytheon
Corp.
Rene R. Martinez, TRW Systems Co.
Nitin B. Desai, Motorola, Inc.
Brian C. McCrory, Delsen Testing Frank St. John, Methode Electronics,
Joseph A. DiPalermo, Parlex Corp.
Labs Inc.
C. Don Dupriest, Lockheed Martin
Brian McDermott, MicroVia, Inc. Tim Stevens, NORTEL
Vought Systems
Tom Miller, IBM Corp. Mario Suarez-Solis, Motorola, Inc.
Theodore Edwards, Honeywell, Inc.
Suzanne F. Nachbor, Honeywell, Inc. David D. Sullivan, Rockwell Collins
Air Transport Sys.
Kathleen A. Nargi-Toth, Thomas C. Sutter, Shipley Co. L.L.C.
Werner Engelmaier, Engelmaier
Enthone-OMI, Inc.
Associates, L.C. Charles Edwin Thorn,
Bob Neves, Microtek Laboratories Electrochemicals, Inc.
Martin G. Freedman, AMP, Inc.
Steven M. Nolan, Silicon Graphics Paul Thrasher, Network Equipment
Lionel Fullwood, WKK
Computer System Technologies
Rolf Funer
Takafumi Obata, JPCA-Japan Printed Ken Trude, Hadco Santa Clara, Inc.
Dennis Fritz, MacDermid, Inc.
Circuit Assn.
William E. Wallace, Ph.D., U.S.
Stanley Glukh, BFGoodrich Specialty
Christopher G. Olson, Rockwell Department of Commerce
Chemicals
Collins
William W. Ward, Raytheon Systems
Ceferino G. Gonzalez, E. I. du Pont
Michael W. Paddack, The Boeing Co. Co.
de Nemours and Co.
Bruce Panke, NORTEL Richard Wessel, E. I. du Pont de
Don Gustafson, Olec Corp.
Nemours and Co.
Sandra Petty-Weeks, Motorola, Inc.
David L. Hawken, IBM Corp.
Wally Younger, Nelco Arizona
Frank Polakovic, Electrochemicals
Phillip E. Hinton, Hinton ‘PWB’
Inc.
Engineering
iii
Copyright © 1999, IPC; 2001, IEC

IPC-6016 May 1999
Table of Contents
1 SCOPE. 1 3.6.1 Thermal Stress Method. 5

3.6.2 Microsection Technique. 5
1.1 Purpose. 1

3.6.3 Microvia Integrity (after Thermal Stress) . 5
1.2 Performance Classification . 1

3.6.4 Filled Vias . 6
1.3 Slash Sheet Categories . 1

3.6.5 Lifted Lands . 6
1.4 Documentation Hierarchy. 1

3.7 Other Tests . 6

2 APPLICABLE DOCUMENTS. 1
3.7.1 Bond Strength, Unsupported Hole or

2.1 IPC . 1
Surface Mount Land . 6
2.2 Joint Industry Standards . 2
3.8 Solder Resist (Solder Mask) Requirements . 6
3.8.1 Solder Resist Coverage. 6
3 REQUIREMENTS . 2
3.9 Electrical Properties. 6
3.1 General . 2
3.9.1 Circuitry . 6
3.1.1 Terms and Definitions. 2
3.9.2 Dielectric Withstanding Voltage. 6
3.2 Materials. 2
3.9.3 Insulation Resistance . 6
3.2.1 Rigid Laminates. 2
3.10 Environmental. 6
3.2.2 Flexible Films . 2
3.10.1 Moisture and Insulation Resistance . 6
3.2.3 Bonding Materials. 2
3.10.2 Thermal Shock. 7
3.2.4 Other Dielectric and Conductive Materials . 2
3.10.3 Cleanliness . 7
3.2.5 Metal Foils . 2
3.11 Special Requirements . 7
3.2.6 Metallic Plating and Coatings . 2
3.11.1 Outgassing. 7
3.2.7 Solder Resist . 3
3.11.2 Organic Contamination. 7
3.2.8 Marking Inks. 3
3.11.3 Fungus Resistance. 7
3.2.9 Hole Fill Material . 3
3.11.4 Vibration. 7
3.3 Visual Examination. 3
3.3.1 Edges. 3 3.11.5 Mechanical Shock. 7
3.11.6 Impedance Testing . 7
3.3.2 Surface Dielectric Imperfections. 3
3.12 Repair . 7
3.3.3 Lifted Lands. 3
3.3.4 Marking. 3
4 QUALITY ASSURANCE . 7
3.3.5 Solderability . 3
4.1 General . 7
3.3.6 Adhesion . 3
4.1.1 Inspection for Delivery. 7
3.3.7 Workmanship . 3
4.1.2 Referee Tests. 7
3.4 Dimensional Requirements. 3
Appendix A . 8
3.4.1 Hole Pattern Accuracy. 3

3.4.2 Registration (Internal) .
...