IEC 60115-2:2023

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

IEC 60115-2:2023(E) is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this document is to state preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:  
the definitions of product technologies and product classification levels of the generic specification, IEC 60115‑1:2020, have been adopted;
the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA_0922 has been removed;
a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
the 'period-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been adopted as default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4;
the revised solderability test of IEC 60115‑1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20;
the combined solvent resistance test of IEC 60115‑1:2020, 11.3 has been adopted in 5.3.22;
the 'endurance at room temperature test' of IEC 60115‑1:2020, 7.2 (prior IEC 60115 2:2014, Annex C) has been adopted as an optional test in 5.4.1;
the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.2;
climatic tests for 'operation at low temperature' of IEC 60115‑1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional tests in 5.4.4 and 5.4.5, respectively;
new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2;
the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
the revised test clause numbering of IEC 60115‑1:2020 has been applied;
a new Annex C has been added to summarize workmanship requirements for the assembly of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
the informative Annex F (prior Annex B) on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly.

General Information

• Status: Published
• Publication Date: 14-Feb-2023
• ICS: 31.040.10 - Fixed resistors
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60115-2 - TC 40/MT 60115-2
• Current Stage: PPUB - Publication issued
• Start Date: 20-Mar-2023
• Completion Date: 15-Feb-2023

Relations

• Revises: IEC 60115-2:2014 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60115-2
®

Edition 4.0 2023-02
INTERNATIONAL
STANDARD



Fixed resistors for use in electronic equipment –
Part 2: Sectional specification: Low-power film resistors with leads for through-
hole assembly on circuit boards (THT)
IEC 60115-2:2023-02(en)

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IEC 60115-2

®


Edition 4.0 2023-02




INTERNATIONAL



STANDARD



















Fixed resistors for use in electronic equipment –

Part 2: Sectional specification: Low-power film resistors with leads for through-

hole assembly on circuit boards (THT)

























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.040.10 ISBN 978-2-8322-6467-6




  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC 60115-2:2023 © IEC 2023
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
3.1 Terms . 10
3.2 Product technologies . 11
3.3 Product classification . 11
4 Preferred characteristics . 11
4.1 General . 11
4.2 Style and dimensions . 11
4.2.1 Preferred styles and outline dimensions. 11
4.2.2 Length of excessive coating or welding bead . 13
4.2.3 Lead wire spacing . 13
4.2.4 Lead eccentricity . 14
4.3 Preferred climatic categories . 15
4.4 Resistance . 16
4.5 Tolerances on resistance . 16
4.6 Rated dissipation P . 16
70
4.7 Limiting element voltage U . 16
max
4.8 Insulation voltage U . 17
ins
4.9 Insulation resistance R . 17
ins
5 Tests and test severities . 17
5.1 General provisions for tests applied by this specification . 17
5.2 Preparation of specimens . 18
5.2.1 Drying . 18
5.2.2 Mounting of components on test boards . 18
5.2.3 Mounting of components on a test rack . 21
5.3 Details of applied tests . 23
5.3.1 Resistance . 23
5.3.2 Temperature coefficient of resistance . 23
5.3.3 Temperature rise . 23
5.3.4 Endurance at the rated temperature 70 °C . 23
5.3.5 Endurance at a maximum temperature: UCT . 24
5.3.6 Short-term overload . 24
5.3.7 Single-pulse high-voltage overload test . 25
5.3.8 Periodic-pulse high-voltage overload test . 26
5.3.9 Electrostatic discharge (ESD) test . 27
5.3.10 Visual examination . 27
5.3.11 Gauging of dimensions . 28
5.3.12 Detail dimensions . 28
5.3.13 Robustness of terminations . 28
5.3.14 Vibration . 29
5.3.15 Rapid change of temperature . 29
5.3.16 Rapid change of temperature, ≥ 100 cycles . 29
5.3.17 Climatic sequence . 29
5.3.18 Damp heat, steady state . 30

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IEC 60115-2:2023 © IEC 2023 – 3 –
5.3.19 Solderability, with lead-free solder . 30
5.3.20 Solderability, with SnPb solder . 31
5.3.21 Resistance to soldering heat . 32
5.3.22 Solvent resistance . 32
5.3.23 Insulation resistance . 32
5.3.24 Voltage proof . 32
5.3.25 Flammability . 33
5.4 Optional and/or additional tests . 33
5.4.1 Endurance at room temperature . 33
5.4.2 Single-pulse high-voltage overload test . 34
5.4.3 Periodic-pulse overload test . 34
5.4.4 Operation at low temperature. 35
5.4.5 Damp heat, steady state, accelerated . 35
6 Performance requirements. 36
6.1 General . 36
6.2 Limits for change of resistance at tests . 36
6.3 Temperature coefficient of resistance . 39
6.4 Temperature rise . 39
6.5 Visual examination . 40
6.5.1 General visual criteria . 40
6.5.2 Visual criteria after tests . 40
6.5.3 Visual criteria for the packaging . 40
6.6 Solderability . 40
6.7 Insulation resistance . 41
6.8 Flammability . 41
7 Marking, packaging and ordering information . 41
7.1 Marking of the component . 41
7.2 Packaging . 41
7.3 Marking of the packaging . 41
7.4 Ordering information . 42
8 Detail specifications . 42
8.1 General . 42
8.2 Information to be specified in a detail specification . 42
8.2.1 Outline drawing or illustration . 42
8.2.2 Style and dimensions . 42
8.2.3 Climatic category . 43
8.2.4 Resistance range . 43
8.2.5 Tolerances on resistance . 43
8.2.6 Rated dissipation P . 43
70
8.2.7 Limiting element voltage U . 43
max
8.2.8 Insulation voltage U . 43
ins
8.2.9 Insulation resistance R . 43
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 44
8.2.14 Ordering information . 44
8.2.15 Mounting . 44

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– 4 – IEC 60115-2:2023 © IEC 2023
8.2.16 Storage. 44
8.2.17 Transportation . 44
8.2.18 Additional information . 44
8.2.19 Quality assessment procedures . 44
8.2.20 0 Ω resistors . 44
9 Quality assessment procedures . 45
9.1 General . 45
9.2 Definitions. 45
9.2.1 Primary stage of manufacture . 45
9.2.2 Structurally similar components . 45
9.2.3 Assessment level EZ . 45
9.3 Formation of inspection lots . 45
9.4 Approved component (IECQ AC) procedures . 46
9.5 Qualification approval (QA) procedures . 46
9.5.1 General . 46
9.5.2 Qualification approval . 47
9.5.3 Quality conformance inspection . 47
9.6 Capability certification (IECQ AC-C) procedures . 47
9.7 Technology certification (IECQ-AC-TC) procedures . 47
9.8 Periodical evaluation of termination plating . 47
9.9 Delayed delivery . 47
9.10 Certified test records. 48
9.11 Certificate of conformity (CoC) . 48
Annex A (normative) Symbols and abbreviated terms . 58
A.1 Symbols . 58
A.2 Abbreviated terms . 61
Annex B (normative) Visual examination acceptance criteria . 63
B.1 General . 63
B.2 Criteria for general visual inspection of specimens . 63
B.3 Criteria for visual inspection of specimens after tests . 63
Annex C (normative) Workmanship requirements for the assembly of leaded film
resistors . 64
C.1 General . 64
C.2 Lead forming . 64
C.2.1 General . 64
C.2.2 Means for support of mounting height . 65
C.3 Mounting . 66
C.3.1 General . 66
C.3.2 Lateral mounting . 67
C.3.3 Upright mounting . 68
C.4 Lead trimming . 69
Annex D (normative) Zero Ohm resistors (jumpers). 71
D.1 General . 71
D.2 Preferred characteristics . 71
D.3 Tests and test severities . 71
D.4 Performance requirements . 72
D.5 Marking, packaging and ordering information . 72
D.6 Detail specification . 73

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IEC 60115-2:2023 © IEC 2023 – 5 –
D.7 Quality assessment procedures . 73
Annex E (informative) Guide on the application of optional and additional tests . 74
E.1 General . 74
E.2 Endurance at room temperature . 74
E.3 Single-pulse high-voltage overload test . 75
E.4 Periodic- pulse overload test . 76
E.5 Operation at low temperature . 76
E.6 Damp heat, steady state, accelerated . 77
Annex F (informative) Radial formed types. 79
F.1 General . 79
F.1.1 Applicability of this annex . 79
F.1.2 Denomination of radial formed types . 79
F.1.3 Coated lead wires . 81
F.1.4 Means for support of mounting height . 81
F.1.5 Means for retention . 82
F.2 Radial formed types for through-hole assembly . 82
F.2.1 Radial formed type with lateral body position . 82
F.2.2 Radial formed type with upright body position . 84
F.3 Radial formed types for surface-mount assembly . 87
F.4 Packaging . 88
F.4.1 Packaging of resistors formed for through-hole assembly . 88
F.4.2 Packaging of resistors formed for surface-mount assembly . 89
F.5 Quality assessment . 89
F.5.1 General . 89
F.5.2 Quality assessment of formed resistors . 89
F.5.3 Forming of finished resistors of assessed quality . 90
F.5.4 Special inspection requirements . 90
Annex X (informative) Cross-references for the prior revision of this specification . 91
Bibliography . 94

Figure 1 – Illustration of a typical axial leaded resistor . 10
Figure 2 – Illustrations of typical radial leaded resistors . 10
Figure 3 – Shape and dimension of axial leaded resistors . 12
Figure 4 – Alternative methods for specification of the length of excessive protective
coating on axial leaded resistors . 13
Figure 5 – Lead-wire spacing of axial leaded resistors with bent leads . 14
Figure 6 – Specification of the lead eccentricity of axial leaded resistors . 15
Figure 7 – Derating curve . 16
Figure 8 – Basic layout for mechanical, environmental and electrical tests . 19
Figure 9 – Assembly of specimens to the test board . 20
Figure 10 – Mounting of axial leaded specimens on a rack, top view . 22
Figure 11 – Examples of specimen lead fixation devices . 23
Figure C.1 – Lead forming dimensions . 64
Figure C.2 – Examples of mounting height support . 66
Figure C.3 – Clearance between coating and solder . 67
Figure C.4 – Lateral mounting . 67

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– 6 – IEC 60115-2:2023 © IEC 2023
Figure C.5 – Upright mounting . 68
Figure C.6 – Lead protrusion . 69
Figure C.7 – Lead end distortion . 70
Figure F.1 – Production flow and different scopes of quality assurance . 80
Figure F.2 – Shape and dimensions of radial formed resistor for lateral body position . 82
Figure F.3 – Shape and dimensions of radial formed resistor for lateral body position
with kinked lead wires . 83
Figure F.4 – Shape and dimensions of radial formed resistor for upright body position. 84
Figure F.5 – Shape and dimensions of radial formed resistor for upright body position

and wide spacing . 85
Figure F.6 – Shape and dimensions of radial formed resistor for upright body position
and wide spacing, with kinked lead wire . 85
Figure F.7 – Shape and dimensions of radial formed resistor for surface-mount
assembly (Z-bend) . 87
Figure F.8 – Land pattern dimensions for surface-mount assembly . 88

Table 1 – Preferred styles of axial leaded resistors . 12
Table 2 – Test board dimensions . 20
Table 3 – Preferred aggravated overload conditions . 27
Table 4 – Limits for the change of resistance at tests . 38
Table 5 – Permitted change of resistance due to the variation of temperature . 39
Table 6 – Test schedule for the qualification approval . 48
Table 7 – Test schedule for the quality conformance inspections . 53
Table C.1 – Lead bend radius . 65
Table C.2 – Recommended circuit board bore diameters . 66
Table C.3 – Clearance of lateral mounted resistors . 68
Table E.1 – Implementation of the test endurance at room temperature . 74
Table E.2 – Implementation of the single-pulse high-voltage overload test . 75
Table E.3 – Implementation of the periodic-pulse overload test . 76
Table E.4 – Implementation of the operation at low temperature test . 77
Table E.5 – Implementation of the test damp heat, steady state, accelerated . 78
Table F.1 – Feasible lead-wire spacing of radial formed resistor for lateral body
position . 84
Table F.2 – Feasible lead-wire spacing of radial formed resistor for upright body
position . 87
Table X.1 – Cross reference for references to clauses . 91
Table X.2 – Cross reference for references to figures . 93
...